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公开(公告)号：US20230092019A1
公开(公告)日：2023-03-23
申请号：US17940515
申请日：2022-09-08
Applicant: CORNING INCORPORATED
Inventor： Matthew John Dejneka , Jesse Kohl , Alexander Mikhailovich Streltsov
Abstract: An article includes a glass ceramic that has an amorphous silicate glass phase and a crystalline phase including a species of MxWO3 with 0
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公开(公告)号：US11530155B2
公开(公告)日：2022-12-20
申请号：US16556767
申请日：2019-08-30
Applicant: CORNING INCORPORATED
Inventor： Rebecca Vernon Higginbottom Dahlman , William James Miller , Katherine Rose Rossington , Alexander Mikhailovich Streltsov
Abstract: A method of forming a strengthened glass article is provided. The method includes providing a strengthened glass article. The strengthened glass article is in the form of a container including a sidewall having an exterior surface and an interior surface that encloses an interior volume. The sidewall has an exterior strengthened surface layer that includes the exterior surface, an interior strengthened surface layer that includes the interior surface and a central layer between the exterior strengthened surface layer and the interior strengthened surface layer that is under a tensile stress. A laser-induced intended line of separation is formed in the central layer at a predetermined depth between the exterior strengthened surface layer and the interior strengthened surface layer by irradiating the sidewall with a laser without separating the glass article.
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33.发明申请公开(公告)号：US20200277225A1
公开(公告)日：2020-09-03
申请号：US16462092
申请日：2017-11-15
Applicant: CORNING INCORPORATED
Abstract: Methods of making a glass-based article including a surface feature thereon. Methods include arranging a glass-based substrate relative to a laser. Methods also include irradiating the glass-based substrate with laser beam with a light wavelength from about 2500 nm to about 3000 nm to grow a surface feature thereon.
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公开(公告)号：US20190352228A1
公开(公告)日：2019-11-21
申请号：US16526472
申请日：2019-07-30
Applicant: Corning Incorporated
IPC: C03C23/00
Abstract: A glass article having a glass bump formed integrally thereon by laser-irradiation methods. The glass bump includes a lower region connected to an upper region by an inflection region. The lower region projects from a surface of the glass article and is defined by concavely rounded sides with a radius of curvature R1. The upper region includes a transition portion and a top portion. The transition portion is defined by convexly rounded sides with a radius of curvature R2. The transition portion connects to the lower portion via the inflection region. The upper portion connects to the transition portion and is defined by a convexly rounded top surface with a radius of curvature R3, which is greater than radius of curvature R2.
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公开(公告)号：US10358386B2
公开(公告)日：2019-07-23
申请号：US15096751
申请日：2016-04-12
Applicant: Corning Incorporated
IPC: C03C23/00 , C03B23/02 , C03B23/24 , E06B3/663 , C03B29/02 , E06B3/66 , E06B3/673 , E06B3/677 , G02B5/02
Abstract: Methods of forming a sheet glass product comprising a plurality of growth-limited glass bump spacers. According to the methods, a glass pane of the sheet glass product is irradiated with laser radiation to locally heat the glass pane at a plurality of spacer localities and induce growth of a plurality of glass bump spacers in the glass pane. The growth of the plurality of glass bump spacers is limited by utilizing a growth-limiting plate comprising a scattering surface portion. The scattering surface portion of the growth-limiting plate mitigates damage to the growth-limiting plate and may also mitigate damage to the glass pane. Vacuum insulated glass products and systems for forming a growth-limited sheet glass product are also provided.
