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公开(公告)号:EP3436251A1
公开(公告)日:2019-02-06
申请号:EP16901869.4
申请日:2016-05-12
Applicant: Hewlett-Packard Development Company, L.P.
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公开(公告)号:EP3658356A1
公开(公告)日:2020-06-03
申请号:EP17919498.0
申请日:2017-07-27
Applicant: Hewlett-Packard Development Company, L.P.
Inventor: LAWS, Alexander David , BOUCHER, Peter , KOEPL, Devin , KANG, Samantha , OPPENHEIMER, Charles Hugh , ROMAN, Justin M.
IPC: B29C64/307 , B29C64/20 , B29C64/141 , B33Y30/00 , B33Y40/00
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公开(公告)号:EP3634728A1
公开(公告)日:2020-04-15
申请号:EP17919018.6
申请日:2017-07-28
Applicant: Hewlett-Packard Development Company, L.P.
Inventor: SCHALK, Wesley R. , ENGLISH, Kris M. , ROMAN, Justin M. , SWIER, Kevin E. , OTIS, JR., David R.
IPC: B29C64/321 , B29C64/357 , B33Y40/00
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公开(公告)号:EP3197685A1
公开(公告)日:2017-08-02
申请号:EP14902466.3
申请日:2014-09-22
Applicant: Hewlett-Packard Development Company, L.P.
Inventor: SING, Samrin , BINGHAM, Jeffrey G. , ROMAN, Justin M.
CPC classification number: B41J25/34 , B41J2/175 , B41J2/17523 , B41J2/17553 , B41J29/38
Abstract: Examples of a mounting device and method are disclosed herein. An example of the mounting device includes a carriage to hold printhead assembly and an interconnect assembly to supply printing composition to the printhead assembly. The mounting device also includes a first latching assembly having an engaged condition to lock the interconnect assembly to a manifold of the printhead assembly and a disengaged condition to unlock the interconnect assembly from the manifold of the printhead assembly. The mounting device additionally includes a second latching assembly having an engaged condition to lock the printhead assembly to the carriage and a disengaged condition to unlock the printhead assembly from the carriage. In this example of the mounting device, the second latching assembly cannot be moved from the engaged condition to the disengaged condition unless the fast latching assembly is in the disengaged condition.
Abstract translation: 本文公开了安装装置和方法的示例。 安装装置的示例包括托架以保持打印头组件和互连组件以将打印组合物供应到打印头组件。 所述安装装置还包括第一闩锁组件,所述第一闩锁组件具有将所述互连组件锁定到所述打印头组件的接合状态以及将所述互连组件从所述打印头组件的歧管解锁的脱离状态。 安装装置另外包括第二闩锁组件,该第二闩锁组件具有将打印头组件锁定到滑架的接合状态和将打印头组件从滑架解锁的脱离状态。 在该安装装置的实例中,除非第一闩锁组件处于脱离状态,否则第二闩锁组件不能从接合状态移动到脱离状态。
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公开(公告)号:EP3774294A1
公开(公告)日:2021-02-17
申请号:EP18935281.8
申请日:2018-09-28
Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Inventor: WEST, Randall , ROMAN, Justin M. , LAWS, Alexander David , BERGESON, Jeffrey , HULICK, Kevin
IPC: B29C64/329 , B29C64/393 , B29C64/141 , B33Y30/00 , B33Y10/00 , B33Y40/00 , B33Y50/02
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公开(公告)号:EP3713742A1
公开(公告)日:2020-09-30
申请号:EP18913884.5
申请日:2018-04-06
Applicant: Hewlett-Packard Development Company, L.P.
IPC: B29C64/20 , B33Y30/00 , B29C64/393 , B33Y50/02 , B29C64/357
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公开(公告)号:EP3565706A1
公开(公告)日:2019-11-13
申请号:EP17907113.9
申请日:2017-04-24
Applicant: Hewlett-Packard Development Company, L.P.
Inventor: DUDA, Michael , ROMAN, Justin M. , PICKARD, Joel V.
IPC: B29C64/153 , B29C64/20 , B29C64/227 , B33Y30/00 , B33Y80/00
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公开(公告)号:EP3426463A1
公开(公告)日:2019-01-16
申请号:EP16901892.6
申请日:2016-09-06
Applicant: Hewlett-Packard Development Company, L.P.
Inventor: ROMAN, Justin M. , ALONSO BECERRO, Xavier , CHANCLON FERNANDEZ, Ismael
IPC: B29C64/141 , B29C64/227 , B29C64/255 , B29C64/314 , B29C67/04 , B33Y40/00 , B65G53/10
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公开(公告)号:EP3212413A1
公开(公告)日:2017-09-06
申请号:EP14904781.3
申请日:2014-10-31
Applicant: Hewlett-Packard Development Company, L.P.
Inventor: VALLE DE LA MUNOZA, Cristina , WAGNER, Jeffrey A. , ROMAN, Justin M.
CPC classification number: B41J2/04535 , B41J2/04563 , B41J2/04586 , B41J2/175 , B41J19/202 , B41J25/003 , B41J29/38
Abstract: Ambient temperature based flow rates can in an example include a setting a flow rate of ink to a printhead mounted in a carriage based on an ambient temperature associated with the printhead, measuring a flow rate of ink to the printhead, and causing a decrease in a velocity of the carriage in response to the flow rate of ink satisfying the threshold flow rate.
Abstract translation: 在一个示例中,基于环境温度的流率可以包括:基于与打印头相关联的环境温度来设置到安装在滑架中的打印头的墨水的流速,测量到打印头的墨水的流速,并且导致 响应满足阈值流量的墨水流量,滑架的速度。
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公开(公告)号:EP3615302A1
公开(公告)日:2020-03-04
申请号:EP17918932.9
申请日:2017-07-28
Applicant: Hewlett-Packard Development Company, L.P.
Inventor: SCHALK, Wesley R. , ENGLISH, Kris M. , ROMAN, Justin M. , SWIER, Kevin E.
IPC: B29C64/153 , B29C64/329 , B29C64/357 , B33Y10/00 , B33Y40/00
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