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公开(公告)号：KR101605828B1
公开(公告)日：2016-03-24
申请号：KR1020140071379
申请日：2014-06-12
Applicant: 한국기계연구원
Abstract: 본발명은열전소자의자가발전을이용한무전원온도측정장치에관한것으로, 더욱상세하게는열전소자의일부를온도측정부로구성하고, 나머지부는온도측정대상의열을이용하여발전하는발전부로구성하여발전부의전기를온도측정부에공급하는열전소자를이용한무전원온도측정장치및 이를포함하는화재예방시스템에관한것이다.
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公开(公告)号：KR1020150142460A
公开(公告)日：2015-12-22
申请号：KR1020140071379
申请日：2014-06-12
Applicant: 한국기계연구원
Abstract: 본발명은열전소자의자가발전을이용한무전원온도측정장치에관한것으로, 더욱상세하게는열전소자의일부를온도측정부로구성하고, 나머지부는온도측정대상의열을이용하여발전하는발전부로구성하여발전부의전기를온도측정부에공급하는열전소자를이용한무전원온도측정장치및 이를포함하는화재예방시스템에관한것이다.
Abstract translation: 本发明涉及一种使用热电元件的自发电的无电力温度传感器，更具体地说，涉及一种使用热电元件的无电力温度传感器和包括该热电元件的防火系统，其将热电元件的一部分配置成 温度检测单元，其余部分作为使用来自温度感测对象的热量的发电单元，因此将发电单元的电力供应给温度感测单元。
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公开(公告)号：KR101068490B1
公开(公告)日：2011-09-28
申请号：KR1020100075959
申请日：2010-08-06
Applicant: 한국기계연구원
Abstract: 본 발명은 물리 기상 증착을 이용하여 기판(wafer)위에 n형 반도체 패턴과 p형 반도체 패턴을 형성하여 박막형 열전 에너지변환 모듈을 제조하는 공정에 관한 것이다.
보다 구체적으로는 열전 박막소재로 이용되는 금속화합물을 co-evaporating이나 co-sputtering 공정을 이용하여 증착함으로써 정확한 조성비를 갖는 n형 반도체 패턴과 p형 반도체 패턴으로 형성하여 열전성능이 높은 박막형 열전 에너지변환 모듈을 제조하는 공정에 관한 것이다.Abstract translation: 本发明涉及用于制造薄膜热电能量转换模块，以形成通过使用物理气相沉积一个n型半导体图案和衬底（晶片）上的p型半导体图案的工艺。
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公开(公告)号：KR1020110043424A
公开(公告)日：2011-04-27
申请号：KR1020100075961
申请日：2010-08-06
Applicant: 한국기계연구원
Abstract: PURPOSE: A method for manufacturing a thin film thermoelectric energy conversion module is provided to correct a height error and an arrangement error of an n type semiconductor pattern and a p type semiconductor pattern by using a solder ball when a substrate is bonded. CONSTITUTION: An insulation layer(110) and an electrode layer(120) are formed on a substrate(100). A first photoresist is formed on the electrode layer. The first photoresist is patterned. A part of the insulation layer is exposed by using the patterned first photoresist. A lift-off resistor and a second photoresist are successively formed on the exposed insulation layer. The upper side of the electrode layer is partially exposed by etching the lift-off photoresistor. A first semiconductor pattern(160a) is formed on the exposed electrode layer. A first pattern is formed by removing a second photoresist pattern and the lift-off resistor. A second pattern with a second semiconductor pattern is formed. The second semiconductor pattern is opposite to the first semiconductor pattern. A solder ball is bonded between the upper side of the first pattern and the electrode layer of the substrate with the second pattern.