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Patent Agency Ranking
公开(公告)号：US10297787B2
公开(公告)日：2019-05-21
申请号：US15305553
申请日：2015-04-20
Applicant: Corning Incorporated
Inventor： Matthew John Dejneka , Alexander Mikhailovich Streltsov
IPC: H01L51/52 , B23K26/57 , B23K26/20 , C03C3/091 , C03C3/093 , C03C3/095 , C03C23/00 , C03C27/00 , C03B23/203 , C04B37/04 , C04B37/00 , B23K26/21 , B23K26/08 , B23K26/324 , C03C3/062 , C03C3/064 , C03C3/068 , C03C3/076 , C03C3/078 , C03C3/083 , C03C3/085 , C03C3/087 , C03C3/089 , C03C10/00 , H01L51/56 , B23K26/244 , B23K101/36 , B23K103/00
Abstract: Disclosed herein are methods for welding a first substrate and a second substrate, the method comprising bringing the first and second substrates into contact to form a substrate interface, and directing a laser beam operating at a predetermined wavelength through the second substrate onto the substrate interface, wherein the first substrate absorbs light from the laser beam in an amount sufficient to form a weld between the first substrate and the second substrate. The disclosure also relates to glass and/or glass-ceramic packaging and OLED display produced according to the methods disclosed herein.
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37.发明申请公开(公告)号：US20180138445A1
公开(公告)日：2018-05-17
申请号：US15655194
申请日：2017-07-20
Applicant: CORNING INCORPORATED
Inventor： Leonard Charles Dabich, II , Stephan Lvovich Logunov , Mark Alejandro Quesada , Alexander Mikhailovich Streltsov
IPC: H01L51/52 , B23K26/20 , C03C3/247 , B32B7/04 , B32B17/06 , C03C3/14 , C03C3/16 , C03C3/23 , C03C4/00 , C03C8/24 , C03B23/203 , C03C27/08 , C03C27/06 , C03C23/00 , C03C3/12 , H01L51/00 , B32B37/06
CPC classification number: H01L51/5246 , B23K26/206 , B32B7/04 , B32B17/06 , B32B37/06 , B32B2250/03 , B32B2250/40 , B32B2255/20 , B32B2310/0825 , B32B2310/0831 , B32B2310/0843 , B32B2457/206 , C03B23/203 , C03C3/12 , C03C3/14 , C03C3/16 , C03C3/23 , C03C3/247 , C03C4/0071 , C03C8/24 , C03C23/0025 , C03C27/06 , C03C27/08 , C03C2204/00 , C03C2207/00 , C03C2218/32 , H01L51/0024 , H01L2251/301
Abstract: A method of sealing a workpiece comprising forming an inorganic film over a surface of a first substrate, arranging a workpiece to be protected between the first substrate and a second substrate wherein the inorganic film is in contact with the second substrate; and sealing the workpiece between the first and second substrates as a function of the composition of impurities in the first or second substrates and as a function of the composition of the inorganic film by locally heating the inorganic film with a predetermined laser radiation wavelength. The inorganic film, the first substrate, or the second substrate can be transmissive at approximately 420 nm to approximately 750 nm.
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38.发明申请公开(公告)号：US20170022102A1
公开(公告)日：2017-01-26
申请号：US15141658
申请日：2016-04-28
Applicant: CORNING INCORPORATED
IPC: C03C23/00 , B23K26/00 , B23K26/352 , C03B23/02
CPC classification number: C03C23/0025 , B23K26/0006 , B23K26/032 , B23K26/352 , B23K26/354 , B23K26/355 , B23K2103/54 , B32B3/30 , B32B17/06 , B32B2307/304 , B32B2307/412 , B32B2419/00 , C03B23/02 , C03C23/002 , E06B3/6612 , E06B3/663
Abstract: A method for controlling formation of glass bumps in a glass article with laser-irradiation without the use of a growth-limiting structure. Standard deviation of height between the glass bumps on the article is less than 1 micron by controlling the laser radiation dose provided on the glass article.
