Curable silicone composition and cured product thereof
    326.
    发明公开
    Curable silicone composition and cured product thereof 失效
    HärtbareSilikonzusammensetzung undgehärtetesProdukt daraus。

    公开(公告)号:EP0496419A2

    公开(公告)日:1992-07-29

    申请号:EP92101175.5

    申请日:1992-01-24

    Abstract: A curable silicone composition which can cure using hydrosilylation, comprising an aluminum oxide powder and/or silica powder, the powders each consisting of substantially spherical particles with an average particle diameter of 50 µm or below and an elongation of from 1.0 to 1.4 and being such that the respective amounts of alkali metal ions and halogen ions are extracted with 50 ml of water from 5 g of the powder at 121°C for 20 hours are not more than 10 ppm, wherein the amount of the component (D) is from 25 to 90% by weight based on the composition, and the ratio of the amount of hydrosilyl groups contained in the components (A) and (B) to the amount of alkenyl groups contained in the components (A) and (B) is in the range from 0.5/1 to 1.5/1. When the composition is used as a protective material or encapsulating material for devices such as ICs, generated heat can be dissipated efficiently and the devices are not be broken by abrasion. There are no fears of causing corrosion of the devices.

    Abstract translation: 一种可固化的硅氧烷组合物,其可以使用含有氧化铝粉末和/或二氧化硅粉末的氢化硅烷化固化,所述粉末各自由平均粒径为50μm以下且伸长率为1.0至1.4的基本上为球形的颗粒组成,并且为 使得各种量的碱金属离子和卤素离子在50ml的水中用50ml水从121℃提取20小时不大于10ppm,其中组分(D)的量来自 25〜90重量%,组分(A)和(B)中所含的氢化甲硅烷基的量与组分(A)和(B)中所含的链烯基的量的比例为 范围从0.5 / 1到1.5 / 1。 当组合物用作诸如IC之类的装置的保护材料或封装材料时,可以有效地消散所产生的热量,并且不会被磨损破坏装置。 没有担心会导致器件腐蚀。

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