公开(公告)号：US20180308834A1

公开(公告)日：2018-10-25

申请号：US15900590

申请日：2018-02-20

Applicant: Skorpios Technologies, Inc.

Inventor： Stephen B. Krasulick ,  Timothy Creazzo ,  Elton Marchena ,  John Dallesasse

IPC: H01L25/00 ,  G02B6/13 ,  H01L21/48 ,  H01L21/74 ,  H01L21/762 ,  H01L31/18 ,  H01L21/8258 ,  H01L21/84 ,  G02B6/00 ,  H01L33/00 ,  H01L25/16 ,  H01S5/02 ,  H01S5/022

CPC classification number: H01L25/50 ,  G02B6/00 ,  G02B6/13 ,  H01L21/4857 ,  H01L21/746 ,  H01L21/76251 ,  H01L21/76254 ,  H01L21/8258 ,  H01L21/84 ,  H01L25/167 ,  H01L31/18 ,  H01L33/0079 ,  H01L2224/04105 ,  H01L2224/16225 ,  H01L2224/18 ,  H01L2224/24 ,  H01L2224/73259 ,  H01L2224/73267 ,  H01L2224/82 ,  H01L2224/92224 ,  H01L2224/92244 ,  H01L2924/0002 ,  H01S5/021 ,  H01S5/0215 ,  H01S5/0224 ,  H01L2924/00

Abstract: Fabricating a multilevel composite semiconductor structure includes providing a first substrate comprising a first material; dicing a second substrate to provide a plurality of dies; mounting the plurality of dies on a third substrate; joining the first substrate and the third substrate to form a composite structure; and joining a fourth substrate and the composite structure.

公开(公告)号：US20180052283A1

公开(公告)日：2018-02-22

申请号：US15633343

申请日：2017-06-26

Applicant: Skorpios Technologies, Inc.

Inventor： Stephen B. Krasulick ,  John Dallesasse

IPC: G02B6/122 ,  G02B6/136 ,  G02B6/12 ,  H01S5/022 ,  H01L25/16 ,  H01L25/00 ,  H01L33/44 ,  H01L33/48 ,  H01L33/62 ,  H01S5/02 ,  H01L33/00

CPC classification number: H01L25/167 ,  G02B6/12002 ,  G02B6/1225 ,  G02B6/136 ,  G02B2006/12061 ,  G02B2006/12147 ,  H01L25/0753 ,  H01L25/16 ,  H01L25/50 ,  H01L33/0079 ,  H01L33/44 ,  H01L33/486 ,  H01L33/62 ,  H01L2924/00 ,  H01L2924/0002 ,  H01S5/021 ,  H01S5/02272 ,  H01S5/1003

Abstract: A method of fabricating a composite integrated optical device includes providing a substrate comprising a silicon layer, forming a waveguide in the silicon layer, and forming a layer comprising a metal material coupled to the silicon layer. The method also includes providing an optical detector, forming a metal-assisted bond between the metal material and a first portion of the optical detector, forming a direct semiconductor-semiconductor bond between the waveguide, and a second portion of the optical detector.

公开(公告)号：US09882073B2

公开(公告)日：2018-01-30

申请号：US14509979

申请日：2014-10-08

Applicant: Skorpios Technologies, Inc.

Inventor： Stephen B. Krasulick ,  John Dallesasse ,  Amit Mizrahi ,  Timothy Creazzo ,  Elton Marchena ,  John Y. Spann

IPC: H01L31/102 ,  H01L31/0232 ,  H01S5/022 ,  H01S5/026 ,  H01S5/30 ,  H01S5/02

CPC classification number: H01L31/02327 ,  G02B6/423 ,  H01S5/0207 ,  H01S5/021 ,  H01S5/0217 ,  H01S5/0218 ,  H01S5/0224 ,  H01S5/02248 ,  H01S5/02252 ,  H01S5/02268 ,  H01S5/02272 ,  H01S5/02469 ,  H01S5/026 ,  H01S5/3013 ,  H01S2301/176

Abstract: A composite photonic device comprises a platform, a chip, and a contact layer. The platform comprises silicon. The chip is made of a III-V material. The contact layer has indentations to help control a flow of solder during bonding of the platform with the chip. In some embodiments, pedestals are placed under an optical path to prevent solder from flowing between the chip and the platform at the optical path.

公开(公告)号：US20170108649A1

公开(公告)日：2017-04-20

申请号：US15246925

申请日：2016-08-25

Applicant: Skorpios Technologies, Inc.

