公开(公告)号：JP2007062261A

公开(公告)日：2007-03-15

申请号：JP2005253294

申请日：2005-09-01

Applicant: Sony Corp ,  ソニー株式会社

Inventor： TANIGAWA TORU ,  ANDO MASATO ,  HARAI TOMOHISA ,  IZUMI MASAYOSHI ,  INOUE YOSUKE

IPC: B41J2/05 ,  B41J2/16

Abstract: PROBLEM TO BE SOLVED: To prevent unnecessary radiation and change in quality of liquid from occurring by grounding a nozzle sheet by a simple constitution.
SOLUTION: An electrode 23 of a head chip 20 is exposed from a region not covered by the nozzle sheet 25 of a head chip positioning hole. A flexible wiring substrate 3 is disposed to cover the exposed electrode 23 of the head chip 20 at the side of a face of a module frame 11 where the nozzle sheet 25 is provided. The electrode 23 of the head chip 20 is electrically connected with a wiring pattern 3a of the flexible wiring substrate 3 via an anisotropic conductive film 28. At the same time, the nozzle sheet 25 is electrically grounded via the module frame 11 and the anisotropic conductive film 28.
COPYRIGHT: (C)2007,JPO&INPIT

Abstract translation: 要解决的问题：通过简单的结构来防止不必要的辐射和液体质量的变化，从而使喷嘴片接地。 解决方案：头芯片20的电极23从头芯片定位孔的未被喷嘴片25覆盖的区域露出。 柔性布线基板3设置成覆盖头部芯片20的暴露的电极23的模块框架11的设置有喷嘴片25的面的一侧。 头芯片20的电极23通过各向异性导电膜28与柔性布线基板3的布线图案3a电连接。同时，喷嘴片25经由模块框架11和各向异性导电 电影28.版权所有（C）2007，JPO＆INPIT

公开(公告)号：JP2007015123A

公开(公告)日：2007-01-25

申请号：JP2005196005

申请日：2005-07-05

Applicant: Sony Corp ,  ソニー株式会社

Inventor： TANIGAWA TORU ,  ANDO MASATO ,  SHIROMA ISAO

IPC: B41J2/05 ,  B41J2/16

Abstract: PROBLEM TO BE SOLVED: To prevent an outflow of a sealing material at a connecting part, an exposure part and the like of a wiring board by a simple constitution.
SOLUTION: A nozzle sheet 25 is arranged to have nozzles positioned within a head chip stationing hole of a module frame 11 and to cover a part of the region of the head chip stationing hole. A head chip 20 has a pair of groove parts 24a formed in a barrier layer 24. Each head chip 20 is arranged at each head chip stationing hole so that a heating resistor 22 and the nozzle are opposed to each other and each groove part 24a is disposed on the nozzle sheet 25 at a position where the nozzles are not formed. A flexible wiring board 3 is arranged so that its electrode and an electrode of the head chip 20 are electrically connected to each other. A gap between the head chip 20 of the side where the flexible wiring board 3 is set and the module frame 11 is sealed by the sealing material 29.
COPYRIGHT: (C)2007,JPO&INPIT

Abstract translation: 要解决的问题：为了防止通过简单的结构在配线板的连接部分，曝光部分等处流出密封材料。

解决方案：喷嘴片25布置成具有位于模块框架11的头部芯片驻扎孔内的喷嘴并且覆盖头部芯片固定孔的区域的一部分。 头芯片20具有形成在阻挡层24中的一对槽部24a。每个头部芯片20布置在每个头部芯片驻留孔处，使得加热电阻器22和喷嘴彼此相对，并且每个槽部分24a是 在不形成喷嘴的位置设置在喷嘴片25上。 柔性布线板3被布置成使得其电极和头芯片20的电极彼此电连接。 设置柔性布线板3的一侧的头部芯片20和模块框架11之间的间隙由密封材料29密封。版权所有（C）2007，JPO＆INPIT

公开(公告)号：JP2007007947A

公开(公告)日：2007-01-18

申请号：JP2005190058

申请日：2005-06-29

Applicant: Sony Corp ,  ソニー株式会社

Inventor： ANDO MASATO

IPC: B41J2/05 ,  B41J2/16

Abstract: PROBLEM TO BE SOLVED: To prevent an outflow of a sealing material at a connecting part, an exposing part, etc. of a wiring board by a simple constitution from occurring.
SOLUTION: A module frame 11 has a pair of projections 11e formed to be opposed to each other in a head chip stationing hole. A nozzle sheet 25 is arranged so that nozzles are positioned within the head chip stationing hole of the module frame 11, and is arranged to cover each projection 11e in the head chip stationing hole. Each head chip 20 is arranged in each head chip stationing hole so that a heating resistor and the nozzle are disposed at opposed positions. A flexible wiring board 3 is arranged so that its electrode and an electrode of the head chip 20 are electrically connected with each other. A gap between the head chip 20 and the module frame 11 of the side where the flexible wiring board 3 is set is sealed by the sealing material 29.
COPYRIGHT: (C)2007,JPO&INPIT

Abstract translation: 要解决的问题：通过简单的结构来防止密封材料在连接部分，露出部分等的流出。 解决方案：模块框架11具有在头芯片固定孔中彼此相对形成的一对突起11e。 喷嘴片25布置成使得喷嘴位于模块框架11的头部芯片固定孔内，并且布置成覆盖头部芯片驻留孔中的每个突起11e。 每个头部芯片20布置在每个头部芯片驻留孔中，使得加热电阻器和喷嘴设置在相对的位置。 柔性布线板3被布置成使得其电极和头芯片20的电极彼此电连接。 头部芯片20和设置柔性布线板3的一侧的模块框架11之间的间隙被密封材料29密封。版权所有（C）2007，JPO＆INPIT

