公开(公告)号：WO1998005000A1

公开(公告)日：1998-02-05

申请号：PCT/DE1997001541

申请日：1997-07-22

Applicant: SIEMENS AKTIENGESELLSCHAFT ,  HUBER, Michael ,  STAMPKA, Peter ,  HEITZER, Josef ,  HOUDEAU, Detlef

Inventor： SIEMENS AKTIENGESELLSCHAFT

IPC: G06K19/077

CPC classification number: G06K19/07743 ,  B44C5/00

Abstract: The contact surfaces of metal contacts (7) of a smart card are at least partially provided with an electrically conductive layer (11) which is arranged on the contact zone (5) so that there is no short-circuit in relation to the contacts. The contact surfaces are therefore used not only as functional surfaces for contacting but also as information carriers corresponding to the external outline of the conductive layer (11).

Abstract translation: 的芯片卡的金属触点（7）的接触表面至少部分地设置有导电层（11）。 的层（11）相对于所述触点（7）短路自由地布置在接触区（5）。 的接触表面，从而不仅作为功能面，用于接触而且还作为根据导电层（11）的外轮廓的信息载体。

公开(公告)号：WO1997042655A1

公开(公告)日：1997-11-13

申请号：PCT/DE1997000827

申请日：1997-04-25

Applicant: SIEMENS AKTIENGESELLSCHAFT ,  MUNDIGL, Josef ,  STAMPKA, Peter ,  HUBER, Michael

Inventor： SIEMENS AKTIENGESELLSCHAFT

IPC: H01L23/16

CPC classification number: G06K19/07728 ,  G06K19/07745 ,  H01L23/3121 ,  H01L24/48 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/18301 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2224/85399

Abstract: In order to avoid damages to the integrated circuit (6) or the formation of cracks between the carrier (2) and the integrated circuit (6) when the carrier (2) is subjected to bending loads, a stiffening member (12) which does not touch the carrier (2) is introduced into the covering (10) of the integrated circuit (6). The stiffening member (12), for example a ring-shaped element, is laid into the covering tool of an appropriate plastic injection mould in such a way that plastic material can penetrate between the carrier (2) and the stiffening member (12).

Abstract translation: 为了使载体元件的弯曲载荷（2）（2），以避免所述集成电路（6）或所述载体元件和集成电路（6），一个支撑构件之间的裂纹的形成的任何风险（2）不与所述加强装置（12）接触（在盖 集成电路的引入10）（6）。 所述加强装置（12），例如 的环状部件是，用于此目的的合适的塑料注射模具的屏蔽工具这样插入，使得塑料的承载元件（2）和加强装置（12）之间可以穿透。

公开(公告)号：WO1997012394A1

公开(公告)日：1997-04-03

申请号：PCT/DE1996001783

申请日：1996-09-19

Applicant: SIEMENS AKTIENGESELLSCHAFT ,  HEITZER, Josef ,  KIRSCHBAUER, Josef ,  STAMPKA, Peter

Inventor： SIEMENS AKTIENGESELLSCHAFT

IPC: H01L21/607

CPC classification number: H01L24/85 ,  B23K20/007 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/78 ,  H01L2224/0401 ,  H01L2224/05624 ,  H01L2224/1134 ,  H01L2224/13099 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/48095 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/48455 ,  H01L2224/48471 ,  H01L2224/48479 ,  H01L2224/48624 ,  H01L2224/49425 ,  H01L2224/78301 ,  H01L2224/85051 ,  H01L2224/85186 ,  H01L2224/85205 ,  H01L2224/85986 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01068 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01327 ,  H01L2924/00014 ,  H01L2924/20752 ,  H01L2924/00 ,  H01L2924/00015

Abstract: The invention concerns a method of electrically connecting a semiconductor chip (1) to at least one contact surface by means of a thin wire whose first end is welded to the at least one contact surface and whose second end is connected to a contact area of the semiconductor chip (1). In order to establish a good connection between the wire and the contact area of the semiconductor chip (1), the second end of the wire is welded to a wedge-shaped metal part (5) which is disposed on the contact area of the semiconductor chip (1) and is conductively connected thereto. The metal part (5) is formed by a nailhead contact (6) whose free end is guided in a loop and connected to the nailhead by a wedge contact.

