Abstract:
PURPOSE: A polyamide resin composition and a method for preparing the same are provided to ensure excellent impact strength, heat resistance, and wet-proof properties while not degrading reflectivity and mechanical properties. CONSTITUTION: A polyamide resin composition comprises 100 parts by weight of a polyamide resin, 0.1 - 50 parts by weight of white pigment, and 0.01 - 30 parts by weight of magnesium compounds. The polyamide resin includes aromatic dicarboxylic acids or alicyclic diamines as a recurring unit. The polyamide resin is represented by chemical formula 2. In chemical formula 2, N is a fixed number from 50 to 500.
Abstract:
PURPOSE: A polycarbonate resin composition is provided to have superior flame retardant property and flexibility, to obtain excellent mechanical properties including impact strength, flexural strength, and flexural modulus, and to be environment-friendly used for manufacturing electronic products and parts of vehicles by preventing the exhaust of halogen gas. CONSTITUTION: A polycarbonate resin composition having excellent flexibility and flame retardant property comprises: 100.0 parts by weight of a polycarbonate resin; 1-30 parts by weight of a phosphate-based flame retardant; 5-100 parts by weight of fiber filler having an aspect ratio more than 1.5; and 0.05-5 parts by weight of a fluorinated polyolefin resin. The phosphate-based flame retardant is a mixture of a cyclic phosphagen oligomeric compound and a phosphate ester compound. The fiber filler is selected from a glass fiber, a carbon fiber, an aramid fiber, a potassium titanate fiber, a silicon carbide fiber, and their mixture.
Abstract:
A polycarbonate resin composition according to the present invention comprises: a polycarbonate resin; a graft copolymer containing polyorganosiloxane; an organic siloxane polymer; a phosphorus-based flame retardant; and titanium dioxide. The polycarbonate resin composition does not degrade heat resistance and mechanical properties, does not generate halogen-based poisonous gas, and has excellent light resistance and flame retardancy.
Abstract:
본 발명은 (A) 폴리아마이드 수지, (B) 백색 안료, 및 (C) 소듐 포스페이트 염을 포함하는 폴리아마이드 수지 조성물을 포함하는 반사성, 충격강도, 내열성 및 내습성이 모두 우수한 폴리아마이드 수지 조성물에 관한 것으로, 상기 폴리아마이드 수지 조성물은 폴리아마이드 수지(A) 100 중량부에 대하여, 백색안료(B) 0.1 내지 50 중량부, 소듐 포스페이트 염(C) 0.01 내지 20 중량부를 포함하는 것을 특징으로 한다.
Abstract:
본 발명은 (A) 폴리아마이드 수지 100 중량부; (B) 백색 안료 0.1 내지 50 중량부; 및 (C) 마그네슘 화합물 0.01 내지 30 중량부를 포함하고, 상기 마그네슘 화합물(C)은 산화마그네슘(MgO)인 것을 특징으로 하는 반사성, 충격강도, 내열성 및 내습성이 모두 우수한 폴리아마이드 수지 조성물을 제공한다. 폴리아마이드 수지, 백색 안료, 마그네슘 화합물, 내열성, 반사성, 내습성
Abstract:
PURPOSE: A polyamide resin composition is provided to have excellent reflectivity, heat resistance, and adhesion with a sealing resin like epoxy resin, and to restrain degradation of reflectivity in case of being used as a reflecting plate of an LED operating device. CONSTITUTION: A polyamide resin composition comprises 10-70 weight% of crystalline polyamide resin, 10-70 weight% of amorphous polyamide resin with the glass transition temperature of 110-200 °C, 10-60 weight% of an inorganic filler, 10-150 weight% of white pigment, and comprises 0.05-2 parts by weight of photostabilizer based on 100.0 parts by weight of total content of the crystalline polyamide resin, the amorphous polyamide resin, the inorganic filler, and the white pigment. The melting point, the crystallization temperature, and the glass transition temperature of the polyamide resin is respectively 260-350°C, 260-320°C, and 100°C or lower.
Abstract:
PURPOSE: A polyamide resin composition is provided to have excellent surface reflectivity, heat resistance, physical strength and processability, thereby useful for manufacturing molded product like a reflective plate which has low reflectivity as time passed after operating LED. CONSTITUTION: A polyamide resin composition comprises 30-80 weight% of a polyamide resin, 10-60 weight% of an inorganic filler, and 10-50 weight% of white pigment, and comprises 0.05-2 parts by weight of a photostabilizer and 0.05-3 parts by weight of an inorganic powder based on 100.0 parts by weight of the polyamide resin. The photostabilizer and the inorganic particle are comprised with the weight ratio of 1:2-1:5. The limiting viscosity[η] of the polyamide resin is 0.6-0.6 [dl/g], and the melting point is 310 °C or higher. The inorganic filler comprises glass fiber of which average length is 0.1-20 mm, and the aspect ratio is 10-2000.
Abstract:
A polyester thermoplastic resin composition is provided to improve surface smoothness, heat resistance and out gas property of the resin and to realize excellent property balance. A polyester thermoplastic resin composition comprises polyester resin 100.0 parts by weight, inorganic filler 0.1-10 parts by weight and resin stabilizer 0.01-5 parts by weight. The resin stabilizer has the structure of being expressed as the chemical formula 1. In the chemical formula 1, R1-R3 are identical or independently substituted or unsubstituted alkyl group, substituted or unsubstituted aryl group, substituted or unsubstituted alkoxy group, substituted or unsubstituted aryloxy group, substituted or unsubstituted amino group, and hydroxyl group; X1-X3 and R4-R9 are identical or independently and are selected from the group consisting of hydrogen, substituted or unsubstituted alkyl group, substituted or unsubstituted aryl group, and substituted or unsubstituted alkoxy group; and n1-n3 are identical or independently and are an integer of 0-6.