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公开(公告)号：JP2001053432A
公开(公告)日：2001-02-23
申请号：JP22696499
申请日：1999-08-10
Applicant: MATSUSHITA ELECTRIC WORKS LTD
Inventor： KUZUHARA KAZUNARI , TANAKA YASUSHI , INOUE TOMOHIRO , YAMAMOTO MASAHIRO
Abstract: PROBLEM TO BE SOLVED: To provide a flip chip mounted structure for preventing inter-bump short circuit. SOLUTION: A solder bump 3 is formed on a device side electrode 4 formed on the lower face of a semiconductor device 1. A substrate side electrode 5 is formed at the site of a substrate for mounting corresponding to the solder bump 3, and a recess 6 is formed at each substrate side electrode 5. In this case, the face of the semiconductor device 1 on which the device side electrode 4 is formed is faced to the substrate 2 for mounting, the positions of the device side electrode 4 and the substrate side electrode 5 formed at the substrate 2 for mounting are matched, the semiconductor device 1 is placed on the substrate 2 for mounting, and the solar bump 3 is heated and melted so that the device side electrode 4 of the semiconductor device 1 and the substrate side electrode 5 of the substrate 2 for mounting can be electrically and mechanically connected. Any surplus solder is allowed to flow in the recess 6 formed at the substrate side electrode 5.
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公开(公告)号：JP2001053111A
公开(公告)日：2001-02-23
申请号：JP22696399
申请日：1999-08-10
Applicant: MATSUSHITA ELECTRIC WORKS LTD
Inventor： TANAKA YASUSHI , KUZUHARA KAZUNARI , INOUE TOMOHIRO , YAMAMOTO MASAHIRO
Abstract: PROBLEM TO BE SOLVED: To provide a flit-chip mounting structure preventing short circuits between bumps. SOLUTION: In this flip-chip mounting structure, solder bumps 3 are respectively formed in a plurality of element side electrodes, provided in a semiconductor element 1. Substrate side electrodes 4 are respectively formed at portions of a mounting substrate 2, corresponding to each solder bump 3, and pairs of grooves 5 are formed at portions between each substrate side electrode 4 in the mounting substrate 2. Here, the plane of the semiconductor element 1 forming the solder bump 3 is made to confront the mounting substrate 2, and the substrate side electrode 4 formed in the solder bump 3 and the mounting substrate 2 is positioned, and the semiconductor element 1 is mounted on the mounting substrate 2. Thereafter, if the solder bump 3 is heated and bused, an element side electrode of the semiconductor element 1 is connected electrically and mechanically To the substrate side electrode 4 of the mounting substrate 2. At This time, since surplus solder runs over from the substrate side electrode 4 and flows into the groove 5 provided in the mounting substrate 2, short-circuiting the space between adjacent solder bumps 3 is prevented.
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公开(公告)号：JP2000114588A
公开(公告)日：2000-04-21
申请号：JP27949098
申请日：1998-10-01
Applicant: MATSUSHITA ELECTRIC WORKS LTD
Inventor： KANBE YOSHIAKI , MATSUSHIMA SHUNSUKE , KUZUHARA KAZUNARI , SUMI SADAYUKI , TANAKA YASUSHI , INOUE TOMOHIRO , YAMAMOTO MASAHIRO , SAITO HIROSHI , TAKAMI SHIGENARI
IPC: H01L31/0232 , H01L31/12 , H01L33/54 , H01L33/00
Abstract: PROBLEM TO BE SOLVED: To provide a light transmitting element with extended angular range which can transmit and receive an optical signal with an equipment on the other side. SOLUTION: A light emitting element, light receiving element, and IC for signal processing are bare chip-mounted on a mounting board, and the light emitting element, light receiving element, and IC are sealed by translucent sealing resin, and a flood lens 6 and a light receiving lens 7 are formed in the optical axial direction of the light emitting element and the light receiving element by the sealing resin so that a light transmitting element A can be constituted. The light receiving lens 7 is constituted of a spherical lens, and the vertical and horizontal beam width of a received beam is made almost the same. The flood lens 6 is constituted of a cylindrical lens or the like, and the vertical and horizontal beam width of a projected beam is made different. The beam width in a direction orthogonally crossing the array direction of the light emitting element and the light receiving element is made wider than the beam width in a direction in parallel to the array direction of the light emitting element and the light receiving element.