Abstract translation: 一种用于通过具有第一端部焊接至所述至少一个接触面和与所述半导体芯片（1）连接的接触垫的第二端部的细线是指具有至少一个接触区域电连接的Hableiterchips（1）方法。 为了生产线和半导体芯片（1）的接触焊盘之间的良好连接，线的第二端被布置成与一个在半导体芯片（1）和电连接到这一点，焊接楔形金属件（6），所述金属片的接触垫（ 5）由一个钉头接触（6），其自由端通过楔来引导在回路和连接到所述钉头接触地形成。

公开(公告)号：WO1997012341A1

公开(公告)日：1997-04-03

申请号：PCT/DE1996001725

申请日：1996-09-12

Applicant: SIEMENS AKTIENGESELLSCHAFT ,  HOUDEAU, Detlef ,  KIRSCHBAUER, Josef ,  MENSCH, Hans-Georg ,  STAMPKA, Peter ,  STECKHAN, Hans-Hinnerk

Inventor： SIEMENS AKTIENGESELLSCHAFT

IPC: G06K19/077

CPC classification number: G06K19/07728 ,  G06K19/07743 ,  G06K19/07745 ,  H01L23/24 ,  H01L23/49855 ,  H01L24/29 ,  H01L24/83 ,  H01L2224/2919 ,  H01L2224/8319 ,  H01L2224/8385 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01023 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/14 ,  H01L2924/00 ,  H01L2924/3512

Abstract: The object of the invention is to prevent delamination between the covering compound and the chip in the hot-melt assembly process. According to the invention, this object is achieved in that the heat flow introduced from the exterior into the chip module is controlled in a deliberate manner, either by a heat-insulating layer (9) interposed between the flexible carrier strip (2) of the chip module and the chip (3) bonded thereon, or by recesses (11) in the surface or layer of the metal contacts (10) such that heat is prevented from flowing from a hollow stamp (1) placed in the outer region of the metal contacts (10) in the direction of the centrally-mounted chip (3).

Abstract translation: 为了防止覆盖化合物和热熔安装方法的芯片之间的分层被提出了控制注入到从目标外部热流芯片模块。 这是根据或者通过热绝缘层（9）介于所述柔性载体带之间的本发明（2）实现的芯片模块和的粘附在其上的芯片（3）被插入，或通过金属触点的区域或层（10）内的凹部（11）， 使得从热流中的金属触点的外侧区域中的一个接合（10）中空柱塞防止了在居中地安装芯片（3）的方向（1）。

公开(公告)号：WO1996034410A1

公开(公告)日：1996-10-31

申请号：PCT/DE1996000718

申请日：1996-04-24

Applicant: SIEMENS AKTIENGESELLSCHAFT ,  ATZESDORFER, Alexandra ,  HOUDEAU, Detlef ,  STAMPKA, Peter

Inventor： SIEMENS AKTIENGESELLSCHAFT

IPC: H01L23/28

CPC classification number: H01L23/573 ,  H01L23/28 ,  H01L23/58 ,  H01L24/48 ,  H01L27/02 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01068 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2924/00012

Abstract: The description relates to a chip cover (6, 11) to cover completely or partially electrical, electronic, opto-electronic and/or electromechanical components of a chip (1, 8). The chip cover (6, 11) is characterized in that a pigmenting agent is added to the cover material. It is thus possible reliably to prevent unauthorised analyses and/or manipulations of the chip (1, 8).

Abstract translation: 它是用于电气，电子，光电和/或机电部件的芯片的完全或部分覆盖的芯片罩（6,11）（1,8）进行说明。 该芯片罩（6,11）的特征在于，所述盖具有着色剂加入。 以这种方式，有可能外国分析和/或芯片的操作（1，8），以防止可靠。