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    Heat dissipation structure for mobile device
    31.
    发明授权
    Heat dissipation structure for mobile device 有权

    公开(公告)号：US10114430B2

    公开(公告)日：2018-10-30

    申请号：US14517929

    申请日：2014-10-20

    Applicant: ASIA VITAL COMPONENTS CO., LTD.

    Inventor： Ching-Hang Shen

    IPC: H05K5/00 ,  H01L23/38 ,  G06F1/20 ,  G06F1/16

    Abstract: A heat dissipation structure for mobile device includes an element holding member, which has a holding portion and a cooling chip set on the holding portion. The holding portion has a first side and an opposite second side; and the cooling chip has a cold surface and an opposite hot surface. The cooling chip is set on the holding portion with the cold surface and the hot surface being flush with the first and the second side of the holding portion, respectively. The heat dissipation structure can be mounted in a mobile device to quickly cool heat-producing electronic elements in the mobile device, so that any produced heat is guided away from the mobile device without accumulating therein.

    WATER-COOLING DEVICE
    35.
    发明申请
    WATER-COOLING DEVICE 审中-公开

    公开(公告)号：US20170363362A1

    公开(公告)日：2017-12-21

    申请号：US15183793

    申请日：2016-06-16

    Applicant: ASIA VITAL COMPONENTS CO., LTD.

    Inventor： Ching-Hang Shen

    IPC: F28D15/00 ,  F28F3/02 ,  F04D13/06 ,  F04D29/22 ,  F28F9/00 ,  F28D21/00

    CPC classification number: F28F3/02 ,  F04D13/0646 ,  F04D13/0666 ,  F05B2280/5008 ,  F28D2021/0028 ,  F28F3/12 ,  F28F2250/08 ,  H02K3/26 ,  H02K7/14 ,  H02K21/24

    Abstract: A water-cooling device includes a pump case, at least one winding, a driver and a heat exchange member. The pump case has a top section, a bottom section and a peripheral section together defining a pump chamber. The winding is disposed on a circuit board. The circuit board is disposed on any of the top section, the bottom section and the peripheral section. The driver is disposed in the pump chamber. At least one magnetic member is disposed on the driver in a position corresponding to the winding, whereby the magnetic member can induce and magnetize the winding on the circuit board. The heat exchange member is connected with the pump case. By means of the structural design of the water-cooling device, the volume of the water-cooling device is greatly minified and the structure of the water-cooling device is thinned.

    INTERNAL FRAME STRUCTURE WITH HEAT ISOLATION EFFECT AND ELECTRONIC APPARATUS WITH THE INTERNAL FRAME STRUCTURE
    36.
    发明申请
    INTERNAL FRAME STRUCTURE WITH HEAT ISOLATION EFFECT AND ELECTRONIC APPARATUS WITH THE INTERNAL FRAME STRUCTURE 有权
    内部框架结构与内部框架结构的隔离效应和电子设备

    公开(公告)号：US20170055379A1

    公开(公告)日：2017-02-23

    申请号：US14828497

    申请日：2015-08-17

    Applicant: ASIA VITAL COMPONENTS CO., LTD.

    Inventor： Ching-Hang Shen

    IPC: H05K7/20

    CPC classification number: H05K7/20954 ,  G06F1/1626 ,  G06F1/1656 ,  G06F1/203

    Abstract: An internal frame structure with heat isolation effect and an electronic apparatus with the internal frame structure. The internal frame is applied to the electronic apparatus. The internal frame includes a main body and a frame unit. The frame unit includes an inner layer, an outer layer and a heat isolation layer positioned between the inner layer and the outer layer. The inner layer is adjacently connected with the main body. The outer layer is positioned on an outermost side of the frame unit. The heat isolation layer serves to isolate the heat of the main body from being transferred to the outer layer of the frame unit.