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公开(公告)号：JPH11304602A
公开(公告)日：1999-11-05
申请号：JP10519098
申请日：1998-04-15
Applicant: MATSUSHITA ELECTRIC WORKS LTD
Inventor： YAMAMOTO MASAHIRO
Abstract: PROBLEM TO BE SOLVED: To obtain a detection method that detects stress distribution in an on-board inspection process for semiconductor chips mounted flip chips on using a relative low cost and an easy inspection method. SOLUTION: Pattern P for detecting Moire interference is formed on the surface of a semiconductor chip 1 to detect deformation of the chip 1 caused from stress occurred by Moire interference method using the pattern. The pattern P for detecting Moire interference formed on the surface of the chip 1 is preferably chosen one from among linear-, fringe-, concentration-, or grid-like shapes. Also, a forming method that forms the pattern P for Moire interference on the chip 1 is chosen either a method that digs a ditch on a wafer by anisotropy etching or a method that adds pattern by printing and imprinting on the surface of the chip 1 already mounted a flip chip on.
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公开(公告)号：JP2007265050A
公开(公告)日：2007-10-11
申请号：JP2006089649
申请日：2006-03-28
Applicant: Matsushita Electric Works Ltd , 松下電工株式会社
Inventor： YAMAMOTO MASAHIRO , OKI KAZUFUMI , TANAKA TAKAKO , TOSHIKAWA MOTOHIDE
Abstract: PROBLEM TO BE SOLVED: To provide an appliance control system wherein operation of each home appliance becomes natural operation as if residents are at home even when not at home, allowing easy setting of a control pattern of each home appliance when residents are not at home.
SOLUTION: A control module 8a has: a control means transmitting control information to a dimming control module 8d controlling a luminaire and a wireless communication module 8e controlling a remote control reception function-equipped television 201 to control the operation of the home appliance; a mode setting means changeably setting a home presence mode wherein a person is present inside a home and an absence mode wherein the person is absent inside the home; a recording means recording a control situation of each home appliance when the home presence mode is set by the mode setting means; and a control pattern generation means generating the control pattern of each home appliance on the basis of a recording result of the recording means. When the absence mode is set by the mode setting means, the control means controls the operation of each home appliance by the control pattern generated by the control pattern generation means.
COPYRIGHT: (C)2008,JPO&INPITAbstract translation: 要解决的问题：提供一种家电控制系统，其中每个家用电器的操作变得自然操作，就好像居民在家中，即使不在家，如果居民不在家时容易设置每个家用电器的控制模式 在家。 解决方案：控制模块8a具有：将控制信息发送到控制照明器的调光控制模块8d和控制配有遥控接收功能的电视机201的无线通信模块8e的控制装置，以控制家用电器的操作 ; 模式设置装置，可变地设置家庭存在模式，其中人在家中存在的人和存在于家中的缺席模式; 记录装置，当由所述模式设定装置设定所述家庭存在模式时，记录每个家用电器的控制状况; 以及控制图案生成单元，根据记录单元的记录结果，生成各家用电器的控制图形。 当通过模式设置装置设置不存在模式时，控制装置通过由控制模式产生装置产生的控制模式来控制每个家用电器的操作。 版权所有（C）2008，JPO＆INPIT
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Patent Agency Ranking
公开(公告)号：JP2007041152A
公开(公告)日：2007-02-15
申请号：JP2005223198
申请日：2005-08-01
Applicant: Matsushita Electric Works Ltd , 松下電工株式会社
Inventor： YAMAMOTO MASAHIRO , HOSHINO HIROSHI , OKI KAZUFUMI , YONEYAMA KENICHI , HAMAGUCHI HIDEJI
CPC classification number: G09F19/228
Abstract: PROBLEM TO BE SOLVED: To provide an arrangement grid creation system and a hall using the same, in which various equipment arrangement works are made easy and its work time is significantly reduced, by dispensing with the work of calculating arrangement positions of various equipment by measurement and work of providing a mark.
SOLUTION: A user creates arrangement grid data for projecting to a floor face F of the hall by using an arrangement grid creating device 1. A distortion correction device 2 corrects distortion of the arrangement grid data created by the arrangement grid creating device 1, based on a shape of the floor F and a tilt angle with respect to the floor face F of a light axis and a distance to the floor face F of a projector 3, and a video signal is generated from the corrected arrangement grid data and output to the projector 3. A shape of the arrangement grid displayed by an image which is projected from the projector 3 to the floor face F by the video signal is indicated by a real scale and turns into a rectangular shape due to the distortion correction.
