DUAL INTERFACE LAMINATED CARD AND CORRESPONDING METHOD FOR MANUFACTURING A DUAL INTERFACE LAMINATED CARD

    公开(公告)号:US20250111186A1

    公开(公告)日:2025-04-03

    申请号:US18830236

    申请日:2024-09-10

    Abstract: A dual interface laminated card having a stack of layers includes at least a first core plastic layer, a second core plastic layer disposed over the first core plastic layer, an antenna inlay disposed between the second core plastic layer and first core plastic layer, and a micromodule disposed over the second core plastic layer. The core plastic layers are recycled plastic layers comprising a major percentage, in particular at least 80%, of low surface energy plastic. The laminated card further comprises at least a first layer of polyurethane heat activatable glue, coupled to a side facing the antenna inlay of at least one of the first and second core plastic layers such that the antenna inlay and the at least one core plastic layer are bonded together.

    MULTIPLICATION METHOD AND ELECTRONIC CIRCUIT

    公开(公告)号:US20250110696A1

    公开(公告)日:2025-04-03

    申请号:US18903498

    申请日:2024-10-01

    Inventor: Fabrice ROMAIN

    Abstract: A digital multiplicand is received. An initial digital multiplier including logical 0s and 1s is also received. The initial multiplier is processed including at the beginning of each string with at least one logical 1 of the initial multiplier, by applying, or not, in a selective manner, a Booth encoding on said string so as to output a final multiplier. The multiplicand is then multiplied by the final multiplier to produce an output.

    CONTACTLESS COMMUNICATION DEVICE BY ACTIVE LOAD MODULATION

    公开(公告)号:US20250105999A1

    公开(公告)日:2025-03-27

    申请号:US18886470

    申请日:2024-09-16

    Abstract: A device of contactless communication by active load modulation includes a receive circuit configured to receive as an input a reception signal originating from a magnetic field intended to be received by an antenna. A transmit circuit has an output coupled to the antenna with a modulation signal in phase with the reception signal intended to be delivered thereon. A circuit compensates for a delay of the modulation signal due to the transmit circuit and to the amplitude of the reception signal. The compensation circuit determines a phase-shift value to be applied to an input signal of the transmit circuit to compensate for the delay.

    CIRCUIT FOR SUPPLYING A CLOCK SIGNAL

    公开(公告)号:US20250103087A1

    公开(公告)日:2025-03-27

    申请号:US18884579

    申请日:2024-09-13

    Abstract: The present disclosure provides a circuit for supplying a clock signal. An example circuit for supplying a clock signal comprises a selector of one signal out of a plurality of clock signals; a switch between the selector and a node for outputting the selected clock signal, the circuit being configured so that the application of a control signal for selecting one of the clock signals causes, in the order, the turning off of the switch, the selection of the signal via the selector, and the turning on of the switch.

    CORRECTION CIRCUIT FOR BANDGAP CIRCUIT

    公开(公告)号:US20250103081A1

    公开(公告)日:2025-03-27

    申请号:US18888049

    申请日:2024-09-17

    Abstract: The present description concerns a correction circuit for a bandgap circuit comprising a first bipolar transistor and a second bipolar transistor, the bandgap circuit being configured to deliver a temperature-stable DC voltage based on the first and second bipolar transistors, the correction circuit being configured to generate a correction current equal to a difference in the base currents of said first and second transistors, and inject the correction current on the emitter of one of said first and second bipolar transistors to correct an error on the temperature-stable voltage resulting from a current gain difference between said first and second bipolar transistors.

    MEMS METAMATERIAL AND MEMS DEVICE INCORPORATING THE MEMS METAMATERIAL

    公开(公告)号:US20250102371A1

    公开(公告)日:2025-03-27

    申请号:US18895219

    申请日:2024-09-24

    Abstract: A MEMS metamaterial has a substrate and a suspended structure having an elementary cell which extends at a distance from the substrate along a first direction. The elementary cell has a first structural region having a first material with a first coefficient of thermal expansion. The first structural region has a first side facing the substrate and a second side opposite to the first side. The elementary cell also has a second structural region having a second material different from the first material and with a second coefficient of thermal expansion different from the first coefficient of thermal expansion. The second structural region extends on at least part of the first structural region, on the first side, the second side, or both the first and second side of the first structural region.

    Palm rejection method for active pens and touch screen devices

    公开(公告)号:US12254156B2

    公开(公告)日:2025-03-18

    申请号:US18365789

    申请日:2023-08-04

    Abstract: A method of operating a touch screen panel includes initiating a communication between the panel and an active pen and determining a touch zone of the panel. The touch zone includes communication channels that are operating by touch while bi-directional communication is occurring between the panel and active pen. Communications channels within the touch zone are disabled and communication between the panel and the active pen can occur while the communications channels within the touch zone are disabled. When it is determined that the communication between the panel and the active pen has stopped, communications channels continue to be disabled within the touch zone for a set time delay while no communication occurs between the panel and the active pen. After the set delay time, the communication channels within the touch zone are enabled.

    PROCESS FOR MANUFACTURING MICROELECTROMECHANICAL DEVICES WITH REDUCED STICTION PHENOMENON

    公开(公告)号:US20250083951A1

    公开(公告)日:2025-03-13

    申请号:US18807103

    申请日:2024-08-16

    Abstract: A process for manufacturing a microelectromechanical device includes: on a body containing semiconductor material, forming a sacrificial layer of dielectric material having a first surface, opposite to the body; conferring a sacrificial surface roughness to the first surface of the sacrificial layer; on the first surface of the sacrificial layer, forming a structural layer of semiconductor material having a second surface in contact with the first surface of the sacrificial layer. Conferring sacrificial surface roughness to the first surface of the sacrificial layer includes: on the sacrificial layer, forming a transfer layer of semiconductor material with intrinsic porosity; and partially removing the sacrificial layer through the transfer layer.

    SRAM cell layout including arrangement of multiple active regions and multiple gate regions

    公开(公告)号:US12250804B2

    公开(公告)日:2025-03-11

    申请号:US18454471

    申请日:2023-08-23

    Abstract: A memory cell including a set of active regions that overlay a set of gate regions to form a pair of cross-coupled inverters. A first active region extends along a first axis. A first gate region extends transversely to the first active region and overlays the first active region to form a first transistor of the pair of cross-coupled inverters. A second gate region extends transversely to the first active region and overlays the first active region to form a second transistor of the pair of cross-coupled inverters. A second active region extends along a second axis and overlays the first gate region to form a third transistor of the pair of cross-coupled inverters. A fourth active region extending along a third axis and overlays a gate region to form a transistor of a read port.

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