Inventor： John Dallesasse ,  Stephen B. Krasulick

IPC: G02B6/27 ,  G02F1/09 ,  G02F1/00 ,  G02B6/126

CPC classification number: G02B6/2746 ,  G02B5/3058 ,  G02B6/105 ,  G02B6/126 ,  G02B6/26 ,  G02B6/2726 ,  G02B6/2766 ,  G02B2006/12061 ,  G02F1/0036 ,  G02F1/093

Abstract: An integrated non-reciprocal polarization rotator comprises a substrate, a Faraday crystal, a first waveguide, and a second waveguide. The substrate has a recess extending to a predetermined depth. The Faraday crystal is mounted in the recess and optically coupled with the first waveguide and the second waveguide.

公开(公告)号：US09316785B2

公开(公告)日：2016-04-19

申请号：US14509914

申请日：2014-10-08

Applicant: Skorpios Technologies, Inc.

Inventor： Stephen B. Krasulick ,  John Dallesasse ,  Amit Mizrahi ,  Timothy Creazzo ,  Elton Marchena ,  John Y. Spann

IPC: G02B6/12 ,  G02B6/122 ,  H01S5/022 ,  H01S5/00

CPC classification number: G02B6/1225 ,  G02B6/12004 ,  G02B2006/12176 ,  H01L2224/32225 ,  H01S5/005 ,  H01S5/02252

Abstract: A composite device for splitting photonic functionality across two or more materials comprises a platform, a chip, and a bond securing the chip to the platform. The platform comprises a base layer and a device layer. The device layer comprises silicon and has an opening exposing a portion of the base layer. The chip, a III-V material, comprises an active region (e.g., gain medium for a laser). The chip is bonded to the portion of the base layer exposed by the opening such that the active region of the chip is aligned with the device layer of the platform. A coating hermitically seals the chip in the platform.

Abstract translation: 用于在两种或多种材料上分离光子功能的复合器件包括平台，芯片和将芯片固定到平台的接合。 平台包括基层和器件层。 器件层包括硅并且具有露出基底层的一部分的开口。 芯片III-V材料包括有源区（例如，用于激光的增益介质）。 芯片被接合到由开口暴露的基层的部分，使得芯片的有源区域与平台的器件层对准。 涂层在平台上密封芯片。

公开(公告)号：US09190400B2

公开(公告)日：2015-11-17

申请号：US14135006

申请日：2013-12-19

Applicant: Skorpios Technologies, Inc.

Inventor： Stephen B. Krasulick ,  John Dallesasse

IPC: H01L25/16 ,  H01L25/00 ,  H01S5/022 ,  H01L33/00 ,  H01L33/44 ,  H01L33/48 ,  H01L33/62 ,  H01S5/02

CPC classification number: G02B6/1225 ,  G02B6/12002 ,  G02B6/136 ,  G02B2006/12061 ,  G02B2006/12147 ,  H01L25/167 ,  H01L25/50 ,  H01L33/0079 ,  H01L33/44 ,  H01L33/486 ,  H01L33/62 ,  H01L2924/00 ,  H01L2924/0002 ,  H01S5/021 ,  H01S5/02272

Abstract: A method of fabricating a composite integrated optical device includes providing a substrate comprising a silicon layer, forming a waveguide in the silicon layer, and forming a layer comprising a metal material coupled to the silicon layer. The method also includes providing an optical detector, forming a metal-assisted bond between the metal material and a first portion of the optical detector, forming a direct semiconductor-semiconductor bond between the waveguide, and a second portion of the optical detector.

Abstract translation: 制造复合集成光学器件的方法包括提供包括硅层的衬底，在硅层中形成波导，以及形成包含耦合到硅层的金属材料的层。 该方法还包括提供光学检测器，在金属材料和光学检测器的第一部分之间形成金属辅助结合，在波导与光学检测器的第二部分之间形成直接的半导体 - 半导体结合。

公开(公告)号：US20150098676A1

公开(公告)日：2015-04-09

申请号：US14509914

申请日：2014-10-08

Applicant: Skorpios Technologies, Inc.

Inventor： Stephen B. Krasulick ,  John Dallesasse ,  Amit Mizrahi ,  Timothy Creazzo ,  Elton Marchena ,  John Y. Spann

IPC: G02B6/122

CPC classification number: G02B6/1225 ,  G02B6/12004 ,  G02B2006/12176 ,  H01L2224/32225 ,  H01S5/005 ,  H01S5/02252

Abstract: A composite device for splitting photonic functionality across two or more materials comprises a platform, a chip, and a bond securing the chip to the platform. The platform comprises a base layer and a device layer. The device layer comprises silicon and has an opening exposing a portion of the base layer. The chip, a III-V material, comprises an active region (e.g., gain medium for a laser). The chip is bonded to the portion of the base layer exposed by the opening such that the active region of the chip is aligned with the device layer of the platform. A coating hermitically seals the chip in the platform.

