Abstract:
A ceramic and a method for preparing a ceramic are provided. The ceramic includes an alumina and an oxygen-containing compound of strontium having a perovskite structure.
Abstract:
Embodiments of the present disclosure are directed to a circuit board. The circuit board comprises: an aluminum-based substrate; an alumina layer formed on at least one surface of the aluminum-based substrate; and a circuit layer formed on the alumina layer. The alumina layer comprises alumina and an element selected from a group consisting of chromium, nickel, a rare earth metal, and a combination thereof.
Abstract:
A defroster and vehicle are provided. The defroster includes: a housing (5) defining an air outlet (4), a heating device disposed in the housing (5), an air blower (1) defining a blowing outlet (11) and disposed in the housing (5), and an air duct (2) defining a duct inlet (22) and a duct outlet (23), the air duct (2) being disposed between the blowing outlet (11) and the heating device so that air blown out from the blower outlet (11) enters the air duct (2) via the duct inlet (22) and goes out of the air duct (2) via the duct outlet (23), then passes through the heating device to exchange heat with the heating device, and is discharged out of the housing (5) via the air outlet (4), wherein the area of the duct inlet (22) is different from that of the duct outlet (23).
Abstract:
A method for selectively metallizing a surface of a ceramic substrate, a ceramic product and use of the ceramic product are provided. The method comprises steps of: A) molding and sintering a ceramic composition to obtain the ceramic substrate, in which the ceramic composition comprises a ceramic powder and a functional powder dispersed in the ceramic powder; the ceramic powder is at least one selected from a group consisting of an oxide of E, a nitride of E, a oxynitride of E, and a carbide of E; E is at least one selected from a group consisting of Li, Na, K, Rb, Cs, Be, Mg, Ca, Sr, Ba, B, Al, Ga, Si, Ge, P, As, Sc, Y, Zr, Hf, and lanthanide elements; the functional powder is at least one selected from a group consisting of an oxide of M, a nitride of M, a oxynitride of M, a carbide of M, and a simple substance of M; and M is at least one selected from a group consisting of Ti, V, Cr, Mn, Fe, Co, Ni, Cu, Zn, Nb, Mo, Tc, Ru, Rh, Pd, Ag, Cd, Ta, W, Re, Os, Ir, Pt, Au, In, Sn, Sb, Pb, Bi, Ce, Pr, Nd, Pm, Sm, Eu, Gd, Tb, Dy, Ho, Er, Tm, Yb, and Lu; B) radiating a predetermined region of the surface of the ceramic substrate using an energy beam to form a chemical plating active center on the predetermined region of the surface of the ceramic substrate; and C) performing chemical plating on the ceramic substrate formed with the chemical plating active center to form a metal layer on the predetermined region of the surface of the ceramic substrate.
Abstract:
The present disclosure relates to a heat dissipation element, a method for manufacturing the heat dissipation element, and an IGBT module. The heat dissipation element includes a heat conductor and a heat dissipation body, where the heat conductor is an aluminum-clad ceramic heat conductor; the heat dissipation body is an aluminum silicon carbon heat dissipation body; the aluminum silicon carbon heat dissipation body is provided with at least one groove; and the aluminum-clad ceramic heat conductor is embedded into the groove through aluminizing in an integral forming manner. The present disclosure further provides a method for manufacturing the foregoing heat dissipation element and an IGBT module including the foregoing heat dissipation element.
Abstract:
An LED support assembly and an LED module are provided. The LED support assembly includes: a metal heat sink(10), a first ceramic substrate(20)and a second ceramic substrate(30), the metal heat sink(10)defines an upper surface(11);the first ceramic substrate(20)is adapted to support a LED chip(40)and disposed on the upper surface(11)of the metal heat sink;the second ceramic substrate(30)is adapted to support electrodes(51,52)of the LED chip(40)and surrounds the first ceramic substrate(20).