Abstract translation: 一种用于在不使用生长限制结构的情况下用激光照射来控制玻璃制品中的玻璃凸块的形成的方法。 通过控制玻璃制品上提供的激光辐射剂量，制品上的玻璃凸块之间的高度的标准偏差小于1微米。
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39.发明授权Laser welding transparent glass sheets using low melting glass or thin absorbing films 有权使用低熔点玻璃或薄吸收膜的激光焊接透明玻璃板公开(公告)号：US09515286B2
公开(公告)日：2016-12-06
申请号：US14271797
申请日：2014-05-07
Applicant: CORNING INCORPORATED
Inventor： Leonard Charles Dabich, II , Stephan Lvovich Logunov , Mark Alejandro Quesada , Alexander Mikhailovich Streltsov
IPC: H01L21/00 , H01L51/52 , C03C3/12 , C03C23/00 , C03C27/06 , C03C27/08 , C03B23/203 , B23K26/20 , B32B37/06 , H01L51/00 , B32B7/04 , B32B17/06 , C03C3/14 , C03C3/16 , C03C3/23 , C03C3/247 , C03C4/00 , C03C8/24
CPC classification number: H01L51/5246 , B23K26/206 , B32B7/04 , B32B17/06 , B32B37/06 , B32B2250/03 , B32B2250/40 , B32B2255/20 , B32B2310/0825 , B32B2310/0831 , B32B2310/0843 , B32B2457/206 , C03B23/203 , C03C3/12 , C03C3/14 , C03C3/16 , C03C3/23 , C03C3/247 , C03C4/0071 , C03C8/24 , C03C23/0025 , C03C27/06 , C03C27/08 , C03C2204/00 , C03C2207/00 , C03C2218/32 , H01L51/0024 , H01L2251/301
Abstract: A method of sealing a workpiece comprising forming an inorganic film over a surface of a first substrate, arranging a workpiece to be protected between the first substrate and a second substrate wherein the inorganic film is in contact with the second substrate; and sealing the workpiece between the first and second substrates as a function of the composition of impurities in the first or second substrates and as a function of the composition of the inorganic film by locally heating the inorganic film with a predetermined laser radiation wavelength. The inorganic film, the first substrate, or the second substrate can be transmissive at approximately 420 nm to approximately 750 nm.
Abstract translation: 一种密封工件的方法，包括在第一基板的表面上形成无机膜，将待保护的工件布置在第一基板和第二基板之间，其中无机膜与第二基板接触; 并且通过以预定的激光辐射波长局部加热无机膜，作为第一或第二基板中的杂质组成的函数，并且作为无机膜的组成的函数，将工件密封在第一和第二基板之间。 无机膜，第一衬底或第二衬底可以在大约420nm至大约750nm处是透射的。
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公开(公告)号：US20160268541A1
公开(公告)日：2016-09-15
申请号：US15066704
申请日：2016-03-10
Applicant: Corning Incorporated
Inventor： Leonard Charles Dabich, II , Stephan Lvovich Logunov , Mark Alejandro Quesada , Alexander Mikhailovich Streltsov
IPC: H01L51/52 , B32B17/06 , C03C8/24 , C03C4/00 , C03C3/247 , C03C3/16 , C03C3/14 , B32B7/04 , C03C3/23
CPC classification number: H01L51/5246 , B23K26/206 , B32B7/04 , B32B17/06 , B32B37/06 , B32B2250/03 , B32B2250/40 , B32B2255/20 , B32B2310/0825 , B32B2310/0831 , B32B2310/0843 , B32B2457/206 , C03B23/203 , C03C3/12 , C03C3/14 , C03C3/16 , C03C3/23 , C03C3/247 , C03C4/0071 , C03C8/24 , C03C23/0025 , C03C27/06 , C03C27/08 , C03C2204/00 , C03C2207/00 , C03C2218/32 , H01L51/0024 , H01L2251/301
Abstract: Disclosed herein are sealed devices comprising a first substrate, a second substrate, an inorganic film between the first and second substrates, and at least one weld region comprising a bond between the first and second substrates. The weld region can comprise a chemical composition different from that of the inorganic film and the first or second substrates. The sealed devices may further comprise a stress region encompassing at least the weld region, in which a portion of the device is under a greater stress than the remaining portion of the device. Also disclosed herein are display and electronic components comprising such sealed devices.
Abstract translation: 本文公开了包括第一基板，第二基板，第一和第二基板之间的无机膜以及包括第一和第二基板之间的接合的至少一个焊接区域的密封装置。 焊接区域可以包括与无机膜和第一或第二基板不同的化学组成。 密封装置还可以包括包围至少焊接区域的应力区域，其中装置的一部分处于比装置的剩余部分更大的应力下。 这里还公开了包括这种密封装置的显示器和电子部件。
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