COPYRIGHT: (C)2007,JPO&INPITAbstract translation: 要解决的问题：提供一种布置格网制作系统和使用该布置格栅的大厅，其中使各种设备布置工作变得容易并且其工作时间显着减少，通过分配各种各样的布置位置的计算工作 设备通过测量和工作提供标记。 解决方案：用户通过使用布置网格创建设备1创建用于投影到大厅的地板面F的布置网格数据。失真校正设备2校正由布置网格创建设备1创建的布置网格数据的失真 基于地板F的形状和相对于光轴的地板面F和到投影仪3的地板面F的距离的倾斜角度，并且从校正的布置格栅数据生成视频信号，并且 输出到投影仪3.由投影仪3通过视频信号投影到地板面F的图像显示的排列格栅的形状由实际尺度表示，并且由于失真校正而变成矩形形状。 版权所有（C）2007，JPO＆INPIT
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公开(公告)号：JP2006248728A
公开(公告)日：2006-09-21
申请号：JP2005069763
申请日：2005-03-11
Applicant: Matsushita Electric Works Ltd , 松下電工株式会社
Inventor： YAMAMOTO MASAHIRO , HAMAGUCHI HIDEJI , YONEYAMA KENICHI , OKI KAZUFUMI , UENO TAKESHI
Abstract: PROBLEM TO BE SOLVED: To provide a transportation condition detection device easily recoverable without needing to be incorporated in a transportable article and capable of detecting and obtaining a transportation condition of every individual transportable article.
SOLUTION: In this transportation condition detection device A, a device body mounted on a surface of a detection object load X by attachment is composed of a casing 6, and a circuit board 10 constituting a back lid of the casing 6; and, on the circuit board, a measuring measurement part 1 comprising an acceleration sensor for sensing impact applied during transportation of the load X, a data processing part 2 for obtaining the magnitude of the impact applied to the load X from the measurement data of the measurement part 1, a data recording part 3 comprising a removable memory for constantly recording the magnitude data of the impact obtained by the data processing part 2, a display part 4 for displaying, in the form of a bar, the maximum value of the impact at the present moment, a battery 6 as an operation power source, and a starting switch SW are mounted.
COPYRIGHT: (C)2006,JPO&NCIPIAbstract translation: 要解决的问题：提供一种容易恢复的运输状况检测装置，而不需要被包含在可运输制品中，并且能够检测和获得每个可运输物品的运输状况。 解决方案：在该运送状态检测装置A中，安装在检测对象负载X的表面上的装置主体由壳体6和构成壳体6的后盖的电路基板10构成。 并且在电路板上，包括用于感测在负载X的运输期间施加的冲击的加速度传感器的测量测量部分1，用于根据所述测量数据获得施加到负载X的冲击的大小的数据处理部分2 测量部分1，数据记录部分3，包括用于不断记录由数据处理部分2获得的影响的幅度数据的可移动存储器，用于以条形式显示影响的最大值的显示部分4 目前，安装作为操作电源的电池6和起动开关SW。 版权所有（C）2006，JPO＆NCIPI
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公开(公告)号：JP2004242455A
公开(公告)日：2004-08-26
申请号：JP2003030505
申请日：2003-02-07
Applicant: Matsushita Electric Works Ltd , 松下電工株式会社
Inventor： KIRIHARA MASAO , HASEGAWA YUYA , MURAI AKIHIKO , OKA NAOMASA , HIRATA KATSUHIRO , MIYAJIMA HISAKAZU , OGIWARA ATSUSHI , MITSUTAKE YOSHIO , KAWADA HIROSHI , TAKAKURA NOBUYUKI , YAMAMOTO MASAHIRO
Abstract: PROBLEM TO BE SOLVED: To provide an electrostatic drive type actuator which is adapted to an optical switch or particularly to a matrix optical switch and which has a small size/low power. SOLUTION: This electrostatic drive type actuator includes a movable member deformed by an electrostatic attraction force, a fixed member connected to the movable member, and a magnetic force attraction member for holding a shape in the state that the movable member is attracted. The fixed member has a connector connected to the movable member, and a fixed electrode part connected to the connector and having the form that a distance to the movable member gets longer toward the distal end of the movable member in a length direction. The movable member has a movable electrode part deformed by connecting to the connector, and a magnetic part mounted at the distal end of the movable electrode part at the opposite side of the connector and made of a soft magnetic plate. The magnetic force attraction member has a permanent magnet part for holding the magnetic part by a magnetic attraction force in the state that the movable electrode part is attracted to the fixed electrode part by the electromagnetic attraction force, and an electromagnet part for weakening the magnetic field of permanent magnet part. COPYRIGHT: (C)2004,JPO&NCIPI
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公开(公告)号：JP2003344447A
公开(公告)日：2003-12-03
申请号：JP2002150132
申请日：2002-05-24
Applicant: Matsushita Electric Works Ltd , 松下電工株式会社
Inventor： YASUIKE NORIYUKI , TAKAKURA NOBUYUKI , YASUDA MASAHARU , YAMAMOTO MASAHIRO , KIRIHARA MASAO
Abstract: PROBLEM TO BE SOLVED: To provide a measuring jig and a measuring method of a semiconductor element capable of realizing characteristic measurement in the state of the semiconductor element, and heightening measurement efficiency.
