Abstract:
An optical semiconductor lighting apparatus includes: an upper body open at a lower side thereof to define an interior space therein and formed on an outer surface thereof with an upper protrusion; a lower body open at an upper side thereof to define an interior space therein and formed on an outer surface thereof with a lower protrusion placed collinear with the upper protrusion; one or more heat sinks each including a fastening assembly into which the upper protrusion and the lower protrusion are inserted; and a light emitting module including one or more optical semiconductor devices placed on one side surface of each of the heat sinks, wherein the heat sinks surround outer surfaces of the upper body and the lower body.
Abstract:
An optical semiconductor lighting apparatus includes: a heat sink; a light emitting module contacting the heat sink and comprising a substrate on which one or more optical semiconductor devices are mounted; and an optical member coupled to the heat sink and covering the light emitting module, wherein the optical member includes a substrate positioning slot having a shape corresponding to a periphery of the substrate; and a step having a shape corresponding to a cutaway slot at the periphery of the substrate.
Abstract:
An optical semiconductor illuminating apparatus includes a housing configured to receive power from one side thereof and comprising a first area, a heat dissipation base extending from the housing and comprising a second area smaller than the first area, and a light emitting module comprising at least one optical semiconductor device disposed on a portion of the housing and the heat dissipation base, and comprising a third area smaller than the first area and larger than the second area, in which the housing forms an overlap region comprising a fourth area overlapping the light emitting module, and the light emitting module is electrically connected to a power source through the overlap region.
Abstract:
Embodiments of the invention provide an optical semiconductor illuminating apparatus, which includes a heat dissipating base; a light emitting module comprising at least one semiconductor light emitting device and mounted on a lower side of the heat dissipating base; and a plurality of heat dissipating fins each having opposite edges protruding from opposite sides of the heat dissipating base and being mounted on an upper surface of the heat dissipating base.
Abstract:
An LED luminaire according to an exemplary embodiment of the present invention includes a rectifier outputting a first rectified voltage generated by rectifying AC voltage and flattening the rectified voltage, a power factor correction unit receiving the first rectified voltage output from the rectifier and generating and outputting a drive voltage, an LED light emitting unit including first to m-th light emitting groups each including at least one LED, the LED light emitting unit sequentially driven by receiving the drive voltage input from the power factor correction unit, and an LED drive IC determining a voltage level of the drive voltage upon receiving the drive voltage input from the power factor correction unit, and controlling sequential driving of the first to m-th light emitting groups according to the determined voltage level of the drive voltage.
Abstract:
An optical semiconductor lighting apparatus includes: a housing; a heat discharge block which is made of a metal and is embedded in the housing; an AC direct-connection module which is made of a metal and is embedded in the housing, the AC direct-connection module including a semiconductor optical device which is driven in an AC direct-connection scheme; and an insulation connector which is provided in the AC direct-connection module and is exposed to an outside of the housing for electrical connection with an external power source.
Abstract:
A first heat sinking path formed in a forming direction of a heat sink unit disposed radially in a housing where a light emitting module is mounted. A second heat sinking path is formed along an edge of the light emitting module. By providing a light engine concept in which a light emitting module, an optical member, and a heat sink unit are included and a bottom surface is gradually widened from one side to the other side, an optical semiconductor lighting apparatus can reduce a total weight of a product, can further improve heat dissipation efficiency by inducing natural convection, is simple in the product assembly and installation, and is easy in maintenance, and can provide products with high reliability by increasing the arrangement efficiency of semiconductor optical devices per unit area.
Abstract:
An optical semiconductor illuminating apparatus capable of being simply installed and built, easily detecting a fault generation point, being simply repaired and replaced, and being compactly implemented. A bracket assembly having a power supply embedded therein is mounted at an upper side of a heat sink including a fixed unit, the power supply is seated on the heat sink including the fixed unit, a plurality of heat radiation fins protrude from an inner surface of the heat sink, and an upper surface of the power supply is disposed at a position higher than or equal to that of an edge of an upper end portion of the heat sink.
Abstract:
A light-emitting diode (LED) lighting apparatus is provided. The LED lighting apparatus includes at least one LED, and a wavelength conversion member spaced apart from the LED and configured to convert a wavelength of light emitted from the LED. The wavelength conversion member includes a light-transmitting member, and a transfer molded wavelength conversion layer disposed on at least one surface of the light-transmitting member. The transfer molded wavelength conversion layer includes a resin and a phosphor.
Abstract:
A first heat sinking path formed in a forming direction of a heat sink unit disposed radially in a housing where a light emitting module is mounted. A second heat sinking path is formed along an edge of the light emitting module. By providing a light engine concept in which a light emitting module, an optical member, and a heat sink unit are included and a bottom surface is gradually widened from one side to the other side, an optical semiconductor lighting apparatus can reduce a total weight of a product, can further improve heat dissipation efficiency by inducing natural convection, is simple in the product assembly and installation, and is easy in maintenance, and can provide products with high reliability by increasing the arrangement efficiency of semiconductor optical devices per unit area.