公开(公告)号：EP1588436B1

公开(公告)日：2014-10-01

申请号：EP04706121.3

申请日：2004-01-29

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： ARNDT, Karlheinz ,  BOGNER, Georg ,  BRAUNE, Bert ,  WAITL, Günter

IPC: H01L33/48 ,  H01L33/52 ,  H01L33/54

CPC classification number: H01L33/486 ,  H01L33/52 ,  H01L33/54 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48472 ,  H01L2924/1815 ,  H01L2924/19107 ,  H01L2924/00014 ,  H01L2924/00

公开(公告)号：EP1794787B1

公开(公告)日：2009-11-04

申请号：EP05773768.6

申请日：2005-08-08

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： ARNDT, Karlheinz ,  LIM, Huey Ling Rena ,  BOGNER, Georg ,  GRUBER, Stefan ,  SCHNEIDER, Markus

IPC: H01L21/48 ,  H01L23/495

CPC classification number: H01L23/49541 ,  H01L23/495 ,  H01L23/49562 ,  H01L2924/0002 ,  Y10T29/49174 ,  H01L2924/00

Abstract: The invention relates to a conductor frame (1) for at least one electronic component, comprising at least two electric connection parts (2) with respectively at least one electric connection strip (3) and at least one retaining strip (4). The connection frame (1) is characterized in that an indentation is provided between the at least one retaining strip (4) and connection part (2), creating a parallel offset between the retaining strip (4) and adjacent area of the connection part (2), and in that another parallel offset is created between the connection part (2) and electrical connection strip (3) such that the retaining strip (4) and electric connection strip (3) are located on a common plane. The retaining strip (4) can be removed easily through the indentation (8) without having to create a disadvantageous stamping gap between the connection part (2) and the retaining strip (4).

公开(公告)号：EP1449263B1

公开(公告)日：2008-04-16

申请号：EP02804152.3

申请日：2002-12-02

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： ARNDT, Karlheinz ,  FARCHTCHIAN, Nadir

IPC: H01L33/00 ,  H01L25/075

CPC classification number: H01L33/56 ,  H01L25/0753 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2924/3025 ,  H01L2933/0091 ,  H01L2924/00014 ,  H01L2924/00

Abstract: The invention relates to an optoelectronic component comprising a base body or housing (2), at least one optoelectronic semiconductor chip (3), which is placed inside a recess of the base body, and a casting compound (5). The casting compound embeds the at least one semiconductor chip in the recess and is made of a transparent material. The transparent casting compound (5) is designed to scatter light in a diffused manner and contains, in particular, diffuser particles (6) on which light striking thereon is scattered in a diffused manner.

公开(公告)号：EP1751806A2

公开(公告)日：2007-02-14

申请号：EP05748711.8

申请日：2005-05-12

Applicant: Osram Opto Semiconductors GmbH

Inventor： ARNDT, Karlheinz

IPC: H01L33/00

CPC classification number: H01L33/60 ,  H01L33/486 ,  H01L33/52 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2924/00

Abstract: The invention relates to an optoelectronic semiconductor component which comprises at least one semiconductor chip (1) emitting radiation (11), which is located in a recess (2) of a housing base (3). Said recess (2) is laterally delimited by a wall (31) extending along the semiconductor chip (1) and is at least partially filled with a cladding compound (4) that covers the semiconductor chip (1) and is easily permeable to electromagnetic radiation emitted by the semiconductor chip (1). An inner side (32) of the wall (31) delimiting the recess (2) is configured in such a manner that, when the front of the semiconductor chip is viewed from above, a subsection (33) of the inner side (32) is formed that completely encircles the semiconductor chip (1) and that, when viewed from the radiation-emitting semiconductor chip (1), is in the shadow and is at least partially covered by the cladding compound (4) which completely encircles the semiconductor chip (1). The invention also relates to a housing base for said semiconductor component.

公开(公告)号：EP1565948A2

公开(公告)日：2005-08-24

申请号：EP03767463.7

申请日：2003-11-27

Applicant: Osram Opto Semiconductors GmbH

Inventor： ARNDT, Karlheinz ,  BOGNER, Georg ,  WAITL, Günter ,  WINTER, Matthias

IPC: H01L33/00 ,  H01L31/0203

CPC classification number: H01L33/62 ,  H01L33/486 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2924/00

Abstract: The invention relates to an optoelectronic component containing an optoelectronic chip (1), a chip carrier (2) with a central region (3), on which the chip is fixed and terminals (41, 42, 43, 44), which run from the central region of the chip carrier (2) to the exterior of said chip. The chip and sections of the chip carrier are surrounded by a body (5). The respective projection of the body, in addition to that of the longitudinal axes of the terminals on the contact plane between the chip and the chip carrier are essentially point-symmetrical in relation to the central point of the chip. The invention also relates to an assembly comprising said component. The advantage of the symmetrical configuration of the component is that the risk of thermomechanically induced malfunctions of the components is reduced.

