公开(公告)号：US11202368B2

公开(公告)日：2021-12-14

申请号：US17006016

申请日：2020-08-28

Applicant: Cisco Technology, Inc.

Inventor： Joel Goergen ,  Jessica Kiefer ,  Alpesh Umakant Bhobe ,  Kameron Rose Hurst ,  D. Brice Achkir ,  Amendra Koul ,  Scott Hinaga ,  David Nozadze

IPC: H05K3/46 ,  H05K1/09

Abstract: A power plane structure for a printed circuit board includes a copper layer, and a carbon layer applied directly to a surface of the copper layer. The carbon layer can include graphite or graphene. In additional embodiments, a duplicate power plane structure for a printed circuit board includes two power planes separated by an insulating core, each power plane including a copper layer and a carbon layer applied directly to a surface of the copper layer.

公开(公告)号：US20210059055A1

公开(公告)日：2021-02-25

申请号：US16547639

申请日：2019-08-22

Applicant: Cisco Technology, Inc.

Inventor： Amendra Koul ,  Mike Sapozhnikov ,  David Nozadze ,  Joel Goergen

IPC: H05K3/00 ,  H05K1/18 ,  H05K1/02 ,  G06F17/50 ,  G01R31/28

Abstract: A printed circuit board (PCB) includes a plurality of layers disposed at different depths of the PCB, circuit components disposed at different layers of the PCB, and a plurality of temperature measurement sensors located at one or more layers of the PCB, where each temperature measurement sensor is associated with a corresponding circuit component. A measured temperature is obtained at an embedded temperature measurement sensor located at an embedded layer within the PCB, and the measured temperature is correlated with an electrical property of an embedded circuit component located at the same embedded layer within the PCB as the embedded temperature measurement sensor. A plurality of moisture measurement sensors can also be located at one or more layers of the PCB to facilitate a measured moisture with an electrical property of an embedded circuit component.