公开(公告)号：US11805667B2

公开(公告)日：2023-10-31

申请号：US16652712

申请日：2019-09-23

Applicant: BOE TECHNOLOGY GROUP CO., LTD.

Inventor： Lingzhi Qian ,  Rui Hong ,  Song Zhang ,  Penghao Gu

IPC: H10K50/844 ,  H01L33/56 ,  H10K71/00

CPC classification number: H10K50/844 ,  H01L33/56 ,  H10K71/00 ,  H01L2933/005

Abstract: An encapsulation structure, an electronic apparatus, and an encapsulation method are provided. The encapsulation structure includes: a base substrate, an organic encapsulation layer and a barrier dam that are on the base substrate. The barrier dam is disposed outside the organic encapsulation layer; and the barrier dam includes an upper surface away from the base substrate and a side surface facing the organic encapsulation layer, and at least one of the upper surface and the side surface includes a groove and a protrusion.

公开(公告)号：US11762416B2

公开(公告)日：2023-09-19

申请号：US16640522

申请日：2019-01-03

Applicant: BOE Technology Group Co., Ltd.

Inventor： Penghao Gu ,  Jiahao Zhang ,  Pao Ming Tsai

IPC: G06F1/16 ,  G02B1/14 ,  B32B27/28 ,  B32B7/023 ,  B32B7/022 ,  B32B37/06

CPC classification number: G06F1/1607 ,  B32B7/022 ,  B32B7/023 ,  B32B27/281 ,  B32B37/06 ,  G02B1/14 ,  B32B2250/03 ,  B32B2250/24 ,  B32B2250/40 ,  B32B2307/412 ,  B32B2307/42 ,  B32B2307/51 ,  B32B2307/54 ,  B32B2457/206 ,  B32B2457/208

Abstract: A transparent laminated film, a display device, and a method for manufacturing a transparent laminated film are disclosed. The transparent laminated film includes a first film layer, a central film layer, and a second film layer which are sequentially stacked, each of a material of the first film layer and a material of the second film layer includes a thermoplastic plastic, and a material of the central film layer includes a thermosetting plastic.

公开(公告)号：US20220141967A1

公开(公告)日：2022-05-05

申请号：US16955442

申请日：2019-07-30

Applicant: BOE Technology Group Co., Ltd.

Inventor： Penghao Gu ,  Chunyan Xie ,  Shiming Shi

IPC: H05K5/00 ,  B32B7/022 ,  B32B7/12 ,  B32B27/08 ,  B32B17/10 ,  B32B27/28 ,  B32B27/36 ,  B32B3/30

Abstract: Provided are a backboard support structure, a preparation method therefor, and a display device. The display device includes a display substrate and a backboard support structure; the backboard support structure includes a substrate support film and an adhesive layer arranged in a laminated manner. The backboard support structure is bonded to the non-display side of the display substrate via the adhesive layer, and includes a first bendable region and a first non-bent region. The adhesive layer includes a first portion located in the first bendable region and a second portion located in the first non-bent region; the first portion has a modulus of elasticity of about 1 Kpa-150 Kpa, the second portion has a modulus of elasticity of about 150 Kpa-250 Kpa, and the substrate support film has a modulus of elasticity of about 1 Gpa-10 Gpa.

公开(公告)号：US11239444B2

公开(公告)日：2022-02-01

申请号：US16464621

申请日：2018-10-29

Applicant: BOE Technology Group Co., Ltd.

Inventor： Lingzhi Qian ,  Song Zhang ,  Rui Hong ,  Penghao Gu

IPC: H01L51/52 ,  H01L51/56 ,  H01L23/29

Abstract: A display panel. The display panel includes a base substrate; a plurality of light emitting elements on the base substrate; and an encapsulating structure encapsulating the plurality of light emitting elements. The encapsulating structure includes a first inorganic encapsulating sublayer; a first organic encapsulating sublayer; and a first amphiphilic cross-linking sublayer between the first inorganic encapsulating sublayer and the first organic encapsulating sublayer.

公开(公告)号：US20200321554A1

公开(公告)日：2020-10-08

申请号：US16464621

申请日：2018-10-29

Applicant: BOE Technology Group Co., Ltd.

Inventor： Lingzhi Qian ,  Song Zhang ,  Rui Hong ,  Penghao Gu

IPC: H01L51/52 ,  H01L51/56

Abstract: A display panel. The display panel includes a base substrate; a plurality of light emitting elements on the base substrate; and an encapsulating structure encapsulating the plurality of light emitting elements. The encapsulating structure includes a first inorganic encapsulating sublayer; a first organic encapsulating sublayer; and a first amphiphilic cross-linking sublayer between the first inorganic encapsulating sublayer and the first organic encapsulating sublayer.