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    Virtual inspection systems for process window characterization
    31.
    发明授权
    Virtual inspection systems for process window characterization 有权

    公开(公告)号：US10402461B2

    公开(公告)日：2019-09-03

    申请号：US14946777

    申请日：2015-11-20

    Applicant: KLA-Tencor Corporation

    Inventor： Laurent Karsenti ,  Kris Bhaskar ,  Mark Wagner ,  Brian Duffy ,  Vijayakumar Ramachandran

    IPC: G06T1/00 ,  G06T7/00 ,  H04N7/18 ,  H04L29/08 ,  G06F16/9535

    Abstract: Methods and systems for detecting defects on a specimen are provided. One system includes a storage medium configured for storing images for a physical version of a specimen generated by an inspection system. At least two dies are formed on the specimen with different values of one or more parameters of a fabrication process performed on the specimen. The system also includes computer subsystem(s) configured for comparing portions of the stored images generated at locations on the specimen at which patterns having the same as-designed characteristics are formed with at least two of the different values. The portions of the stored images that are compared are not constrained by locations of the dies on the specimen, locations of the patterns within the dies, or locations of the patterns on the specimen. The computer subsystem(s) are also configured for detecting defects at the locations based on results of the comparing.

    Method and system for universal target based inspection and metrology
    37.
    发明授权
    Method and system for universal target based inspection and metrology 有权
    通用目标检测和计量方法与系统

    公开(公告)号：US09576861B2

    公开(公告)日：2017-02-21

    申请号：US14083126

    申请日：2013-11-18

    Applicant: KLA-Tencor Corporation

    Inventor： Allen Park ,  Ellis Chang ,  Michael Adel ,  Kris Bhaskar ,  Ady Levy ,  Amir Widmann ,  Mark Wagner ,  Songnian Rong

    IPC: G06F17/50 ,  H01L21/66

    CPC classification number: H01L22/12 ,  G06F17/5081

    Abstract: Universal target based inspection drive metrology includes designing a plurality of universal metrology targets measurable with an inspection tool and measurable with a metrology tool, identifying a plurality of inspectable features within at least one die of a wafer using design data, disposing the plurality of universal targets within the at least one die of the wafer, each universal target being disposed at least proximate to one of the identified inspectable features, inspecting a region containing one or more of the universal targets with an inspection tool, identifying one or more anomalistic universal targets in the inspected region with an inspection tool and, responsive to the identification of one or more anomalistic universal targets in the inspected region, performing one or more metrology processes on the one or more anomalistic universal metrology targets with the metrology tool.

    Abstract translation: 通用的基于目标的检测驱动度量包括设计多个通过检测工具测量的通用度量目标并且可以用计量工具测量，使用设计数据识别晶片的至少一个管芯内的多个检查特征，将多个通用目标 在晶片的至少一个模具内，每个通用目标被设置为至少接近所识别的可检查特征之一，用检查工具检查包含一个或多个通用目标的区域，以识别一个或多个异常通用目标 检查区域具有检查工具，并且响应于在被检查区域中识别一个或多个异常通用目标，对所述一个或多个异常通用度量目标与计量工具执行一个或多个计量过程。

    Inspection Recipe Setup from Reference Image Variation
    38.
    发明申请
    Inspection Recipe Setup from Reference Image Variation 有权
    参考图像变化检查配方设置

    公开(公告)号：US20150324964A1

    公开(公告)日：2015-11-12

    申请号：US14707573

    申请日：2015-05-08

    Applicant: KLA-Tencor Corporation

    Inventor： Eugene Shifrin ,  Chetana Bhaskar ,  Ashok V. Kulkarni ,  Chien-Huei (Adam) Chen ,  Kris Bhaskar ,  Brian Duffy

    IPC: G06T7/00

    CPC classification number: G06T7/001 ,  G06T2200/28 ,  G06T2207/30148

    Abstract: Systems and methods for generating information for use in a wafer inspection process are provided. One method includes acquiring output of an inspection system for die(s) located on wafer(s), combining the output for the die(s) based on within die positions of the output, determining, on a within die position basis, a statistical property of variation in values of characteristic(s) of the combined output, and assigning the within die positions to different groups based on the statistical properties determined for the within die positions. The method also includes storing information for the within die positions and the different groups to which the within die positions are assigned in a storage medium that is accessible to the inspection system for performing the wafer inspection process, which includes applying defect detection parameter(s) to additional output of the inspection system generated for a wafer based on the information thereby detecting defects on the wafer.

    Abstract translation: 提供了用于生成用于晶片检查过程的信息的系统和方法。 一种方法包括获取位于晶片上的模具的检查系统的输出，基于输出的管芯位置组合用于管芯的输出，在内部管芯位置的基础上确定统计学 基于针对模具位置确定的统计特性，将组合输出的特性值的变化的属性以及将模具位置分配给不同的组。 该方法还包括在用于执行晶片检查过程的检查系统可访问的存储介质中存储用于管芯位置和内部管芯位置分配的不同组的信息，其包括应用缺陷检测参数， 基于该信息为晶片生成的检查系统的附加输出，从而检测晶片上的缺陷。

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