    Abstract translation: 具有隔热效果的内部框架结构和具有内部框架结构的电子设备。 内部框架被应用于电子设备。 内部框架包括主体和框架单元。 框架单元包括位于内层和外层之间的内层，外层和隔热层。 内层与主体相邻连接。 外层位于框架单元的最外侧。 热隔离层用于将主体的热量隔离以传递到框架单元的外层。

    Internal frame structure with heat isolation effect and electronic apparatus with the internal frame structure
    37.
    发明授权
    Internal frame structure with heat isolation effect and electronic apparatus with the internal frame structure 有权
    具有隔热效果的内框架结构和内框架结构的电子设备

    公开(公告)号：US09578791B1

    公开(公告)日：2017-02-21

    申请号：US14828497

    申请日：2015-08-17

    Applicant: ASIA VITAL COMPONENTS CO., LTD.

    Inventor： Ching-Hang Shen

    IPC: H05K7/20 ,  H01L23/473

    CPC classification number: H05K7/20954 ,  G06F1/1626 ,  G06F1/1656 ,  G06F1/203

    Abstract: An internal frame structure with heat isolation effect and an electronic apparatus with the internal frame structure. The internal frame is applied to the electronic apparatus. The internal frame includes a main body and a frame unit. The frame unit includes an inner layer, an outer layer and a heat isolation layer positioned between the inner layer and the outer layer. The inner layer is adjacently connected with the main body. The outer layer is positioned on an outermost side of the frame unit. The heat isolation layer serves to isolate the heat of the main body from being transferred to the outer layer of the frame unit.

    Abstract translation: 具有隔热效果的内部框架结构和具有内部框架结构的电子设备。 内部框架被应用于电子设备。 内部框架包括主体和框架单元。 框架单元包括位于内层和外层之间的内层，外层和隔热层。 内层与主体相邻连接。 外层位于框架单元的最外侧。 热隔离层用于将主体的热量隔离以传递到框架单元的外层。

    FAN VIBRATION DAMPING STRUCTURE AND FAN WITH THE VIBRATION DAMPING STRUCTURE
    38.
    发明申请
    FAN VIBRATION DAMPING STRUCTURE AND FAN WITH THE VIBRATION DAMPING STRUCTURE 有权
    风扇振动阻尼结构和风扇与振动阻尼结构

    公开(公告)号：US20170002837A1

    公开(公告)日：2017-01-05

    申请号：US14791476

    申请日：2015-07-05

    Applicant: ASIA VITAL COMPONENTS CO., LTD.

    Inventor： Ching-Hang Shen

    IPC: F04D29/66 ,  F04D29/32 ,  F04D29/053 ,  F16C27/04 ,  F04D29/063 ,  F16C19/54 ,  F16C19/52 ,  F04D19/00 ,  F04D29/059

    CPC classification number: F04D29/668 ,  F04D19/002 ,  F04D25/062 ,  F04D29/059 ,  F04D29/063 ,  F16C19/527 ,  F16C19/54 ,  F16C27/04

    Abstract: A fan vibration damping structure and a fan with the vibration damping structure. The fan vibration damping structure includes a bearing cup, a first bearing, a second bearing, a third bearing, an elastic member and at least one oil seal. The bearing cup has an internal receiving space and a bearing hole in communication with each other. The first, second and third bearings and the elastic member are disposed in the receiving space. A high-viscosity-coefficient oil is filled in the receiving space. The fan vibration damping structure is applied to the fan to greatly reduce vibration of the fan in operation.

    Abstract translation: 风扇振动阻尼结构和带振动阻尼结构的风扇。 风扇减振结构包括轴承杯，第一轴承，第二轴承，第三轴承，弹性构件和至少一个油封。 轴承杯具有内部接收空间和彼此连通的轴承孔。 第一，第二和第三轴承和弹性构件设置在容纳空间中。 高粘度系数油被填充在接收空间中。 将风扇振动阻尼结构应用于风扇，大大减少风机运行中的振动。

    Heat dissipation structure of intelligent wearable device
    39.
    发明授权
    Heat dissipation structure of intelligent wearable device 有权
    智能耐磨装置散热结构

    公开(公告)号：US09529396B2

    公开(公告)日：2016-12-27

    申请号：US14555708

    申请日：2014-11-28

    Applicant: Asia Vital Components Co., Ltd.