SOLUTION: This measuring jig of the semiconductor element has a frame 104 comprising a semiconductor substrate, a cantilever 106 supported inside rockably by an elastic beam part 105, a piezo resistance 107 provided on the beam part 105 and having a resistance value changing by applied acceleration, and an electrode 108 provided on the frame 104, for taking out a signal from the piezo resistance 107. The jig is equipped with a tray 1 having a holding part 11 projecting from the surface on one side, for suppressing play of the semiconductor element, and a cover 2 engaged with the tray 1, for covering its surface. In the jig, a terminal 3 capable of abutting oppositely on the electrode 108 held by the holding part 11 is provided on the surface of the cover 2, facing to the tray, and wiring 4 connected to the terminal 3 and enabling electric connection to the outside is provided.
COPYRIGHT: (C)2004,JPOAbstract translation: 要解决的问题：提供一种能够实现半导体元件的状态下的特性测量的半导体元件的测量夹具和测量方法，并提高测量效率。 解决方案：该半导体元件的测量夹具具有框架104，该框架104包括半导体衬底，由弹性梁部分105可摆动地支撑的悬臂106，设置在梁部分105上并具有电阻值变化的压电电阻107 以及设置在框架104上的用于取出来自压电电阻107的信号的电极108.该夹具配备有托盘1，该托盘1具有从一侧的表面突出的保持部11，用于抑制 半导体元件和与托盘1接合以覆盖其表面的盖2。 在夹具中，在盖2的面对托盘的表面上设置有能够抵接在由保持部11保持的电极108上的端子3，以及连接到端子3的布线4，并且能够与 外面提供。 版权所有（C）2004，JPO
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公开(公告)号：JP2003344439A
公开(公告)日：2003-12-03
申请号：JP2002154336
申请日：2002-05-28
Applicant: Matsushita Electric Works Ltd , 松下電工株式会社
Inventor： AKAI SUMIO , GOTO KOJI , YAMAMOTO MASAHIRO , KUZUHARA KAZUNARI , SUMI SADAYUKI , UEDA MICHIHIKO , KANI MITSUHIRO
Abstract: PROBLEM TO BE SOLVED: To prevent deterioration of an output characteristic caused by the influence of a stress generated in a package by an external force or a heat, and to miniaturize the package. SOLUTION: A recessed part 5 is provided in the package 4, and another acceleration sensor chip 1 excluding an integrated circuit chip 2 having the largest size and a memory cell chip 3 are stored in the recessed part 5, and the integrated circuit chip 2 is arranged in piles relative to the acceleration sensor chip 1 and the memory cell chip 3 stored in the recessed part 5. Hereby, the acceleration sensor chip 1 can be arranged on the center of the package 4. Consequently, the influence of the stress to the external force applied to the package 4 or a thermal stress generated in the package 4 is hardly exerted on the acceleration sensor chip 1, and the influence of the stress is changed to be isotropic to prevent deterioration of the output characteristic. In addition, the package 4 can be miniaturized by mounting and arranging stereoscopically a plurality of chips 1-3. COPYRIGHT: (C)2004,JPO
Abstract translation: 要解决的问题：为了防止由外力或热量在包装中产生的应力的影响引起的输出特性的劣化，并且使包装小型化。 解决方案：在封装4中设置有凹部5，并且除了具有最大尺寸的集成电路芯片2和存储单元芯片3之外的另一个加速度传感器芯片1被存储在凹部5中，并且集成电路 芯片2相对于加速度传感器芯片1和存储在凹部5中的存储单元芯片3布置成堆叠。因此，加速度传感器芯片1可以布置在封装4的中心。因此， 施加到包装4的外力或包装4中产生的热应力的应力几乎不施加在加速度传感器芯片1上，并且应力的影响被改变为各向同性的，以防止输出特性的劣化。 此外，通过立体地安装和布置多个芯片1-3，可以使封装4小型化。 版权所有（C）2004，JPO
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