公开(公告)号：US10935569B2

公开(公告)日：2021-03-02

申请号：US16251421

申请日：2019-01-18

Applicant: Rosemount Aerospace Inc.

Inventor： Jim Golden ,  David P. Potasek ,  Marcus Allen Childress

IPC: G01R31/00 ,  G01L1/00 ,  G01R1/04 ,  B81C99/00 ,  G01R31/28

Abstract: A method of testing sensors includes providing a test sheet that includes a plurality of sensor assemblies, a plurality of test pads, and traces extending from the sensor assemblies to the plurality of test pads. A sensor is positioned on each sensor assembly. Each sensor is connected to the sensor assembly with wire bonds. An enclosure is formed over the plurality of sensor assemblies. An electrical signal is detected from each of the plurality of sensor assemblies at the test pads.

公开(公告)号：US10656035B2

公开(公告)日：2020-05-19

申请号：US16599470

申请日：2019-10-11

Applicant: Rosemount Aerospace Inc.

Inventor： Timothy Thomas Golly ,  David P. Potasek ,  Cuong Tho Huynh

IPC: G01L9/00 ,  G01L19/14

Abstract: A MEMS device includes a backing wafer with a support portion and central back plate connected to the support portion with spring flexures, a diaphragm wafer with a support portions and a sensing portion connected to the support portion with spring flexures, a passivation layer on the diaphragm, and a topping wafer. The device allows for stress isolation of a diaphragm in a piezoresistive device without a large MEMS die.

公开(公告)号：US10481025B2

公开(公告)日：2019-11-19

申请号：US15416801

申请日：2017-01-26

Applicant: Rosemount Aerospace Inc.

Inventor： Timothy Thomas Golly ,  David P. Potasek ,  Cuong Tho Huynh

IPC: G01L9/00 ,  G01L19/14

Abstract: A MEMS device includes a backing wafer with a support portion and central back plate connected to the support portion with spring flexures, a diaphragm wafer with a support portions and a sensing portion connected to the support portion with spring flexures, a passivation layer on the diaphragm, and a topping wafer. The device allows for stress isolation of a diaphragm in a piezoresistive device without a large MEMS die.

公开(公告)号：US20180209863A1

公开(公告)日：2018-07-26

申请号：US15416801

申请日：2017-01-26

Applicant: Rosemount Aerospace Inc.

Inventor： Timothy Thomas Golly ,  David P. Potasek ,  Cuong Tho Huynh

IPC: G01L9/00

Abstract: A MEMS device includes a backing wafer with a support portion and central back plate connected to the support portion with spring flexures, a diaphragm wafer with a support portions and a sensing portion connected to the support portion with spring flexures, a passivation layer on the diaphragm, and a topping wafer. The device allows for stress isolation of a diaphragm in a piezoresistive device without a large MEMS die.

公开(公告)号：US20170234752A1

公开(公告)日：2017-08-17

申请号：US15041243

申请日：2016-02-11

Applicant: Rosemount Aerospace Inc.

Inventor： David P. Potasek ,  Charles Little ,  Weibin Zhang

IPC: G01L19/06 ,  G01L9/00

CPC classification number: G01L19/0645 ,  G01L9/0052 ,  G01L9/0072 ,  G01L19/0618 ,  G01L19/146 ,  G01L19/147

Abstract: A pressure sensor comprising a housing, a diaphragm wafer, and an isolator configured to absorb lateral stress. The diaphragm wafer includes a fully exposed diaphragm, a fluid contact surface, a sensing element, and a support portion, where the support portion and the contact surface define a cavity. The isolator extends laterally from the support portion to the housing. The pressure sensor is easily drainable, eliminating the buildup of particulates, and the diaphragm can be directly wire-bonded to printed circuit boards, eliminating the need for extensive electrical feedthrough.