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    Transmission of data over conducting wires
    31.
    发明授权
    Transmission of data over conducting wires 有权

    公开(公告)号：US11450936B2

    公开(公告)日：2022-09-20

    申请号：US16948578

    申请日：2020-09-24

    Applicant: Intel Corporation

    Inventor： Ramaswamy Parthasarathy ,  Punit Ashok Rathod ,  Jayprakash Thakur ,  Arvind Sundaram ,  Ajay Sharma ,  Nikita Bipin Ambasana ,  Satish Ramachandra ,  Vishram Shriram Pandit

    IPC: H01P3/12 ,  H04B3/52

    Abstract: A communication system communicates data elements on a conducting wire. In an embodiment, a sequence of data elements to be transmitted is electrically represented on a pair of terminals, and a transmission element located at a first portion of the conducting wire transmits the sequence in the form of a wave on a surface of the conducting wire. The transmission element includes a first conductor wrapped around the first portion of the conducting wire, a first insulator located between the first conductor and the first portion of the conducting wire, and a conductive structure disposed around the first conductor. The conductive structure has a narrow cross section at one end and extends outwardly to a broader cross section at the other end. A first terminal of the pair of terminals is electrically connected to the first conductor and the second terminal is electrically connected to the conductive structure.

    Low-profile transformer and method of making same
    35.
    发明授权
    Low-profile transformer and method of making same 有权

    公开(公告)号：US10236111B2

    公开(公告)日：2019-03-19

    申请号：US15486176

    申请日：2017-04-12

    Applicant: Intel Corporation

    Inventor： Arvind Sundaram

    IPC: H01F5/00 ,  H01F17/04 ,  H01F27/28 ,  H01F27/24 ,  H01F41/098 ,  H01F41/02 ,  H05K5/00 ,  G06F1/16

    Abstract: Techniques and mechanisms for delivering power with a transformer. In an embodiment, the transformer comprises a dielectric slab structure, a first conductor, a layer of ferromagnetic material disposed around first windings of the first conductor, and a second conductor which forms second windings around the layer of ferromagnetic material. For one of the first windings or one of the second windings, a cross-section of the winding conforms to a rectangle, wherein a width of the cross-section which is more than a height of the cross-section. A ferromagnetic material of the ferrite layer extends between successive ones of the first windings. In another embodiment, a volume fraction of the ferromagnetic material in the ferrite layer is equal to or less than ninety seven percent (97%).

    Method, device and system for facilitating heat dissipation from a circuit assembly
    36.
    发明授权
    Method, device and system for facilitating heat dissipation from a circuit assembly 有权

    公开(公告)号：US10076021B1

    公开(公告)日：2018-09-11

    申请号：US15486194

    申请日：2017-04-12

    Applicant: Intel Corporation

    Inventor： Arvind Sundaram

    IPC: H05K1/02 ,  H05K1/18 ,  H05K7/20 ,  G06F1/20

    Abstract: Techniques and mechanisms for providing efficient heat dissipation by a circuit assembly. In an embodiment, the circuit assembly includes an inductor and a packaged device coupled thereto, where the inductor forms heat dissipation structures on various respective sides of a ferromagnetic body. The packaged assembly includes a circuit board disposed in a mold material, where a metal core of the circuit board is thermally coupled to transfer heat from one or more circuit components of the packaged device to the inductor via one or more conductors extending from the package mold. In another embodiment, portions of the metal core have different respective vertical spans which contribute to different thermal conductivity characteristics across various regions of the circuit board.

    Free air intrasystem interconnect
    38.
    发明授权
    Free air intrasystem interconnect 有权

    公开(公告)号：US11726278B2

    公开(公告)日：2023-08-15

    申请号：US17685922

    申请日：2022-03-03

    Applicant: Intel Corporation

    Inventor： Arvind Sundaram

    IPC: G02B6/42

    CPC classification number: G02B6/4246 ,  G02B6/421 ,  G02B6/4204 ,  G02B6/4257

    Abstract: This document discusses, among other things, systems and methods to transmit laser energy to a first hollow-core transmission medium of a board, and to detect laser energy from a second hollow-core transmission medium of the board using a photodiode of the communication interface. A system can include a communication interface configured to be coupled to a chip carrier, the communication interface including a laser emitter configured to transmit laser energy to a first hollow-core transmission medium of a board, and a photodiode configured to detect laser energy communicated from a second hollow-core transmission. The system can further include the chip carrier and the board, as well as one or more alignment features to position the laser emitter and the photodiode over inputs of the first and second hollow-core transmission mediums, and an optically clear resin optionally between the communication interface and the board.

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