    Inventor： Ching-Hang Shen

    IPC: H05K7/20 ,  G06F1/20 ,  G06F1/16 ,  H01L23/473

    CPC classification number: G06F1/203 ,  G06F1/163 ,  G06F2200/201

    Abstract: A heat dissipation structure of intelligent wearable device includes a wearable mobile device main body and a hard wearable body. The wearable mobile device main body has a receiving space for receiving therein multiple electronic components. The electronic components have at least one heat source. The hard wearable body is made of thermosetting polymer material or thermoplastic polymer material. The hard wearable body has a chamber having a capillary structure. A working fluid is contained in the chamber. The hard wearable body has a heat absorption section and a heat dissipation section. The hard wearable body is connected with the wearable mobile device main body. The heat absorption section is in contact with the electronic components or the heat source to conduct heat to the heat dissipation section to dissipate the heat at a remote end. Accordingly, the heat dissipation efficiency of the intelligent wearable device is greatly enhanced.

    Abstract translation: 智能可穿戴装置的散热结构包括可穿戴式移动装置主体和硬质耐磨装置。 可穿戴移动装置主体具有用于在其中容纳多个电子部件的容纳空间。 电子部件具有至少一个热源。 硬质耐磨体由热固性聚合物材料或热塑性聚合物材料制成。 硬质可穿戴体具有具有毛细结构的腔室。 工作流体包含在腔室中。 硬质耐磨体具有吸热部和散热部。 硬质可穿戴体与可穿戴式移动装置主体相连。 吸热部与电子部件或热源接触，将热量传导到散热部，以散发远端的热量。 因此，智能耐磨装置的散热效率大大提高。

    Heat dissipation structure for wearable mobile device
    40.
    发明授权
    Heat dissipation structure for wearable mobile device 有权
    可穿戴式移动设备的散热结构

    公开(公告)号：US09367105B1

    公开(公告)日：2016-06-14

    申请号：US14555706

    申请日：2014-11-28

    Applicant: ASIA VITAL COMPONENTS CO., LTD.

    Inventor： Ching-Hang Shen

    IPC: G06F1/20 ,  G06F1/16 ,  H05K7/20

    CPC classification number: G06F1/203 ,  G06F1/163

    Abstract: A heat dissipation structure for a wearable mobile device comprises a wearable mobile device and a flexible belt. The wearable mobile device has a receiving space which receives a plurality of electronic components having at least one heat source. The flexible belt is made of rubber or silicone and has a cavity which has at least one wick structure and a working liquid. A wall of the cavity protrudes to form a supporting portion. The flexible belt defines a heat absorbing portion and at least one heat dissipating portion. Two ends of the heat absorbing portion form the heat dissipating portion. The heat absorbing portion contacts the electronic components or the heat source to conduct heat. The present invention provides a heat dissipation structure using a vapor-liquid circulating chamber and structure disposed in a flexible belt for a wearable mobile device to enhance the whole heat dissipation efficiency.

    Abstract translation: 用于可穿戴式移动设备的散热结构包括可穿戴移动设备和柔性带。 所述可穿戴式移动装置具有容纳多个具有至少一个热源的电子部件的接收空间。 柔性带由橡胶或硅树脂制成，具有至少一个芯体结构和工作液体的空腔。 腔的壁突出形成支撑部。 柔性带限定吸热部分和至少一个散热部分。 吸热部的两端形成散热部。 吸热部分接触电子部件或热源以传导热量。 本发明提供了一种使用气液循环室和结构的散热结构，其布置在用于可穿戴式移动装置的柔性带中以增强整体散热效率。

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