公开(公告)号：US20100308204A1

公开(公告)日：2010-12-09

申请号：US12675537

申请日：2009-02-09

Applicant: Jun Taniguchi

Inventor： Jun Taniguchi

IPC: B29C33/56 ,  B28B7/36

CPC classification number: H05K3/205 ,  C23C4/185 ,  C23C14/0005 ,  C23C14/025 ,  C23C14/16 ,  C23C26/00 ,  H05K3/20 ,  H05K2203/0108 ,  H05K2203/1152

Abstract: The invention provides is a process for producing a structure (22) with a metal film, including the steps of preparing a mother die (10) in which a first metal film (16) is formed on the surface of a base (12) on which a concave and convex pattern (14) is formed, forming a second metal film (18) on the first metal film (16), adhering a support member (20) to the second metal film (18), and separating the second metal film (18) to which the concave and convex pattern has been transferred to the second metal film (18) together with the support member from the first metal film (16). Preferably, the first metal film (16) is a film containing Cr and Al, and the second metal film (18) is a film containing at least one metal selected from the group consisting of Au, Ag, Cu, Al, and Pt.

Abstract translation: 本发明提供了一种用金属膜制造结构（22）的方法，包括以下步骤：制备母模（10），其中第一金属膜（16）形成在基底（12）的表面上， 形成凹凸图案（14），在第一金属膜（16）上形成第二金属膜（18），将支撑构件（20）粘附到第二金属膜（18）上，并将第二金属 其中凹凸图案已经与第一金属膜（16）与支撑构件一起被转印到第二金属膜（18）上的膜（18）。 优选地，第一金属膜（16）是含有Cr和Al的膜，第二金属膜（18）是含有选自Au，Ag，Cu，Al和Pt中的至少一种金属的膜。

公开(公告)号：US07551435B2

公开(公告)日：2009-06-23

申请号：US11898254

申请日：2007-09-11

Applicant: Jun Taniguchi ,  Hiroki Uchida ,  Hideshi Tokuhira ,  Minoru Ishinabe ,  Masanobu Ishiduka ,  Hiroaki Date ,  Masatomo Asano ,  Nobuhiro Nanri

Inventor： Jun Taniguchi ,  Hiroki Uchida ,  Hideshi Tokuhira ,  Minoru Ishinabe ,  Masanobu Ishiduka ,  Hiroaki Date ,  Masatomo Asano ,  Nobuhiro Nanri

IPC: H05K7/20 ,  H01L23/36

CPC classification number: H01L23/473 ,  G06F1/203 ,  G06F2200/201 ,  H01L2924/0002 ,  H01L2924/00

Abstract: Electronic components differing in height (a CPU 2a, a capacitor 2b, and coil elements 2c) are mounted on a printed circuit board 1. A heat-absorbing member 3 is provided above the printed circuit board 1 in such a way that the member 3 contacts not only the top surface of the CPU 2a that is the shortest but the sides of the capacitor 2b and the coil elements 2c. To circulate a cooling medium, a flow path 4 is formed in the heat-absorbing member 3. Heat generated at the CPU 2a is transmitted from its top surface to the cooling medium in the flow path 4 via the heat-absorbing member 3; heat generated at the capacitor 2b and the coil elements 2c is transmitted from their sides to the cooling medium in the flow path 4 via the heat-absorbing member 3.

Abstract translation: 高度不同的电子元件（CPU2a，电容器2b和线圈元件2c）安装在印刷电路板1上。在印刷电路板1的上方设有吸热元件3，使得元件3 不仅接触CPU 2a的最短但电容器2b和线圈元件2c的侧面的顶表面。 为了循环冷却介质，在吸热部件3中形成有流路4.在CPU2a产生的热量经由吸热部件3从流路4的顶面向冷却介质传递。 在电容器2b和线圈元件2c处产生的热量经由吸热构件3从侧面传递到流路4中的冷却介质。

公开(公告)号：US07502227B2

公开(公告)日：2009-03-10

申请号：US11085483

申请日：2005-03-22

Applicant: Hiroki Uchida ,  Jun Taniguchi ,  Hideshi Tokuhira ,  Minoru Ishinabe ,  Masanobu Ishiduka ,  Hiroaki Date

Inventor： Hiroki Uchida ,  Jun Taniguchi ,  Hideshi Tokuhira ,  Minoru Ishinabe ,  Masanobu Ishiduka ,  Hiroaki Date

IPC: H05K7/20

CPC classification number: G06F1/203 ,  G06F2200/201

Abstract: A body flow path in a first housing having an MPU element communicates with an inner flow path and outer flow path formed in an inner heat-dissipating board and an outer heat-dissipating board, respectively, and a pump drives a cooling liquid to circulate in these flow paths. A beam is arranged between a pivot provided in a second housing and a pivot provided in the inner heat-dissipating board, a beam is arranged between the pivot of the inner heat-dissipating board and a pivot provided in the outer heat-dissipating board, and the inner heat-dissipating board and the outer heat-dissipating board are movable to the second housing. According to the operation of opening the second housing, a distance between the second housing and the inner heat-dissipating board, and a distance between the inner flow path and the outer flow path are increased.

