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公开(公告)号：EP4176791A1
公开(公告)日：2023-05-10
申请号：EP20944210.2
申请日：2020-08-31
Applicant: LG Electronics Inc.
Inventor： KIM, Youngbin , JANG, Jaewon , LEE, Minwoo , LEE, Yeongjae
IPC: A47L11/40
Abstract: The present disclosure relates to a robot cleaner including a coupler provided on a rotary plate to disperse stress generated by a load and stress generated by a rotation, and the robot cleaner includes a rotary plate having a lower portion to which a mop facing a floor is coupled, the rotary plate being rotatably coupled to a body, and a coupler coupled between the body and the rotary plate, thereby preventing damage to the rotary plate by dispersing the stress generated by the load and the stress generated by the rotation.
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公开(公告)号：EP4085809A1
公开(公告)日：2022-11-09
申请号：EP20909240.2
申请日：2020-12-15
Applicant: LG Electronics Inc.
Inventor： KIM, Youngbin , JANG, Jaewon , LEE, Minwoo , LEE, Yeongjae
IPC: A47L9/28
Abstract: The present invention relates to a charging apparatus for a robot cleaner including a charging apparatus body including a housing that accommodates a power module therein, and a bottom plate that is coupled to a bottom surface of the housing and on which a charging terminal is disposed, and a docking plate that is selectively mounted on the bottom plate of the charging apparatus body and docks the robot cleaner on an upper portion, wherein the docking plate includes an engaging protrusion that is disposed in a front portion, at least a portion of which is inserted into the charging apparatus body, and a hook that is disposed at a rear of the engaging protrusion, at least a portion of which is caught on the charging apparatus body. It is an invention related to a charging apparatus for a robot cleaner in which the docking plate is easily attached to and detached from the charging apparatus body.
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33.发明公开
公开(公告)号：EP4072244A1
公开(公告)日：2022-10-12
申请号：EP22175596.0
申请日：2017-07-20
Applicant: LG Electronics Inc.
Inventor： LEE, Minwoo
Abstract: A display device including a growth substrate; a plurality of semiconductor light emitting devices grown on the growth substrate and disposed on one surface of the growth substrate; a plurality of through holes passing through the growth substrate at positions overlapping with the semiconductor light emitting devices; a wavelength conversion material filled into the through holes to convert a wavelength of light emitted from corresponding semiconductor light emitting devices; and a wiring substrate electrically connected to an electrode of the semiconductor light emitting devices disposed at an opposite side of the growth substrate by interposing the semiconductor light emitting devices therebetween.
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34.发明公开
公开(公告)号：EP3530077A1
公开(公告)日：2019-08-28
申请号：EP17874178.1
申请日：2017-07-20
Applicant: LG Electronics Inc.
Inventor： LEE, Minwoo
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