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    POLYAMIDE MOULDING COMPOSITION AND USE THEREOF
    332.
    发明申请
    POLYAMIDE MOULDING COMPOSITION AND USE THEREOF 有权
    聚酰亚胺模塑组合物及其用途

    公开(公告)号：US20150291795A1

    公开(公告)日：2015-10-15

    申请号：US14681669

    申请日：2015-04-08

    Applicant: EMS-PATENT AG

    Inventor： Etienne AEPLI

    IPC: C08L77/06

    CPC classification number: C08L77/06 ,  C08K7/14 ,  C08L77/02 ,  C08L77/08 ,  C08L2201/08 ,  C08L2205/02 ,  C08L2205/03

    Abstract: The invention relates to a polyamide moulding composition which comprises an amorphous polyamide, a partially crystalline, aliphatic polyamide and also glass fibres for reinforcement. Furthermore, the polyamide moulding composition according to the invention comprises a polyamide made of a cycloaliphatic diamine and a dimerised fatty acid. The polyamide moulding compositions according to the invention are used in the production of electrical or electronic components, housings or housing components.

    Abstract translation: 本发明涉及一种聚酰胺模塑组合物，其包含无定形聚酰胺，部分结晶的脂族聚酰胺和用于增强的玻璃纤维。 此外，根据本发明的聚酰胺模塑组合物包含由脂环族二胺和二聚脂肪酸制成的聚酰胺。 根据本发明的聚酰胺模塑组合物用于生产电气或电子部件，壳体或壳体部件。

    PROCESS FOR PRODUCING HIGH MOLECULAR WEIGHT POLYETHYLENE
    337.
    发明申请
    PROCESS FOR PRODUCING HIGH MOLECULAR WEIGHT POLYETHYLENE 有权
    生产高分子量聚乙烯的方法

    公开(公告)号：US20150203641A1

    公开(公告)日：2015-07-23

    申请号：US14670742

    申请日：2015-03-27

    Applicant: DSM IP ASSETS B.V.

    Inventor： Harold Jan SMELT ,  Pieter GIJSMAN ,  Martin VAN DUIN

    IPC: C08J3/28

    CPC classification number: C08J3/24 ,  A61L27/16 ,  A61L27/505 ,  C08F8/00 ,  C08J3/28 ,  C08J2323/06 ,  C08J2323/36 ,  C08K5/3435 ,  C08K5/3492 ,  C08K5/34926 ,  C08L23/06 ,  C08L2201/08 ,  C08L2203/02 ,  C08L2207/068 ,  C08L2666/02 ,  C08F110/02

    Abstract: The invention relates to a process for producing an (ultra) high molecular weight polyethylene (HMWPE) article comprising: incorporating into the HMWPE resin a Hindered Amine Light Stabilizer (HALS) and cross-link the (U)HMWPE during or after molding the (U)HMWPE resin. In particular the invention relates to a process comprising the following steps: a) incorporating into (U)HMWPE resin a Hindered Amine Light Stabilizer (HALS) according to one of the following general formulas or combinations hereof:  wherein R1 up to and including R5 are herein independent substituents; for example containing hydrogen, ether, ester, amine, amide, alkyl, alkenyl, alkynyl, aralkyl, cycloalkyl and/or aryl groups, which substituents may in turn contain functional groups, for example alcohols, ketones, anhydrides, imines, siloxanes, ethers, carboxyl groups, aldehydes, esters, amides, imides, amines, nitriles, ethers, urethanes and any combination thereof; b) molding the (U)HMWPE resin comprising the HALS, resulting in an article; c) cross-linking and sterilizing the article via gamma radiation or electron beam radiation; d) optionally, if step b results in a stock shape, machining the stock shape into an article; wherein step c and step d can be performed in either order.

