Abstract:
An SW component with electrical structures (3) sealed against environmental influences by a cap-like cover (2), in which there are metallised points (4) in windows (7) in the cover (2) of bonding pads of the electrically conductive structures (3) therein and solderable metallised points (6) on the cover (2), which are connected to the PAD metallised points (4) via through connections (5).
Abstract:
An SW component with electrically conductive structures (3) on a substrate (1), sealed against environmental influences by a cap-like cover (2), on which there is a metallised coating (6) for r.f. screening.