公开(公告)号：KR1020130057798A

公开(公告)日：2013-06-03

申请号：KR1020110123727

申请日：2011-11-24

Applicant: 삼성전기주식회사

Inventor： 김범석 ,  박정민 ,  박은태

IPC: H04R17/00 ,  A61B8/00 ,  G01N29/24

CPC classification number: G01H11/08 ,  Y10T29/42

Abstract: PURPOSE: A supersonic wave sensor and a manufacturing method thereof are provided to automate a manufacturing process of a supersonic wave sensor by electrically connecting a lead line with a piezoelectric device by using a conductive member. CONSTITUTION: A supersonic wave sensor includes a case(110), a piezoelectric device(120), a sound absorption member(130), a conductive member(140), and a lead line(150). The case closes one end and opens the other end. The piezoelectric device is fixed to the one end of the inside of the case. The sound absorption member is combined with the upper side of the piezoelectric device and covers a part of the piezoelectric device. The conductive member connects one end to the piezoelectric device and connects the other end to the sound absorption member. The lead line is electrically combined with the conductive member and the case.

Abstract translation: 目的：提供一种超声波传感器及其制造方法，其通过使用导电部件将引线与压电器件电连接来使超声波传感器的制造过程自动化。 构成：超声波传感器包括壳体（110），压电装置（120），吸声构件（130），导电构件（140）和引线（150）。 案件关闭一端并打开另一端。 压电装置固定在壳体内部的一端。 吸声构件与压电装置的上侧结合并覆盖压电装置的一部分。 导电构件将一端连接到压电装置，并将另一端连接到吸声构件。 引线与导电构件和壳体电气组合。

公开(公告)号：KR1020130034877A

公开(公告)日：2013-04-08

申请号：KR1020110099011

申请日：2011-09-29

Applicant: 삼성전기주식회사

Inventor： 김범석 ,  박정민 ,  박은태

IPC: H04R17/00 ,  G01S7/521 ,  G01N29/24

CPC classification number: G01N29/2437 ,  H04R17/00 ,  Y10T29/42

Abstract: PURPOSE: A supersonic wave sensor and a manufacturing method thereof are provided to reduce the number of processes of the soldering work, thereby making the mass production and automation possible. CONSTITUTION: A cylindrical case(12) forms a floor. A piezoelectric element(16) is formed on the floor of the case. A sound absorbing material(18) is pressed and fixed in an opening part of the case, and equips a recess. A capacitor(20) for the temperature compensation is inserted into the recess and fixed. A first pin terminal(22a) penetrates the recess of the sound absorbing material and is connected to an electrode of the capacitor for the temperature compensation and an exposed electrode of the piezoelectric element. A second pin terminal(22b) is inserted into the recess of the sound absorbing material, fixed, and connected to other electrode of the capacitor for the temperature compensation. A lead wire(24) is inserted into the recess of the sound absorbing material, fixed, connected to an electrode of the second pin terminal and connected to other electrode in an inner wall of the case.

Abstract translation: 目的：提供超声波传感器及其制造方法以减少焊接工序的处理次数，从而可以进行大规模生产和自动化。 构成：圆柱形壳体（12）形成地板。 压电元件（16）形成在壳体的底板上。 吸音材料（18）被按压并固定在壳体的开口部分中，并且装备有凹部。 用于温度补偿的电容器（20）被插入凹部并固定。 第一引脚端子（22a）穿透吸音材料的凹部，并连接到用于温度补偿的电容器的电极和压电元件的暴露电极。 第二针端子（22b）插入到吸音材料的凹部中，固定并连接到用于温度补偿的电容器的其它电极。 引线（24）被插入到吸音材料的凹部中，固定在第二针端子的电极上，并连接到壳体的内壁中的其它电极。