Abstract translation: 具有MPU元件的第一壳体中的主体流动路径分别与形成在内部散热板和外部散热板中的内部流路和外部流路连通，并且泵驱动冷却液体在 这些流路。 在设置在第二壳体中的枢轴和设置在内部散热板中的枢轴之间布置有梁，在内部散热板的枢轴与设置在外部散热板中的枢轴之间布置有梁， 并且内部散热板和外部散热板可移动到第二壳体。 根据打开第二壳体的操作，第二壳体和内部散热板之间的距离以及内部流路和外部流路之间的距离增加。

公开(公告)号：US20090052135A1

公开(公告)日：2009-02-26

申请号：US12251172

申请日：2008-10-14

Applicant: Hiroki UCHIDA ,  Jun Taniguchi ,  Hideshi Tokuhira ,  Minoru Ishinabe ,  Masanobu Ishiduka ,  Hiroaki Date

Inventor： Hiroki UCHIDA ,  Jun Taniguchi ,  Hideshi Tokuhira ,  Minoru Ishinabe ,  Masanobu Ishiduka ,  Hiroaki Date

IPC: H05K7/20

CPC classification number: G06F1/203 ,  G06F2200/201

Abstract: A body flow path in a first housing having an MPU element communicates with an inner flow path and outer flow path formed in an inner heat-dissipating board and an outer heat-dissipating board, respectively, and a pump drives a cooling liquid to circulate in these flow paths. A beam is arranged between a pivot provided in a second housing and a pivot provided in the inner heat-dissipating board, a beam is arranged between the pivot of the inner heat-dissipating board and a pivot provided in the outer heat-dissipating board, and the inner heat-dissipating board and the outer heat-dissipating board are movable to the second housing. According to the operation of opening the second housing, a distance between the second housing and the inner heat-dissipating board, and a distance between the inner flow path and the outer flow path are increased.

Abstract translation: 具有MPU元件的第一壳体中的主体流动路径分别与形成在内部散热板和外部散热板中的内部流路和外部流路连通，并且泵驱动冷却液体在 这些流路。 在设置在第二壳体中的枢轴和设置在内部散热板中的枢轴之间布置有梁，在内部散热板的枢轴与设置在外部散热板中的枢轴之间布置有梁， 并且内部散热板和外部散热板可移动到第二壳体。 根据打开第二壳体的操作，第二壳体和内部散热板之间的距离以及内部流路和外部流路之间的距离增加。

公开(公告)号：US20060151435A1

公开(公告)日：2006-07-13

申请号：US10528480

申请日：2003-09-18

Applicant: Jun Taniguchi

Inventor： Jun Taniguchi

IPC: C03C15/00

CPC classification number: G03F7/32 ,  C03C17/002 ,  C03C17/34 ,  C03C2217/42 ,  C03C2217/475 ,  C03C2218/32 ,  C03C2218/33 ,  G03F7/0017 ,  G03F7/0043 ,  G03F7/0757 ,  G03F7/2059 ,  H01L21/31133

Abstract: This invention relates to an efficient surface processing method. In one embodiment of the invention, a laminated body 4 comprising a sample material 1, an intermediate layer 2 formed on a surface of the sample material 1, and an SOG layer 3 formed on the surface of the intermediate layer 2 is used. First, the surface of the SOG layer 3 is irradiated with an electron beam so as to expose part of the SOG layer. Next, exposed parts 31 of the SOG layer 3 are eliminated by etching. As a result, finely detailed unevenness can be formed at the surface of the SOG layer 3. The depth of the exposed parts 31 can be controlled by changing the acceleration voltage of the electron beam. It is therefore possible to form three-dimensional shapes of different depths. After forming unevenness at the surface of the SOG layer 3, the intermediate layer 2 and the sample material 1 can be eliminated in order using, for example, an oxygen ion beam. As a result, the same unevenness as at the surface of the SOG layer 3 can be formed at the surface of the sample material 1.