    Abstract translation: 本发明涉及一种用于生产（超）高分子量聚乙烯（HMWPE）制品的方法，其包括：在成型期间或之后，将（UALS）掺杂到HMWPE树脂中并与（U）HMWPE交联， U）HMWPE树脂。 具体而言，本发明涉及一种包括以下步骤的方法：a）根据以下通式或其组合之一将（U）HMWPE树脂掺入到受阻胺光稳定剂（HALS）中：其中R 1直至并包括R 5为 本文独立取代基; 例如含有氢，醚，酯，胺，酰胺，烷基，烯基，炔基，芳烷基，环烷基和/或芳基，该取代基又可包含官能团，例如醇，酮，酸酐，亚胺，硅氧烷，醚 羧基，醛，酯，酰胺，酰亚胺，胺，腈，醚，氨基甲酸酯及其任何组合; b）模制包含HALS的（U）HMWPE树脂，得到制品; c）通过伽马辐射或电子束辐射对制品进行交联和灭菌; d）任选地，如果步骤b导致坯料形状，将坯料加工成制品; 其中步骤c和步骤d可以以任何顺序执行。

    MOULDING COMPOUND BASED ON A PARTIALLY AROMATIC COPOLYAMIDE
    340.
    发明申请
    MOULDING COMPOUND BASED ON A PARTIALLY AROMATIC COPOLYAMIDE 审中-公开
    基于部分芳族聚酰胺的成型化合物

    公开(公告)号：US20150086737A1

    公开(公告)日：2015-03-26

    申请号：US14489612

    申请日：2014-09-18

    Applicant: Jasmin NITSCHE ,  Harald HAEGER ,  Sebastian GEERKENS ,  Franz-Erich BAUMANN ,  Reinhard BEUTH

    Inventor： Jasmin NITSCHE ,  Harald HAEGER ,  Sebastian GEERKENS ,  Franz-Erich BAUMANN ,  Reinhard BEUTH

    IPC: C08L77/06 ,  C08K5/18 ,  C08K5/00 ,  C08K3/16

    CPC classification number: C08L77/06 ,  C08K3/16 ,  C08K5/005 ,  C08K5/18 ,  C08L2201/08 ,  C08L2203/18 ,  Y10T428/1352 ,  Y10T428/139 ,  Y10T428/1393 ,  Y10T428/1397

    Abstract: A moulding composition, comprising at least 40 wt. % of the following components: a) 60 to 99 parts by wt. of a partially aromatic copolyamide which comprises as polymerized monomer units: I. 30 to 90 mol % of a combination of hexamethylenediamine and terephthalic acid; and II. 70 to 10 mol % of a combination of hexamethylenediamine and a linear aliphatic dicarboxylic acid with 8 to 19 C atoms; and b) 40 to 1 parts by wt. of an olefinic copolymer comprising as polymerized monomer units: i) 35 to 94.9 wt. % of ethene-based monomer units, ii) 5 to 65 wt. % of monomer units based on a 1-alkene with 4 to 8 C atoms, iii) 0 to 10 wt. % of monomer units based on an olefin different from i) and ii), and iv) 0.1 to 2.5 wt. % of monomer units based on an aliphatically unsaturated dicarboxylic acid anhydride, wherein the sum of the wt. % values of i), ii), iii) and iv) is 100%, and the sum of the parts by wt. of a) and b) is 100 which can be processed into moulded articles with improved thermal aging resistance is provided.

    Abstract translation: 一种模塑组合物，其包含至少40重量％ ％以下组分：a）60至99重量份。 的部分芳族共聚酰胺，其包含作为聚合单体单元：I.30至90摩尔％的六亚甲基二胺和对苯二甲酸的组合; 和II。 70〜10摩尔％的六亚甲基二胺和8〜19个碳原子的直链脂肪族二羧酸的组合; 和b）40〜1重量份。 的包含作为聚合单体单元的烯烃共聚物：i）35-94.9wt。 ％的基于乙烯的单体单元，ii）5至65wt。 基于具有4至8个C原子的1-烯烃的单体单元的％，iii）0至10重量％ ％的基于不同于i）和ii）的烯烃的单体单元，和iv）0.1-2.5wt。 ％的基于脂族不饱和二羧酸酐的单体单元，其中wt。 i），ii），iii）和iv）的％值为100％，并且重量份的总和。 的a）和b）为100，其可以加工成具有改善的耐热老化性的模塑制品。

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