公开(公告)号：EP2999665A1

公开(公告)日：2016-03-30

申请号：EP14801718.9

申请日：2014-05-23

Applicant: BYD Company Limited

Inventor： GONG, Qing ,  ZHOU, Wei ,  MIAO, Weifeng

IPC: C01G19/02 ,  C23C18/20 ,  C08K3/22 ,  C08L69/00 ,  C23C18/52

CPC classification number: C23C18/1608 ,  B29C37/0025 ,  B29C2035/0838 ,  B29C2035/0872 ,  B29C2035/0877 ,  C01G19/006 ,  C01G19/02 ,  C01G30/002 ,  C01G31/00 ,  C01G39/00 ,  C01P2002/50 ,  C01P2002/52 ,  C01P2004/61 ,  C01P2004/62 ,  C01P2004/64 ,  C08K3/22 ,  C08K2003/2231 ,  C08K2003/2255 ,  C09D11/03 ,  C23C18/1612 ,  C23C18/1641 ,  C23C18/204 ,  C23C18/285 ,  C23C18/38 ,  H05K1/0373 ,  H05K3/107 ,  H05K3/185 ,  H05K2201/0215 ,  H05K2201/0218 ,  H05K2201/0236 ,  H05K2203/107

Abstract: A method for selective metallization of a surface of a polymer article is provided. The polymer article contains a base polymer and at least one metal compound dispersed in the base polymer. The method includes gasifying at least a part of a surface of the polymer article by irradiating the surface with an energy source, and forming at least one metal layer on the surface of the polymer article by chemical plating. The metal compound contains a tin oxide doped with at least one doping element selected from a group including: V, Sb, In, and Mo.

公开(公告)号：EP3196338B1

公开(公告)日：2019-12-18

申请号：EP15849159.7

申请日：2015-08-28

Applicant: BYD Company Limited

Inventor： ZHOU, Wei ,  MIAO, Weifeng ,  MAO, Bifeng ,  ZHOU, Fangxiang

IPC: C23C18/16

公开(公告)号：EP3239241A1

公开(公告)日：2017-11-01

申请号：EP15871765.2

申请日：2015-10-23

Applicant: BYD Company Limited

Inventor： ZHANG, Xiong ,  WEN, Jianjun ,  ZHAO, Zhengsheng ,  ZHOU, Wei ,  GONG, Qing

IPC: C08L81/02 ,  C08L67/02 ,  B29C45/14

CPC classification number: C08L81/04 ,  B29C45/0046 ,  B29C45/14 ,  B32B7/04 ,  B32B7/14 ,  C08K7/02 ,  C08L63/08 ,  C08L67/00 ,  C08L67/02 ,  C08L71/00 ,  C08L81/02

Abstract: A resin composition, a metal-resin composite formed with the resin composition and a metal substrate and a preparation method and use thereof, and an electronic product shell using the resin composition are provided. The resin composition comprises a base resin, a modified resin and a fiber, wherein the base resin is one or two or more of a polyarylene sulfide resin, a polyether resin, and a polyester resin, and the modified resin has a melting point that is 3-24°C higher than the glass transition temperature of the base resin.

Abstract translation: 提供树脂组合物，由该树脂组合物和金属基材形成的金属树脂复合体及其制备方法和用途，以及使用该树脂组合物的电子产品外壳。 所述树脂组合物包含基础树脂，改性树脂和纤维，其中所述基础树脂为聚芳硫醚树脂，聚醚树脂和聚酯树脂中的一种或两种以上，并且所述改性树脂的熔点为 比基础树脂的玻璃化转变温度高3-24℃。

公开(公告)号：EP3108034A1

公开(公告)日：2016-12-28

申请号：EP15740539.0

申请日：2015-01-27

Applicant: BYD Company Limited

Inventor： GONG, Qing ,  ZHOU, Wei ,  SUN, Yongliang

IPC: C23C18/30 ,  C23C18/31 ,  C23C18/38

Abstract: A method for metalizing a polymer substrate and a polymer article prepared thereof. First a polymer substrate having a base polymer and at least one metal compound dispersed in the base polymer is provided. A surface of the polymer substrate is then irradiated with an energy beam such that a water contact angle of the surface of the polymer substrate is at least 120°. And then the surface of the polymer substrate is subjected to chemical plating.

