Electronic device antenna with suppressed parasitic resonance

    公开(公告)号:US10249937B2

    公开(公告)日:2019-04-02

    申请号:US15257542

    申请日:2016-09-06

    Applicant: Apple Inc.

    Abstract: An electronic device may be provided with wireless circuitry. The wireless circuitry may include one or more antennas. The antennas may include cellular telephone antennas, wireless local area network antennas, antenna structures for receiving satellite navigation system signals, and other antennas. An antenna may have an antenna resonating element such as an inverted-F antenna resonating element. The inverted-F antenna resonating element may have an inverted-F antenna resonating element arm formed from metal traces on a flexible printed circuit. The flexible printed circuit may be soldered to an antenna grounding clip. A screw may attach the clip, a speaker tab, a connector bracket, and other metal structures to a metal device housing that serves as ground for the antenna. The screw may be isolated from the antenna grounding clip and the other metal structures by an insulating structure such as an insulating gasket.

    Electronic Device with Antenna Grounding Springs and Pads

    公开(公告)号:US20240079790A1

    公开(公告)日:2024-03-07

    申请号:US18458726

    申请日:2023-08-30

    Applicant: Apple Inc.

    CPC classification number: H01Q13/18 H04R9/02 H01Q1/241

    Abstract: An electronic device may be provided with peripheral conductive housing structures having a segment that forms a resonating element for an antenna. A speaker may be mounted to a mid-chassis of the electronic device. A printed circuit may be mounted to the speaker and may have a ground trace for the antenna. A conductive spring may extend through the printed circuit and the speaker to couple the ground trace to the mid-chassis. A conductive contact pad may be welded to an aluminum layer such as an aluminum layer used to form the mid-chassis. A conductive spring such as the conductive spring coupled to the ground traces may press against the contact pad. The contact pad may include gold or nickel-plated stainless steel. The contact pad may provide a strong electrical connection between the conductive spring and the aluminum layer.

    Electronic Device Having Antenna with Vent Structures

    公开(公告)号:US20240079785A1

    公开(公告)日:2024-03-07

    申请号:US18458811

    申请日:2023-08-30

    Applicant: Apple Inc.

    CPC classification number: H01Q9/0421 H01Q1/243

    Abstract: An electronic device may be provided with an antenna having a resonating element formed from a segment of peripheral conductive housing structures. A speaker may be aligned with first openings in the segment. A vent may be aligned with second openings in the segment. A connector may protrude through the segment. A trace combiner for the antenna may be patterned onto the speaker and may be coupled to the segment. Tuners for the antenna may be disposed on first and second flexible printed circuits that extend along opposing sides of the connector. The tuners may be controlled through the speaker. The second flexible printed circuit may extend along the vent. The vent may have a vent cowling with a cut-out region next to the tuner on the second flexible printed circuit.

    Electronic Device with Antenna Grounding Through Sensor Module

    公开(公告)号:US20240079779A1

    公开(公告)日:2024-03-07

    申请号:US18458779

    申请日:2023-08-30

    Applicant: Apple Inc.

    CPC classification number: H01Q5/328 H01Q9/0442

    Abstract: An electronic device may be provided with a sensor module and an antenna having an antenna arm, ground structures, and a tuner. The tuner may be mounted to a printed circuit overlapping the sensor module. A spring may be mounted to the printed circuit and may couple the tuner to a conductive chassis of the sensor module. The sensor module may include optical sensors that gather sensor data through a display and may form ground paths from the tuner to the ground structures. Conductive interconnect structures such as springs may exert biasing forces in different directions to couple the ground paths to different layers of the ground structures. This may serve to couple the antenna to the ground structures as close as possible to the tuner, thereby maximizing antenna performance, despite the presence of the sensor module.

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