Abstract translation: 本发明涉及一种有效的表面处理方法。 在本发明的一个实施例中，使用包括样品材料1的层叠体4，在样品材料1的表面上形成的中间层2和形成在中间层2的表面上的SOG层3。 首先，用电子束照射SOG层3的表面，以暴露部分SOG层。 接下来，通过蚀刻来消除SOG层3的暴露部分31。 结果，可以在SOG层3的表面形成精细的不均匀性。可以通过改变电子束的加速电压来控制暴露部分31的深度。 因此，可以形成不同深度的三维形状。 在SOG层3的表面形成不均匀之后，可以使用例如氧离子束的顺序消除中间层2和样品材料1。 结果，可以在样品材料1的表面形成与SOG层3的表面相同的不均匀性。

公开(公告)号：US06825571B2

公开(公告)日：2004-11-30

申请号：US10368092

申请日：2003-02-18

Applicant: Jun Taniguchi

Inventor： Jun Taniguchi

IPC: H01L2348

CPC classification number: H01L23/562 ,  H01L23/16 ,  H01L23/3128 ,  H01L23/49861 ,  H01L24/48 ,  H01L2224/05599 ,  H01L2224/32225 ,  H01L2224/45099 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/73265 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/14 ,  H01L2924/15183 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2924/00012

Abstract: A raised portion 12 is formed on a substrate 10. The raised portion consists of a raised support pattern that preferably includes a wiring pattern. A sheet 30 is supported by the top surfaces of the raised support pattern such that the sheet is maintained apart from the base surface of the substrate 10. A semiconductor die 40 is adhered onto the sheet 30 using an adhesive agent 42. A sealant is used to create a sealed portion 50 that seals the semiconductor die 40 on the sheet 30. The sheet 30 has gas permeable region at least at a location accessible by the adhesive agent.

Abstract translation: 凸起部分12形成在基板10上。凸起部分由优选包括布线图案的凸起的支撑图案组成。 片材30由凸起的支撑图案的顶表面支撑，使得片材保持与衬底10的基面分离。使用粘合剂42将半导体管芯40粘附到片材30上。使用密封剂 以形成密封片30上的半导体管芯40的密封部分50.片材30至少在粘合剂可接近的位置处具有透气区域。

公开(公告)号：US4738408A

公开(公告)日：1988-04-19

申请号：US895659

申请日：1986-08-12

Applicant: Toshiya Odaka ,  Kouichi Sota ,  Jun Taniguchi ,  Hiroshi Yamaguchi

Inventor： Toshiya Odaka ,  Kouichi Sota ,  Jun Taniguchi ,  Hiroshi Yamaguchi

IPC: B65H18/08 ,  G11B23/107 ,  G11B23/113 ,  B65H75/28 ,  G03B1/04 ,  G11B15/32

CPC classification number: G11B23/113

Abstract: A tape winding apparatus for winding tape supplied from a tape reel mounted upon a supply reel base onto at least one empty takeup reel contained in a cartridge case having an opening at a part thereof, comprises a cartridge holder for holding and positioning the cartridge case, a winding shaft for revolving the takeup reel of the cartridge case, a tape retainer capable of retaining a beginning portion of the tape, the tape retainer bringing the beginning portion of the tape from within the vicinity of the opening provided on the cartridge case to the interior of the cartridge case close to the takeup reel, while holding the beginning portion of the tape, and a coating arrangement for applying an adhesive to the beginning portion of the tape retained on the tape retainer, whereby securing of the tape to the takeup reel can be achieved. A tape winding method comprises the steps of positioning the cartridge case, applying an adhesive to the beginning portion of the tape retained upon the tape retainer, thereby adhering the tape to the takeup reel, bringing the beginning portion of the tape from the opening provided on the cartridge case to the interior of the cartridge case close to the takeup reel, securing the beginning portion of the tape to the takeup reel, and revolving the takeup reel.

Abstract translation: 一种用于将从安装在供带盘基座上的带盘提供的带卷的带卷绕装置包括在其一部分具有开口的盒壳中的至少一个空卷绕卷轴上，包括用于保持和定位盒壳体的盒保持器， 用于旋转盒壳的卷取卷轴的卷绕轴，能够保持带的开始部分的带保持器，带保持器将带的开始部分从设置在盒壳体上的开口附近带到 盒壳体的内部靠近收紧卷轴，同时保持带的开始部分，以及用于将粘合剂施加到保持在带保持器上的带的开始部分的涂布装置，由此将带固定到卷取卷轴 可以实现。 磁带缠绕方法包括以下步骤：定位盒壳体，将粘合剂施加到保持在带保持器上的带的开始部分，从而将带子粘附到卷取卷轴上，使带的开始部分从设置在其上的开口 盒壳体到盒壳体的内部靠近卷绕卷轴，将带的开始部分固定到卷取卷轴上，并使卷取卷轴旋转。