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    Integration of an unprocessed, direct-bandgap chip into a silicon photonic device
    31.
    发明授权
    Integration of an unprocessed, direct-bandgap chip into a silicon photonic device 有权
    将未处理的直接带隙芯片集成到硅光子器件中

    公开(公告)号：US09316785B2

    公开(公告)日：2016-04-19

    申请号：US14509914

    申请日：2014-10-08

    Applicant: Skorpios Technologies, Inc.

    Inventor： Stephen B. Krasulick ,  John Dallesasse ,  Amit Mizrahi ,  Timothy Creazzo ,  Elton Marchena ,  John Y. Spann

    IPC: G02B6/12 ,  G02B6/122 ,  H01S5/022 ,  H01S5/00

    CPC classification number: G02B6/1225 ,  G02B6/12004 ,  G02B2006/12176 ,  H01L2224/32225 ,  H01S5/005 ,  H01S5/02252

    Abstract: A composite device for splitting photonic functionality across two or more materials comprises a platform, a chip, and a bond securing the chip to the platform. The platform comprises a base layer and a device layer. The device layer comprises silicon and has an opening exposing a portion of the base layer. The chip, a III-V material, comprises an active region (e.g., gain medium for a laser). The chip is bonded to the portion of the base layer exposed by the opening such that the active region of the chip is aligned with the device layer of the platform. A coating hermitically seals the chip in the platform.

    Abstract translation: 用于在两种或多种材料上分离光子功能的复合器件包括平台，芯片和将芯片固定到平台的接合。 平台包括基层和器件层。 器件层包括硅并且具有露出基底层的一部分的开口。 芯片III-V材料包括有源区（例如，用于激光的增益介质）。 芯片被接合到由开口暴露的基层的部分，使得芯片的有源区域与平台的器件层对准。 涂层在平台上密封芯片。

    Method and system for template assisted wafer bonding using pedestals
    32.
    发明授权
    Method and system for template assisted wafer bonding using pedestals 有权
    使用基座进行模板辅助晶片接合的方法和系统

    公开(公告)号：US09159631B2

    公开(公告)日：2015-10-13

    申请号：US14261276

    申请日：2014-04-24

    Applicant: Skorpios Technologies, Inc.

    Inventor： Elton Marchena

    IPC: H01L21/8258 ,  H01L21/762 ,  G02B6/13 ,  H01L31/18 ,  H01L33/00 ,  H01S5/02 ,  H01S5/30

    CPC classification number: H01L21/8258 ,  G02B6/13 ,  H01L21/76251 ,  H01L31/18 ,  H01L33/005 ,  H01S5/0215 ,  H01S5/3013

    Abstract: A method of fabricating a composite semiconductor structure includes providing a first substrate comprising a first material and having a first surface and forming a plurality of pedestals extending to a predetermined height in a direction normal to the first surface. The method also includes attaching a plurality of elements comprising a second material to each of the plurality of pedestals, providing a second substrate having one or more structures disposed thereon, and aligning the first substrate and the second substrate. The method further includes joining the first substrate and the second substrate to form the composite substrate structure and removing at least a portion of the first substrate from the composite substrate structure.

    Abstract translation: 制造复合半导体结构的方法包括提供包括第一材料并具有第一表面的第一基板，并且形成沿垂直于第一表面的方向延伸到预定高度的多个基座。 该方法还包括将包括第二材料的多个元件附接到多个基座中的每一个，从而提供其上设置有一个或多个结构的第二基板，以及对准第一基板和第二基板。 该方法还包括接合第一基板和第二基板以形成复合基板结构，并从复合基板结构去除第一基板的至少一部分。

    INTEGRATION OF AN UNPROCESSED, DIRECT-BANDGAP CHIP INTO A SILICON PHOTONIC DEVICE
    33.
    发明申请
    INTEGRATION OF AN UNPROCESSED, DIRECT-BANDGAP CHIP INTO A SILICON PHOTONIC DEVICE 有权
    将不受约束的直接带状芯片集成到硅光电器件

    公开(公告)号：US20150098676A1

    公开(公告)日：2015-04-09

    申请号：US14509914

    申请日：2014-10-08

    Applicant: Skorpios Technologies, Inc.

    Inventor： Stephen B. Krasulick ,  John Dallesasse ,  Amit Mizrahi ,  Timothy Creazzo ,  Elton Marchena ,  John Y. Spann

    IPC: G02B6/122

    CPC classification number: G02B6/1225 ,  G02B6/12004 ,  G02B2006/12176 ,  H01L2224/32225 ,  H01S5/005 ,  H01S5/02252

    Abstract: A composite device for splitting photonic functionality across two or more materials comprises a platform, a chip, and a bond securing the chip to the platform. The platform comprises a base layer and a device layer. The device layer comprises silicon and has an opening exposing a portion of the base layer. The chip, a III-V material, comprises an active region (e.g., gain medium for a laser). The chip is bonded to the portion of the base layer exposed by the opening such that the active region of the chip is aligned with the device layer of the platform. A coating hermitically seals the chip in the platform.

    Abstract translation: 用于在两种或多种材料上分离光子功能的复合器件包括平台，芯片和将芯片固定到平台的接合。 平台包括基层和器件层。 器件层包括硅并且具有露出基底层的一部分的开口。 芯片III-V材料包括有源区（例如，用于激光的增益介质）。 芯片被接合到由开口暴露的基层的部分，使得芯片的有源区域与平台的器件层对准。 涂层在平台上密封芯片。

    Method and system for template assisted wafer bonding using pedestals
    34.
    发明授权
    Method and system for template assisted wafer bonding using pedestals 有权
    使用基座进行模板辅助晶片接合的方法和系统

    公开(公告)号：US08735191B2

    公开(公告)日：2014-05-27

    申请号：US13733337

    申请日：2013-01-03

    Applicant: Skorpios Technologies, Inc.