Abstract translation: 本发明涉及一种包含光电芯片（1）的光电子器件，具有芯片固定在其上的中心区域（3）的芯片载体（2）以及从其延伸的端子（41,42,43,44） 芯片载体（2）的中心区域延伸到所述芯片的外部。 芯片载体的芯片和部分被本体（5）包围。 除了芯片和芯片载体之间的接触平面上的端子的纵向轴线之外，本体的相应投影相对于芯片的中心点基本上是点对称的。 本发明还涉及一种包括所述部件的组件。 组件对称配置的优点是减少了组件热机械引起的故障的风险。

公开(公告)号：EP1004145B1

公开(公告)日：2005-06-01

申请号：EP98947353.3

申请日：1998-07-27

Applicant: Osram Opto Semiconductors GmbH

Inventor： ARNDT, Karlheinz

IPC: H01L33/00

CPC classification number: H01L33/486 ,  H01L25/0753 ,  H01L33/62 ,  H01L33/642 ,  H01L33/647 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/01068 ,  H01L2924/12041 ,  H01L2924/00014

Abstract: The invention relates to an optoelectronic component in which an optoelectronic chip (1) is mounted on a chip carrier (2) of a leadframe (7). Said leadframe (7) contains a terminal (8) which is set apart from the chip carrier (2). The terminal is electrically joined to an electrical contact of the optoelectronic chip (7). The chip carrier (2) contains a number of external connections (4, 5, 6) for improving the transfer of heat away from the chip (1). Said connections project out of different positions of a covering (3) which are set apart from one another.

Abstract translation: 本发明涉及一种光电子器件，其中光电子芯片（1）安装在引线框架（7）的芯片载体（2）上。 所述引线框架（7）包含与芯片载体（2）分离的端子（8）。 该端子电连接到光电芯片（7）的电触点。 芯片载体（2）包含多个外部连接（4,5,6），用于改善从芯片（1）传走的热量。 所述连接从彼此分离的覆盖物（3）的不同位置伸出。

公开(公告)号：EP1216266A1

公开(公告)日：2002-06-26

申请号：EP00963869.3

申请日：2000-08-04

Applicant: Osram Opto Semiconductors GmbH & Co. OHG

Inventor： HÖHN, Klaus ,  WAITL, Günter ,  ARNDT, Karlheinz

IPC: C08G59/42 ,  C08G59/38 ,  C08L63/04 ,  H01L33/00

CPC classification number: C08G59/38 ,  C08G59/42 ,  H01L23/293 ,  H01L33/56 ,  H01L2924/0002 ,  H01L2933/0091 ,  H01L2924/00

Abstract: The invention relates to a cast resin material which can be used as a material for assembling and encapsulating electronic and optoelectronic parts, modules and components. The inventive resin material can be used to cast optoelectronic parts made from epoxy compounds which are acid-anhydride curable, especially bisphenol-A-diglycidylether, and is characterized in that it contains poly-functional epoxynovolac resins, especially one epoxycresolnovalac. Said cast resin material exhibits a significantly higher glass transition temperature, is suitable for mass production processes, is not harmful to health and yields SMT-enabled products which can be used in car production.

公开(公告)号：EP1565948B1

公开(公告)日：2016-03-16

申请号：EP03767463.7

申请日：2003-11-27

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： ARNDT, Karlheinz ,  BOGNER, Georg ,  WAITL, Günter ,  WINTER, Matthias

IPC: H01L33/48 ,  H01L33/62 ,  H01L31/0203

CPC classification number: H01L33/62 ,  H01L33/486 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2924/00

公开(公告)号：EP2329538A1

公开(公告)日：2011-06-08

申请号：EP09776123.3

申请日：2009-08-31

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： ARNDT, Karlheinz

IPC: H01L33/00 ,  H01L33/48

CPC classification number: H01L33/486 ,  H01L33/62 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A housing (1) for an optoelectronic component is specified. The housing (1) comprises a housing body (2) and a first and a second electrical connection strip (11, 12), which connection strips run partially inside the housing body (2) and are routed out of the housing body (2) on a first side surface (4a). Outside the housing body (2), the two connection strips (11, 12) are bent in such a manner that they have a first section (11c, 12c), which extends transversely with respect to the first side surface (4a), and a second section (11d, 12d) which extends along the first side surface (4a) at a distance (D). A method for producing such a housing (1) is also specified.

公开(公告)号：EP1449263B9

公开(公告)日：2008-10-08

申请号：EP02804152.3

申请日：2002-12-02

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： ARNDT, Karlheinz ,  FARCHTCHIAN, Nadir

IPC: H01L33/00 ,  H01L25/075

CPC classification number: H01L33/56 ,  H01L25/0753 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2924/3025 ,  H01L2933/0091 ,  H01L2924/00014 ,  H01L2924/00

Abstract: The invention relates to an optoelectronic component comprising a base body or housing (2), at least one optoelectronic semiconductor chip (3), which is placed inside a recess of the base body, and a casting compound (5). The casting compound embeds the at least one semiconductor chip in the recess and is made of a transparent material. The transparent casting compound (5) is designed to scatter light in a diffused manner and contains, in particular, diffuser particles (6) on which light striking thereon is scattered in a diffused manner.