公开(公告)号：EP3108033A1

公开(公告)日：2016-12-28

申请号：EP15740739.6

申请日：2015-01-27

Applicant: BYD Company Limited

Inventor： GONG, Qing ,  ZHOU, Wei ,  SUN, Yongliang

IPC: C23C18/20 ,  C23C18/31

Abstract: A method for metalizing a polymer substrate and a polymer article prepared thereof. First a polymer substrate having a base polymer and at least one metal compound dispersed in the base polymer is provided. A surface of the polymer substrate is then irradiated with an energy beam such that a water contact angle of the surface of the polymer substrate is at least 120°. And then the surface of the polymer substrate is subjected to chemical plating.

Abstract translation: 提供了用于金属化聚合物基底的方法和通过该方法制备的聚合物制品。 首先提供具有基础聚合物和分散在基础聚合物中的至少一种金属化合物的聚合物基材。 然后用能量束照射聚合物基材的表面，使得聚合物基材的表面的水接触角为至少120°。 并且聚合物基材的表面经受化学镀。

公开(公告)号：EP4175425A1

公开(公告)日：2023-05-03

申请号：EP21831763.4

申请日：2021-06-28

Applicant: BYD Company Limited

Inventor： ZHOU, Wei ,  XU, Qiang ,  XIE, Caicai

IPC: H05K3/02 ,  C04B37/02

Abstract: A method for preparing a ceramic copper clad laminate is provided, including following steps: providing a copper material; forming a copper oxide layer on a surface of the copper material; thermally treating the copper material on which the copper oxide layer is formed, to diffuse oxygen atoms in the copper material; removing the copper oxide layer on the thermally treated copper material; and soldering the copper-oxide-layer-removed copper material to a ceramic substrate to obtain a ceramic copper clad laminate.

公开(公告)号：EP4166869A1

公开(公告)日：2023-04-19

申请号：EP21827078.3

申请日：2021-06-07

Applicant: BYD Company Limited

Inventor： LI, Yonghui ,  LI, Junqiao ,  ZHOU, Wei

IPC: F25B21/02

Abstract: A semiconductor refrigeration chip and a method for manufacturing same are provided. The method includes: providing a semiconductor refrigeration assembly, where the semiconductor refrigeration assembly includes a first insulating and heat-conducting layer and a second insulating and heat-conducting layer provided opposite to each other and a semiconductor layer arranged between the first insulating and heat-conducting layer and the second insulating and heat-conducting layer, a side of the semiconductor refrigeration assembly provided with the first insulating and heat-conducting layer is a cold end, and a side of the semiconductor refrigeration assembly provided with the second insulating and heat-conducting layer is a hot end; and forming a packaging structure, and causing the packaging structure to cover a side wall of the semiconductor refrigeration assembly and define a first groove with the first insulating and heat-conducting layer, to obtain the semiconductor refrigeration chip.

公开(公告)号：EP3108034B1

公开(公告)日：2019-10-30

申请号：EP15740539.0

申请日：2015-01-27

Applicant: BYD Company Limited

Inventor： GONG, Qing ,  ZHOU, Wei ,  SUN, Yongliang

IPC: C23C18/30 ,  C23C18/31 ,  C23C18/38 ,  C08K3/20 ,  C23C18/16

公开(公告)号：EP3108035B1

公开(公告)日：2019-10-16

申请号：EP15740215.7

申请日：2015-01-27

Applicant: BYD Company Limited

Inventor： GONG, Qing ,  ZHOU, Wei ,  SUN, Yongliang

IPC: C23C18/38 ,  C23C18/20 ,  C23C18/31 ,  C23C18/16 ,  C08K3/32

公开(公告)号：EP3108033B1

公开(公告)日：2019-10-16

申请号：EP15740739.6

申请日：2015-01-27

Applicant: BYD Company Limited

Inventor： GONG, Qing ,  ZHOU, Wei ,  SUN, Yongliang

IPC: C23C18/20 ,  C23C18/31 ,  C08K3/20