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公开(公告)号:US20190119104A1
公开(公告)日:2019-04-25
申请号:US16094287
申请日:2016-07-13
Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Inventor: Chien-Hua Chen , Devin Alexander Mourey , Michael W. Cumbie , Si-lam J. Choy
Abstract: One example provides a microelectromechanical systems (MEMS) device that includes a number of silicon die over-molded with an overmold material, a number of active areas formed on the silicon die, the active areas including at least one sensor to sense a number of attributes of a fluid introduced to the at least one sensor, and a fan-out layer coupled to the silicon die, the fan-out layer including a number of fluid channels formed therein that interface with active areas of the silicon die and allow the fluid to flow to the at least one sensor.
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公开(公告)号:US20180264834A1
公开(公告)日:2018-09-20
申请号:US15988206
申请日:2018-05-24
Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Inventor: Chien-Hua Chen , Michael W. Cumbie , Devin Alexander Mourey
CPC classification number: B41J2/17553 , B41J2/14145 , B41J2/1601 , B41J2/1623 , B41J2/17513 , B41J2/17559 , B41J2002/14362
Abstract: An ink delivery device is described. The ink delivery device includes an ink die with a first surface. The ink delivery device also includes an overmold to encapsulate a number of surfaces of the ink die. The overmold has a second surface that is wider than the first surface. The second surface receives an adhesive to attach the ink delivery device to a printhead. The ink delivery device also includes an ink slot passing through the overmold and at least a portion of the ink die.
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公开(公告)号:US10029467B2
公开(公告)日:2018-07-24
申请号:US14770608
申请日:2013-09-27
Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Inventor: Silam J. Choy , Michael W. Cumbie , Devin Alexander Mourey , Chien-Hua Chen
Abstract: In one example, a printhead includes: a printhead die having a front face along which fluid may be dispensed from the die, the die molded into a monolithic molding having a channel therein through which fluid may pass directly to a back part of the die, the front face of the die exposed outside the molding and the back part of the die covered by the molding except at the channel; an electrical contact exposed outside the molding to connect to circuitry external to the printhead; a printed circuit board molded into the molding, the printed circuit board having an exposed front face co-planar with and surrounding the exposed front face of the die and a conductor electrically connected to the contact; and an electrical connection between the die and the printed circuit board conductor fully encapsulated in the molding.
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公开(公告)号:US20170120596A1
公开(公告)日:2017-05-04
申请号:US15122701
申请日:2014-03-31
Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Inventor: Chien-Hua CHEN , Michael W Cumbie , Devin Alexander Mourey
IPC: B41J2/16 , B23K26/402 , B24C1/04 , B29C69/00
CPC classification number: B41J2/1637 , B23K26/402 , B24C1/04 , B29C69/001 , B29L2031/767 , B41J2/1603 , B41J2/162 , B41J2/1632 , B41J2/1639 , B41J2/1752
Abstract: In an example, a method for making a fluid ejection apparatus may include forming a molding material over a fluid passage on a back surface of printhead die, embedding the printhead die in an encapsulant in a cavity in a printed circuit board such that at least one drop ejector of the printhead die is exposed at a front side of the printed circuit board, removing the encapsulant at a back side of the printed circuit board to expose the molding material, and removing the molding material to form a fluid feed slot through which fluid may flow to the fluid passage opening in the printhead die.
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公开(公告)号:US11090929B2
公开(公告)日:2021-08-17
申请号:US16092978
申请日:2016-07-21
Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Inventor: Chien-Hua Chen , Michael W. Cumbie , Devin Alexander Mourey
Abstract: A printhead may include a nozzle, a firing chamber fluidly coupled to the nozzle, a printing fluid slot fluidly coupled to the firing chamber, and a sensor to detect a plurality of complex impedance values of a printing fluid at the printhead over a plurality of frequencies and create a printing fluid signature of the printing fluid. A method of determining at least one characteristic of a printing fluid provided to a printhead ma include, with a number of sensors, applying an alternating current at a plurality of frequencies over time to the printing fluid to receive a plurality of complex impedance values and comparing the plurality of complex impedance signals to a number of stored signals.
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公开(公告)号:US10479085B2
公开(公告)日:2019-11-19
申请号:US15749399
申请日:2015-10-21
Applicant: Hewlett-Packard Development Company, L.P.
Inventor: Devin Alexander Mourey , Chien-Hua Chen , Michael W. Cumbie
Abstract: In one example, a method for fabricating a printhead is described. The method may include applying an electrical interconnect between a printhead die and an electrical fan out structure embedded in a molding of a printhead via a direct patterning additive process. The method may further include applying a passivation layer over the electrical interconnect as a dry film laminate.
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公开(公告)号:US20190135615A1
公开(公告)日:2019-05-09
申请号:US16099020
申请日:2016-07-12
Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Inventor: Si-lam J. Choy , Chien-Hua Chen , Michael W. Cumbie , Devin Alexander Mourey
Abstract: A composite wafer includes a first silicon die with a first top surface; and a polymer substrate with a top surface and a bottom surface. The silicon die is embedded in the polymer substrate such that the top surface of the substrate and the first top surface of the first silicon die are coplanar and the bottom surface of the polymer substrate is planar.
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公开(公告)号:US20190119723A1
公开(公告)日:2019-04-25
申请号:US16094360
申请日:2016-07-22
Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Inventor: Michael W. Cumbie , Devin Alexander Mourey , Si-lam Choy
IPC: C12Q1/6806 , C12Q1/686 , B01L3/00 , B01L3/02
Abstract: A method of preparing a sample may include depositing an aqueous solution comprising copies of a primer into a layer of hydrophobic liquid on a substrate with a thermal inkjet device. A sample may include: a substrate; a layer of hydrophobic liquid on the substrate, the layer of hydrophobic liquid comprising a plurality of droplets of aqueous solution distributed in the layer, wherein the plurality of droplets contain: primers; a polymerase enzyme; deoxynucleotide triphosphates (dNTPs); and a target sequence for replication; and a cover, the cover contacting and covering the layer of hydrophobic liquid.
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公开(公告)号:US10207500B2
公开(公告)日:2019-02-19
申请号:US15748856
申请日:2015-10-15
Applicant: Hewlett-Packard Development Company, L.P.
Inventor: Michael W. Cumbie , Devin Alexander Mourey , Chien-Hua Chen
Abstract: In example implementations, an apparatus with an interposer is provided. The apparatus may include an epoxy molded compound (EMC). A print head die and a drive integrated circuit (IC) may be embedded in the EMC. An interposer may also be embedded in the EMC. The print head die, the drive IC and the interposer may be wire bonded within the EMC.
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公开(公告)号:US20180304633A1
公开(公告)日:2018-10-25
申请号:US16025222
申请日:2018-07-02
Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Inventor: Silam J. Choy , Michael W. Cumbie , Devin Alexander Mourey , Chien-Hua Chen
CPC classification number: B41J2/1637 , B41J2/14 , B41J2/14072 , B41J2/14145 , B41J2/1433 , B41J2/155 , B41J2/16 , B41J2/1601 , B41J2/1603 , B41J2/1607 , B41J2/1628 , B41J2/17526 , B41J2/17553 , B41J2002/14362 , B41J2002/14419 , B41J2002/14491 , B41J2202/19 , B41J2202/20
Abstract: In some examples, a print bar fabrication method comprises placing printhead dies face down on a carrier, placing a printed circuit board on the carrier, wire bonding each printhead die of the printhead dies to the printed circuit board, and overmolding the printhead dies and the printed circuit board on the carrier, including fully encapsulating the wire bonds.
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