公开(公告)号：EP2665596A1

公开(公告)日：2013-11-27

申请号：EP12704216.6

申请日：2012-02-08

Applicant: Apple Inc.

Inventor： KENNEY, Kevin M. ,  RUSSELL-CLARKE, Peter N.

IPC: B29C70/32 ,  B29C70/34 ,  B29C53/56 ,  B29L31/34 ,  H05K9/00 ,  H05K5/00

CPC classification number: B29C70/32 ,  B29C53/562 ,  B29C53/564 ,  B29C53/845 ,  B29C70/347 ,  B29L2031/3437 ,  B29L2031/3481 ,  H05K5/0008 ,  Y10T156/1028

Abstract: A composite enclosure for housing electronic devices, and methods related thereto, are provided. In particular, in some embodiments, a method of manufacturing a composite enclosure for housing electronic devices includes winding composite material about a mandrel and curing the composite material to create a composite hoop. A panel is formed in a separate process that includes stacking a plurality of composite layers in a mold and curing the composite layers to create a composite panel. The composite hoop and the composite panel are bonded together to form the composite enclosure.