Abstract translation: 目的：提供一种制造薄膜热电能转换模块的方法，用于当基片接合时通过使用焊球来校正n型半导体图案和p型半导体图案的高度误差和布置误差。 构成：在基板（100）上形成绝缘层（110）和电极层（120）。 在电极层上形成第一光致抗蚀剂。 第一光致抗蚀剂被图案化。 通过使用图案化的第一光致抗蚀剂来暴露绝缘层的一部分。 在暴露的绝缘层上依次形成剥离电阻和第二光致抗蚀剂。 通过蚀刻剥离光敏电阻来部分地暴露电极层的上侧。 在暴露的电极层上形成第一半导体图案（160a）。 通过去除第二光致抗蚀剂图案和剥离电阻器形成第一图案。 形成具有第二半导体图案的第二图案。 第二半导体图案与第一半导体图案相对。 焊料球以第二图案结合在第一图案的上侧和基板的电极层之间。
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公开(公告)号：KR1020110043423A
公开(公告)日：2011-04-27
申请号：KR1020100075960
申请日：2010-08-06
Applicant: 한국기계연구원
Abstract: PURPOSE: A method for manufacturing a thin film thermoelectric energy conversion module is provided to improve productivity by decreasing a deposition process of a plurality of insulation layers and a photoresist. CONSTITUTION: A first semiconductor pattern(160a) is formed on an exposed electrode layer. A nickel layer(170) is formed on a first semiconductor pattern through a deposition process. A tin layer that is a bonding layer is formed on the nickel layer. A first pattern is formed by removing a second photoresist pattern and a lift off resistor and forming the bonding layer on the first semiconductor pattern. A second pattern includes a second semiconductor pattern(160b) opposite to the first semiconductor pattern. The bonding layer of the second pattern is connected to the upper side of the electrode layer of the first pattern.
Abstract translation: 目的：提供一种制造薄膜热电能转换模块的方法，通过减少多个绝缘层和光致抗蚀剂的沉积工艺来提高生产率。 构成：在暴露的电极层上形成第一半导体图案（160a）。 通过沉积工艺在第一半导体图案上形成镍层（170）。 在镍层上形成作为结合层的锡层。 通过去除第二光致抗蚀剂图案和剥离电阻并在第一半导体图案上形成接合层来形成第一图案。 第二图案包括与第一半导体图案相对的第二半导体图案（160b）。 第二图案的接合层连接到第一图案的电极层的上侧。
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Patent Agency Ranking
公开(公告)号：KR1020110043422A
公开(公告)日：2011-04-27
申请号：KR1020100075959
申请日：2010-08-06
Applicant: 한국기계연구원
Abstract: PURPOSE: A method for manufacturing a thin film thermoelectric energy conversion module is provided to prevent the deterioration of thermoelectric performance by depositing metal compound. CONSTITUTION: A first semiconductor pattern(160a) is formed on an exposed electrode layer. A nickel layer(170) is formed on the first semiconductor pattern through a deposition process. A tin layer(180) is formed on the nickel layer through the deposition process. A first pattern is formed by removing a second photo resist pattern and a lift off resistor. A second pattern with the second semiconductor pattern is formed. The first semiconductor pattern is opposite to the second semiconductor pattern. A thermoelectric energy conversion module is formed by bonding the tin layer on the upper side of the electrode layer of the first pattern.
Abstract translation: 目的：提供一种制造薄膜热电能转换模块的方法，以通过沉积金属化合物来防止热电性能的劣化。 构成：在暴露的电极层上形成第一半导体图案（160a）。 通过沉积工艺在第一半导体图案上形成镍层（170）。 通过沉积工艺在镍层上形成锡层（180）。 通过去除第二光致抗蚀剂图案和剥离电阻器形成第一图案。 形成具有第二半导体图案的第二图案。 第一半导体图案与第二半导体图案相反。 通过将第一图案的电极层的上侧上的锡层接合而形成热电能转换模块。
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公开(公告)号：KR1020090123128A
公开(公告)日：2009-12-02
申请号：KR1020080049052
申请日：2008-05-27
Applicant: 한국기계연구원 , 재단법인 서울테크노파크
CPC classification number: C25D17/06 , C25D7/12 , H01L21/687
Abstract: PURPOSE: A wafer jig for a plating device is provided to facilitate dissolution of a cover and a base plate by inserting a sealing member, which seals the rear parts of the base plate and the cover, into an inner sealing groove. CONSTITUTION: A wafer jig for a plating device comprises a circular head, a base plate, a ring plate, a dummy plate, a circular cover(6), a first sealing member, a second sealing member, and a plurality of electrode pins. The base plate is mounted on the upper part of the circular head. The ring plate is mounted on the upper part of the base plate. The dummy plate is inserted into the upper part of the ring plate and has a shape corresponding to the wafer. The circular cover is coupled with the head and an opening part is formed in the circular cover to open the wafer. The first sealing member seals the gap between the front circumference of the base plate and the cover. The second sealing member seals the gap between the inner circumference of the opening part of the cover and the front side of the front circumference of the wafer. A plurality of electrode pins are contacted with the border between the wafer and the ring plate. A plurality of protruded parts are formed on the lower part of the circular cover. The fastening member coupled on the protruded parts by the rotation is formed on the circumference.
