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公开(公告)号：ES2645857T3
公开(公告)日：2017-12-11
申请号：ES15163407
申请日：2015-04-13
Applicant: SHENGYI TECHNOLOGY CO LTD
Inventor： YOU JIANG , HUANG TIANHUI , YANG ZHONGQIANG
Abstract: Una composición de resina termoendurecible exenta de halógenos, en base a 100 partes en peso de sólidos orgánicos, que comprende (A) de 30 a 60 partes en peso de una resina epoxi exenta de halógenos, (B) de 20 a 50 partes en peso de un compuesto que contiene el anillo de la dihidrobenzoxazina, y (C) de 10 a 40 partes en peso de un agente de curado de bisfenol que contiene fósforo; el agente de curado de bisfenol que contiene fósforo tiene la siguiente estructura:**Fórmula** en donde n es cualquier número entero de 2 a 20.
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公开(公告)号：AU2014411040A1
公开(公告)日：2017-06-08
申请号：AU2014411040
申请日：2014-12-02
Applicant: SHENGYI TECHNOLOGY CO LTD
Inventor： LI HUI , FANG KEHONG
Abstract: A halogen-free resin composition and a prepreg and a laminate prepared therefrom. The halogen-free resin composition comprises the following ingredients in parts by weight: 50-100 parts of an epoxy resin, 20-70 parts of benzoxazine, 5-40 parts of polyphenyl ether, 5-30 parts of styrene-maleic anhydride, 5-40 parts of a halogen-free flame retardant, 0.2-5 parts of a curing accelerator and 20-100 parts of a filler. The prepreg and the laminate, which are manufactured from the halogen-free resin composition, have the comprehensive properties of low dielectric constant, low dielectric loss, excellent heat resistance, adhesive property and wet resistance and the like, and are suitable for being applied to halogen-free high-frequency multilayer circuit boards.
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33.发明专利
公开(公告)号：AU2011376206B2
公开(公告)日：2015-07-09
申请号：AU2011376206
申请日：2011-09-02
Applicant: SHENGYI TECHNOLOGY CO LTD
Inventor： HE YUESHAN
IPC: C08K5/5399 , B32B15/08 , H05K1/03
Abstract: A halogen-free resin composition and a method for preparation of copper clad laminate with the same, wherein based on total parts by weight of solid components, the halogen-free resin composition comprises a reactive allyl phenoxy cyclotriphosphazene or vinyl phenoxy cyclotriphosphazene of 5-50 parts, a thermosetting resin of 15-85 parts, a crosslinking curing agent of 1-35 parts, a crosslinking curing accelerant of 0-5 parts and a filler of 0-100 parts. In the present invention, the reactive allyl phenoxy cyclotriphosphazene or vinyl phenoxy cyclotriphosphazene having very low water absorption is introduced into the thermosetting resin, satisfying both the halogen-free and antiflaming requirements and improving the electrical properties of the system, and making it possible to prepare the halogen-free high-frequency high-speed substrate material. The resulted copper clad laminate satisfies the halogen-free requirement, and has advantages such as excellent resistance to heat and moisture, and low dielectric loss.
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公开(公告)号：AU2013201788A1
公开(公告)日：2014-05-08
申请号：AU2013201788
申请日：2013-03-21
Applicant: SHENGYI TECHNOLOGY CO LTD
Inventor： TANG JUNQI
Abstract: Cyanate Ester Resin Composition, and a Prepreg, a Laminated Material and a Metal Clad Laminated Material Made Therefrom 5 The present invention relates to a cyanate ester resin composition and a prepreg, a laminated material and a metal clad laminated material made therefrom. The cyanate ester resin composition comprises cyanate ester resin, non-halogen epoxy resin, and inorganic filler material, and the structural formula of the cyanate ester resin is as the following: 10 formula I CC Hi H> H wherein, n represents an integer between 1 and 50. The cyanate ester resin composition of the present invention has good heat resistance and flame retardance. The laminated material and the metal clad 15 laminated material made from the prepreg that is made from the cyanate ester resin composition, still have good flame retardance and low coefficients of thermal expansion in X, Y directions, without using halogen-containing compounds or phosphorus-containing compounds as the flame retardant, so they are fit for making a substrate material for high density PCB.
