公开(公告)号：US20130170796A1

公开(公告)日：2013-07-04

申请号：US13592627

申请日：2012-08-23

Applicant: KAI-WEN WU

Inventor： KAI-WEN WU

IPC: G02B6/38

CPC classification number: G02B6/32 ,  G02B6/3825 ,  G02B6/3839 ,  G02B6/3846 ,  G02B6/3869 ,  G02B6/3878 ,  G02B6/3882 ,  G02B6/3885

Abstract: An optical fiber coupler includes a male port and a female port. The male port includes a main body, the male transmission lens and the male receiving lens positioned on the main body, and a male optical wave guide assembly. The male base board includes at least one male optical wave guide. Each male optical wave guide includes a male first alignment portion and a male second alignment portion. The male first alignment portion is optically coupled with one male receiving lens; and a male second alignment portion has a greater width than that of the male first alignment portion. The structure of the female port is similar to the male port.

Abstract translation: 光纤耦合器包括公端口和母端口。 阳端口包括主体，位于主体上的阳传播透镜和阳接收透镜，以及阳光导引组件。 阳基板包括至少一个公光导波。 每个阳光波导包括阳第一对准部分和阳第二对准部分。 阳性第一对准部分与一个阳接收透镜光学耦合; 并且阳性第二对准部分的宽度大于阳性第一对准部分的宽度。 女性港口的结构与男性港口相似。

公开(公告)号：US20130136395A1

公开(公告)日：2013-05-30

申请号：US13314192

申请日：2011-12-08

Applicant: KAI-WEN WU

Inventor： KAI-WEN WU

IPC: G02B6/26

CPC classification number: G02B6/4201

Abstract: An optical fiber transmitting system including a first Optical/Electrical (O/E) module, a first interface, a second interface, a fiber cable and a second Optical/Electrical (O/E) module is provided. The first O/E module includes a laser diode (LD) configured to emit laser optical signals. The fiber cable includes two pieces of optical fiber and a third piece of optical fiber for transmitting the laser optical signals to the second O/E module via the first interface and the second interface. The second O/E module includes a photo-detector (PD) configured to convert the laser optical signals into electronic signals to supply power energy to a peripheral device.

Abstract translation: 提供了包括第一光/电（O / E）模块，第一接口，第二接口，光缆和第二光/电（O / E）模块的光纤传输系统。 第一个O / E模块包括配置为发射激光光信号的激光二极管（LD）。 光缆包括两条光纤和第三条光纤，用于经由第一接口和第二接口将激光光信号传输到第二O / E模块。 第二O / E模块包括被配置为将激光光信号转换为电子信号以向外围设备供电的光检测器（PD）。

公开(公告)号：US20130121649A1

公开(公告)日：2013-05-16

申请号：US13336011

申请日：2011-12-23

Applicant: KAI-WEN WU ,  YI-ZHONG SHEU

Inventor： KAI-WEN WU ,  YI-ZHONG SHEU

IPC: G02B6/36

CPC classification number: G02B6/4292 ,  G02B6/3817

Abstract: An optical fiber connector includes a body, a photoelectric conversion module received in the body, a receiving member, and two L-shaped optical fibers. The photoelectric conversion module includes a base, a light emitting unit, and a light receiving unit. The light emitting unit and the light receiving unit are mounted on the base. The receiving member is disposed over the light emitting unit and the light receiving unit and defines two L-shaped receiving holes. The optical fibers are received in the respective receiving holes. One end of one of the two optical fibers is optically aligned and coupled with the light emitting unit. One end of the other optical fiber is optically aligned and coupled with the light receiving unit.

Abstract translation: 光纤连接器包括主体，容纳在主体中的光电转换模块，接收构件和两个L形光纤。 光电转换模块包括基座，发光单元和光接收单元。 发光单元和光接收单元安装在基座上。 接收构件设置在发光单元和光接收单元之上并且限定两个L形接收孔。 光纤被容纳在相应的接收孔中。 两个光纤中的一个的一端光学对准并与发光单元耦合。 另一光纤的一端光学对准并与光接收单元耦合。

公开(公告)号：US20130010444A1

公开(公告)日：2013-01-10

申请号：US13220715

申请日：2011-08-30

Applicant: KAI-WEN WU

Inventor： KAI-WEN WU

IPC: H05K1/18

CPC classification number: H05K3/284 ,  H01L23/047 ,  H01L33/62 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/49175 ,  H01L2224/8592 ,  H01L2924/3011 ,  H01L2924/3025 ,  H05K1/0207 ,  H05K2201/10106 ,  H05K2201/10977 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A chip package includes a circuit board, a chip, and wires. The circuit board includes a metal layer, a middle layer formed on the metal layer, and a wire pattern layer formed on the middle layer. The metal layer is configured to be grounded. A through hole is defined through the wire pattern layer and the middle layer to expose the metal layer. The chip is mounted on the metal layer and received in the through hole. The wires interconnect the chip and the wire pattern layer.

Abstract translation: 芯片封装包括电路板，芯片和电线。 电路板包括金属层，形成在金属层上的中间层和形成在中间层上的引线图案层。 金属层被配置为接地。 通过线图案层和中间层限定通孔以暴露金属层。 芯片安装在金属层上并被接纳在通孔中。 导线将芯片和导线图案层互连。