公开(公告)号：US20200319033A1

公开(公告)日：2020-10-08

申请号：US16906002

申请日：2020-06-19

Applicant: PIXART IMAGING INC.

Inventor： MING-HAN TSAI ,  CHIH-MING SUN ,  JIAN-CHENG LIAO

IPC: G01J5/04 ,  G01J5/12 ,  G01J5/08 ,  G01J5/00

Abstract: An electronic device includes an outer case, a circuit substrate, a thermopile sensor chip, a filter structure, and a waterproof structure. The outer case has an opening. The circuit substrate is disposed inside the outer case. The thermopile sensor chip is disposed on the circuit substrate. The filter structure is disposed above the thermopile sensor chip. The waterproof structure is surroundingly connected between the filter structure and the outer case, wherein the waterproof structure has a through hole for exposing the filter structure and communicated with the opening of the outer case.

公开(公告)号：US20200240846A1

公开(公告)日：2020-07-30

申请号：US16850187

申请日：2020-04-16

Applicant: PIXART IMAGING INC.

Inventor： CHIH-MING SUN ,  MING-HAN TSAI ,  CHENG-NAN TSAI

IPC: G01J5/02 ,  H04N5/33 ,  B81B7/00 ,  G01J5/06 ,  G01J5/04 ,  H04N5/225

Abstract: A wearable device includes a case and a far infrared temperature sensing device. The case has a first opening. The far infrared temperature sensing device is disposed inside the case of the wearable device. The far infrared temperature sensing device includes an assembly structure, a sensor chip, a filter structure, and a metal shielding structure. The assembly structure has an accommodating space and a top opening. The sensor chip is disposed in the accommodating space of the assembly structure. The filter structure is disposed above the sensor chip. The metal shielding structure is disposed above the sensor chip, and has a second opening to expose the filter structure. The first and second openings are communicated to cooperatively define a through hole.