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公开(公告)号：AU2013202046A1
公开(公告)日：2014-03-27
申请号：AU2013202046
申请日：2013-03-27
Applicant: SHENGYI TECHNOLOGY CO LTD
Inventor： ZENG XIANPING , REN NANA , ZHOU BIAO
Abstract: The present invention relates to an epoxy resin composition, and a prepreg and a copper clad laminate made therefrom. The epoxy resin composition comprises: (A) epoxy resin containing two or over two epoxy groups, (B) active 5 ester curing agent, and (C) phosphate salt compound. The epoxy resin composition of the present invention adopts epoxy resin with specific molecular structure, which has comparatively high functionality, so the cured products have high glass transition temperature and low hydroscopic property; active ester is adopted as the curing agent to make full use of the advantages that 10 polar groups will not be produced when the active ester reacts with the epoxy resin; the prepreg and copper clad laminate made therefrom of the present invention can achieve halogen-free flame retardance, and meanwhile have excellent dielectric properties and good resistance to humidity and heat.
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Patent Agency Ranking36.发明专利
公开(公告)号：AU2013202044A1
公开(公告)日：2014-02-27
申请号：AU2013202044
申请日：2013-03-27
Applicant: SHENGYI TECHNOLOGY CO LTD
Inventor： ZENG XIANPING
Abstract: The present invention relates to a polyphenylene ether resin composition, and a prepreg and a copper clad laminate made therefrom. The polyphenylene ether resin composition comprises: (A) functionalized polyphenylene ether resin, 5 (B) crosslinking agent, and (C) initiator; the component (A) functionalized polyphenylene ether resin is polyphenylene ether resin that has a number average molecular weight of 500-5000 and unsaturated double bonds at the molecule terminal; the component (B) crosslinking agent is olefin resin with a number average molecular weight of 500-10000, of which styrene structure 10 comprises 10-50wt%, and of which the molecule comprises 1,2-addition butadiene structure. The polyphenylene ether resin composition of the present invention is a composition of functionalized polyphenylene ether resin with a low molecular weight. The prepreg and copper clad laminate made from the polyphenylene ether resin composition have good dielectric properties and heat 15 resistance.
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37.发明专利
公开(公告)号：AU2011376206A1
公开(公告)日：2014-02-20
申请号：AU2011376206
申请日：2011-09-02
Applicant: SHENGYI TECHNOLOGY CO LTD
Inventor： HE YUESHAN
IPC: C08K5/5399 , B32B15/08 , H05K1/03
Abstract: A halogen-free resin composition and a method for preparation of copper clad laminate with the same, wherein based on total parts by weight of solid components, the halogen-free resin composition comprises a reactive allyl phenoxy cyclotriphosphazene or vinyl phenoxy cyclotriphosphazene of 5-50 parts, a thermosetting resin of 15-85 parts, a crosslinking curing agent of 1-35 parts, a crosslinking curing accelerant of 0-5 parts and a filler of 0-100 parts. In the present invention, the reactive allyl phenoxy cyclotriphosphazene or vinyl phenoxy cyclotriphosphazene having very low water absorption is introduced into the thermosetting resin, satisfying both the halogen-free and antiflaming requirements and improving the electrical properties of the system, and making it possible to prepare the halogen-free high-frequency high-speed substrate material. The resulted copper clad laminate satisfies the halogen-free requirement, and has advantages such as excellent resistance to heat and moisture, and low dielectric loss.
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公开(公告)号：JP6921891B2
公开(公告)日：2021-08-18
申请号：JP2019078769
申请日：2019-04-17
Applicant: 廣東生益科技股▲ふん▼有限公司 , SHENGYI TECHNOLOGY CO.,LTD.
IPC: H01L23/14 , C09J163/00 , C09J11/04 , C09J7/28 , B29C65/50 , G06K19/02 , G06K19/077 , B32B15/08 , H01L21/60
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公开(公告)号：JP6861843B2
公开(公告)日：2021-04-21
申请号：JP2019554844
申请日：2017-10-19
Applicant: 廣東生益科技股▲ふん▼有限公司 , SHENGYI TECHNOLOGY CO.,LTD.
Inventor： 曾 ▲憲▼平 , ▲関▼ ▲遅▼▲記▼ , ▲陳▼ ▲広▼兵 , 徐 浩晟
IPC: C08F212/12 , C08J5/24 , H05K1/03 , C08F299/00
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公开(公告)号：JP6845889B2
公开(公告)日：2021-03-24
申请号：JP2019079088
申请日：2019-04-18
Applicant: 廣東生益科技股▲ふん▼有限公司 , SHENGYI TECHNOLOGY CO.,LTD.
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