    Inventor： Elton Marchena

    IPC: H01L21/00

    CPC classification number: H01L21/8258 ,  G02B6/13 ,  H01L21/76251 ,  H01L31/18 ,  H01L33/005 ,  H01S5/0215 ,  H01S5/3013

    Abstract: A method of fabricating a composite semiconductor structure includes providing a first substrate comprising a first material and having a first surface and forming a plurality of pedestals extending to a predetermined height in a direction normal to the first surface. The method also includes attaching a plurality of elements comprising a second material to each of the plurality of pedestals, providing a second substrate having one or more structures disposed thereon, and aligning the first substrate and the second substrate. The method further includes joining the first substrate and the second substrate to form the composite substrate structure and removing at least a portion of the first substrate from the composite substrate structure.

    Abstract translation: 制造复合半导体结构的方法包括提供包括第一材料并具有第一表面的第一基板，并且形成沿垂直于第一表面的方向延伸到预定高度的多个基座。 该方法还包括将包括第二材料的多个元件附接到多个基座中的每一个，从而提供其上设置有一个或多个结构的第二基板，以及对准第一基板和第二基板。 该方法还包括接合第一基板和第二基板以形成复合基板结构，并从复合基板结构去除第一基板的至少一部分。

    METHOD AND SYSTEM FOR THE MONOLITHIC INTEGRATION OF CIRCUITS FOR MONITORING AND CONTROL OF RF SIGNALS
    35.
    发明申请
    METHOD AND SYSTEM FOR THE MONOLITHIC INTEGRATION OF CIRCUITS FOR MONITORING AND CONTROL OF RF SIGNALS 有权
    用于监视和控制RF信号的电路的单片集成方法和系统

    公开(公告)号：US20140037286A1

    公开(公告)日：2014-02-06

    申请号：US13959107

    申请日：2013-08-05

    Applicant: Skorpios Technologies, Inc.

    Inventor： Stephen B. Krasulick ,  Timothy Creazzo ,  Kalpit Jha ,  Elton Marchena ,  Amit Mizrahi

    IPC: H04B10/556

    CPC classification number: H04B10/5561 ,  H04B10/07955 ,  H04B10/5053 ,  H04B10/564 ,  H04J14/0227 ,  H04L27/2096

    Abstract: A method of operating a BPSK modulator includes receiving an RF signal at the BPSK modulator and splitting the RF signal into a first portion and a second portion that is inverted with respect to the first portion. The method also includes receiving the first portion at a first arm of the BPSK modulator, receiving the second portion at a second arm of the BPSK modulator, applying a first tone to the first arm of the BPSK modulator, and applying a second tone to the second arm of the BPSK modulator. The method further includes measuring a power associated with an output of the BPSK modulator and adjusting a phase applied to at least one of the first arm of the BPSK modulator or the second arm of the BPSK modulator in response to the measured power.

    Abstract translation: 一种操作BPSK调制器的方法包括在BPSK调制器处接收RF信号，并将RF信号分成第一部分和相对于第一部分反相的第二部分。 该方法还包括在BPSK调制器的第一臂处接收第一部分，在BPSK调制器的第二臂处接收第二部分，向BPSK调制器的第一臂应用第一音调，并向第 BPSK调制器的第二臂。 该方法还包括测量与BPSK调制器的输出相关联的功率，并且响应于测量的功率调整施加到BPSK调制器的第一臂或BPSK调制器的第二臂中的至少一个的相位。

    METHOD AND SYSTEM FOR TEMPLATE ASSISTED WAFER BONDING USING PEDESTALS
    36.
    发明申请
    METHOD AND SYSTEM FOR TEMPLATE ASSISTED WAFER BONDING USING PEDESTALS 有权
    使用PEDESTALS模板辅助波形粘结的方法和系统

    公开(公告)号：US20130189804A1

    公开(公告)日：2013-07-25

    申请号：US13733337

    申请日：2013-01-03

    Applicant: Skorpios Technologies, Inc.

    Inventor： Elton Marchena

    IPC: H01L21/762

    CPC classification number: H01L21/8258 ,  G02B6/13 ,  H01L21/76251 ,  H01L31/18 ,  H01L33/005 ,  H01S5/0215 ,  H01S5/3013

    Abstract: A method of fabricating a composite semiconductor structure includes providing a first substrate comprising a first material and having a first surface and forming a plurality of pedestals extending to a predetermined height in a direction normal to the first surface. The method also includes attaching a plurality of elements comprising a second material to each of the plurality of pedestals, providing a second substrate having one or more structures disposed thereon, and aligning the first substrate and the second substrate. The method further includes joining the first substrate and the second substrate to form the composite substrate structure and removing at least a portion of the first substrate from the composite substrate structure.

    Abstract translation: 制造复合半导体结构的方法包括提供包括第一材料并具有第一表面的第一基板，并且形成沿垂直于第一表面的方向延伸到预定高度的多个基座。 该方法还包括将包括第二材料的多个元件附接到多个基座中的每一个，从而提供其上设置有一个或多个结构的第二基板，以及对准第一基板和第二基板。 该方法还包括接合第一基板和第二基板以形成复合基板结构，并从复合基板结构去除第一基板的至少一部分。

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