Abstract translation: 目的：提供一种用于电镀装置的晶片夹具，以便通过将密封构件（其将基板和盖的后部部分密封）密封到内密封槽中来便于盖和基板的溶解。 构成：用于电镀装置的晶片夹具包括圆头，基板，环板，虚拟板，圆形盖（6），第一密封构件，第二密封构件和多个电极引脚。 基板安装在圆头的上部。 环板安装在基板的上部。 虚拟板被插入到环板的上部，并且具有与晶片相对应的形状。 圆形盖与头部联接，并且在圆形盖中形成开口部分以打开晶片。 第一密封构件密封基板的前周与盖之间的间隙。 第二密封构件密封盖的开口部的内周与晶片的前周的前侧之间的间隙。 多个电极引脚与晶片与环形板之间的边界接触。 在圆形罩的下部形成有多个突出部。 通过旋转而联接在突出部上的紧固构件形成在圆周上。
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公开(公告)号：KR1020090109851A
公开(公告)日：2009-10-21
申请号：KR1020080035289
申请日：2008-04-16
Applicant: 한국기계연구원 , 재단법인 서울테크노파크
IPC: C25D17/06 , H01L21/673
CPC classification number: C25D17/06 , C25D7/12 , H01L21/687
Abstract: PURPOSE: A wafer jig for plating apparatus is provided to improve practicality and by changeably mounting and applying wafer of the various thicknesses. CONSTITUTION: A wafer jig for plating apparatus comprises a head, a base plate, a ring plate, a dummy plate, a cover(6), a first sealing member, a second sealing member and an electrode pin. The ring plate is mounted in front of the base plate, the electrified with the base plate and has a hole defining a wafer loading area. The dummy plate is inserted in the hole of the ring plate to load a wafer. The first sealing member seals up the frontal surface circumference of the base plate and the inside of the cover. The second sealing member seals up the opening inner circumference of the cover and the frontal surface circumference frontal surface of the wafer. The electrode pin is contacted to the wafer and ring plate border and mounted on the inside of the second sealing member of the cover.
Abstract translation: 目的：提供电镀装置的晶片夹具，以提高实用性，并且可变地安装和应用各种厚度的晶片。 构成：用于电镀装置的晶片夹具包括头，基板，环板，虚拟板，盖（6），第一密封构件，第二密封构件和电极引脚。 环板安装在基板的前面，与基板通电，并具有限定晶片装载区域的孔。 将虚拟板插入环形板的孔中以加载晶片。 第一密封构件密封基板的正面周边和盖的内侧。 第二密封构件密封盖的开口内周和晶片的前表面周向前表面。 电极针与晶片和环板边界接触并安装在盖的第二密封构件的内侧。
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公开(公告)号：KR100670232B1
公开(公告)日：2007-01-17
申请号：KR1020040075590
申请日：2004-09-21
Applicant: 한국기계연구원
Abstract: 본 발명은 하나의 장치를 통해 고무재료의 이축인장 시험은 물론 단순인장, 순수전단, 단순압축 시험을 가능하게 하는 이축인장 시험장비를 이용한 단순인장과 단순압축 및 순수전단 시험장치에 관한 것으로서, 다수의 수직 가이드기둥이 상부 둘레에 구비되고 그 중앙에 모터 구동수단을 통해 돌출 승강되는 승강나선축이 구비된 프레임과, 상기 수직 가이드기둥을 타고 승강되며 중앙이 로드셀을 통해 상기 승강나선축의 상단과 연결되어 있는 승강판과, 상기 수직 가이드기둥의 상부에 고정되며 둘레에 다수의 풀리가 방사형의 등간격으로 구비되어 있는 테이블과, 상기 승강판의 둘레에서 상기 풀리와 상응되게 인출되어 각 풀리를 거치며 각각의 내측단에는 고무시편의 단부가 고정되는 고정그립이 구비된 다수의 인장 와이어와, 상기 테이블의 상부에 지지축에 의해 구비되어 다수의 태그가 부착된 고무시편의 변형률을 측정하는 레이저 변형률 측정기와, 상기 마주보는 여러쌍의 고정그립 중 한쌍이 비틀림 없이 이동되도록 테이블의 상부에 구비된 단일의 직선 가이드레일, 및 상기 모터 구동수단에 동작신호를 출력하여 상기 로드셀과 레이저 변형률 측정기로부터 입력되는 신호를 분석하여 하중에 대한 고무시편의 변형량을 산출하는 제어부로 구성됨을 특징으로 하는 것이다.
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