Abstract translation: 用于在两种或多种材料上分离光子功能的复合器件包括平台，芯片和将芯片固定到平台的接合。 平台包括基层和器件层。 器件层包括硅并且具有露出基底层的一部分的开口。 芯片III-V材料包括有源区（例如，用于激光的增益介质）。 芯片被接合到由开口暴露的基层的部分，使得芯片的有源区域与平台的器件层对准。 涂层在平台上密封芯片。

公开(公告)号：US20140342500A1

公开(公告)日：2014-11-20

申请号：US14245191

申请日：2014-04-04

Applicant: Skorpios Technologies, Inc.

Inventor： John Dallesasse ,  Stephen B. Krasulick

IPC: H01L25/16 ,  H01L23/00 ,  H01L33/00 ,  H01L21/78 ,  H01L31/18

CPC classification number: H01L25/167 ,  H01L21/78 ,  H01L21/822 ,  H01L23/50 ,  H01L24/97 ,  H01L31/1876 ,  H01L33/005 ,  H01L33/48 ,  H01L33/52 ,  H01L2924/1204 ,  H01L2924/12042 ,  H01L2924/14 ,  H01S5/0217 ,  H01S5/026 ,  H01L2924/00

Abstract: A method of fabricating a composite semiconductor structure includes providing a substrate including a plurality of devices and providing a compound semiconductor substrate including a plurality of photonic devices. The method also includes dicing the compound semiconductor substrate to provide a plurality of photonic dies. Each die includes one or more of the plurality of photonics devices. The method further includes providing an assembly substrate, mounting the plurality of photonic dies on predetermined portions of the assembly substrate, aligning the substrate and the assembly substrate, joining the substrate and the assembly substrate to form a composite substrate structure, and removing at least a portion of the assembly substrate from the composite substrate structure.

Abstract translation: 制造复合半导体结构的方法包括提供包括多个器件的衬底并提供包括多个光子器件的化合物半导体衬底。 该方法还包括切割化合物半导体衬底以提供多个光子管芯。 每个管芯包括多个光子器件中的一个或多个。 该方法还包括提供组装衬底，将多个光子模具安装在组装衬底的预定部分上，对准衬底和组装衬底，将衬底和组件衬底接合以形成复合衬底结构，并且移除至少一个 从组合衬底结构的组装衬底的一部分。

公开(公告)号：US08722464B2

公开(公告)日：2014-05-13

申请号：US13869408

申请日：2013-04-24

Applicant: Skorpios Technologies, Inc.

Inventor： John Dallesasse ,  Stephen B. Krasulick

IPC: H01L21/00

CPC classification number: H01L25/167 ,  H01L21/78 ,  H01L21/822 ,  H01L23/50 ,  H01L24/97 ,  H01L31/1876 ,  H01L33/005 ,  H01L33/48 ,  H01L33/52 ,  H01L2924/1204 ,  H01L2924/12042 ,  H01L2924/14 ,  H01S5/0217 ,  H01S5/026 ,  H01L2924/00

Abstract: A method of fabricating a composite semiconductor structure includes providing a substrate including a plurality of devices and providing a compound semiconductor substrate including a plurality of photonic devices. The method also includes dicing the compound semiconductor substrate to provide a plurality of photonic dies. Each die includes one or more of the plurality of photonics devices. The method further includes providing an assembly substrate, mounting the plurality of photonic dies on predetermined portions of the assembly substrate, aligning the substrate and the assembly substrate, joining the substrate and the assembly substrate to form a composite substrate structure, and removing at least a portion of the assembly substrate from the composite substrate structure.

Abstract translation: 制造复合半导体结构的方法包括提供包括多个器件的衬底并提供包括多个光子器件的化合物半导体衬底。 该方法还包括切割化合物半导体衬底以提供多个光子管芯。 每个管芯包括多个光子器件中的一个或多个。 该方法还包括提供组装衬底，将多个光子模具安装在组装衬底的预定部分上，对准衬底和组装衬底，将衬底和组件衬底接合以形成复合衬底结构，并且移除至少一个 从组合衬底结构的组装衬底的一部分。