公开(公告)号：JP2005225190A

公开(公告)日：2005-08-25

申请号：JP2004038558

申请日：2004-02-16

Applicant: Sony Corp ,  ソニー株式会社

Inventor： MIYAZAKI AKIHITO ,  NAKAMURA MASATO ,  TAKAKURA SHIGEYUKI ,  HIRASHIMA SHIGEYOSHI ,  ANDO MASATO ,  NISHI SHOTA ,  ENOMOTO SADAO

IPC: B41J2/175 ,  B05C5/00 ,  B05C11/10 ,  B41J2/18 ,  B41J2/185

Abstract: PROBLEM TO BE SOLVED: To transmit a driving force of a driving part to an operation part of a pressure generating part by making the pressure generating part of a liquid circulating means and its driving part separate members, and combining a head cartridge into an apparatus body part.
SOLUTION: The head cartridge 3 equipped with a liquid delivery pump 10 which is disposed on an ink reflux line for returning ink from an ink discharging head 7 to an ink tank 6 and includes the pressure generating part for sucking and discharging to circulate the ink between the ink discharging head 7 and the ink tank 6 is combined into a predetermined part of a printer body part 2 equipped with both the driving part 32 for generating the driving force to operate the pressure generating part of the liquid delivery pump 10 of the head cartridge 3 and a control part 33 for controlling the operation of the driving part 32. Thus the driving force of the driving part 32 can be transmitted to the operation part 28 of the pressure generating part of the liquid delivery pump 10.
COPYRIGHT: (C)2005,JPO&NCIPI

Abstract translation: 要解决的问题：通过使液体循环装置的压力产生部分及其驱动部分分离部件将驱动部件的驱动力传递到压力产生部件的操作部分，并将头盒组合成 装置主体部分。 解决方案：装有液体输送泵10的头盒3，该液体输送泵10设置在墨水回流管线上，用于将墨水从喷墨头7返回到墨水罐6，并且包括用于吸引和排出的压力产生部件 喷墨头7和墨水罐6之间的墨水被组合到打印机主体部分2的预定部分中，打印机主体部件2配备有用于产生驱动力的驱动部件32，以操作液体输送泵10的压力产生部分 头盒3和用于控制驱动部32的操作的控制部33.因此，驱动部32的驱动力可以传递到液体输送泵10的压力产生部的操作部28。

版权所有（C）2005，JPO＆NCIPI

公开(公告)号：JP2005138523A

公开(公告)日：2005-06-02

申请号：JP2003379423

申请日：2003-11-10

Applicant: Sony Corp ,  ソニー株式会社

Inventor： TANIGAWA TORU ,  ANDO MASATO ,  MURAKAMI TAKAAKI

IPC: B41J2/05 ,  B41J2/16

Abstract: PROBLEM TO BE SOLVED: To form a head ensuring high positional accuracy between a head chip and a nozzle sheet and applicable to a line head without increasing a manufacturing cost.
SOLUTION: The head module comprises a head chip 20 arranged with heating resistors 22, a nozzle sheet 13 on which nozzles 13a are formed, and a barrier layer 12 for forming an ink liquid chamber 14 wherein a particle spacer 17 composed of particles having a diameter not larger than the thickness of the barrier layer 12 is arranged between the head chip 20 and the nozzle sheet 13.
COPYRIGHT: (C)2005,JPO&NCIPI

Abstract translation: 要解决的问题：形成头部芯片和喷嘴片之间的高位置精度的头部，并且可以用于线头而不增加制造成本。 解决方案：头模块包括配置有加热电阻器22的头芯片20，其上形成有喷嘴13a的喷嘴片13和用于形成墨液室14的阻挡层12，其中由颗粒构成的颗粒间隔物17 具有不大于阻挡层12的厚度的直径布置在头部芯片20和喷嘴片13之间。版权所有（C）2005，JPO＆NCIPI

公开(公告)号：JP2005138522A

公开(公告)日：2005-06-02

申请号：JP2003379422

申请日：2003-11-10

Applicant: Sony Corp ,  ソニー株式会社

Inventor： TANIGAWA TORU ,  ANDO MASATO ,  HORII SHINICHI ,  NAKAMURA MASATO

IPC: B41J2/05

Abstract: PROBLEM TO BE SOLVED: To form a head especially ensuring positional accuracy between colors in the head chip of each color for color print and applicable to a line head.
SOLUTION: The head module comprises a head chip 20 arranged with heating resistors, a nozzle sheet 13 on which nozzles are formed, a barrier layer for forming an ink liquid chamber, and a module frame 11 for supporting the nozzle sheet 13 by being stuck thereto and provided with a hole 11b for arranging the head chip 20. A nozzle array in the region of n-th (n is a natural number) head chip arranging hole 11b and a nozzle array in the region of (n+1)th head chip arranging hole 11b formed in parallel with the direction intersecting the arranging direction of the nozzle array formed in the head chip arranging hole 11b (longitudinal direction of the head chip 20 on the drawing) perpendicularly are arranged to eject ink of different colors.
COPYRIGHT: (C)2005,JPO&NCIPI

Abstract translation: 要解决的问题：形成头部，特别是确保用于彩色打印的每种颜色的头部芯片中的颜色之间的位置精度并且适用于线头。 解决方案：头模块包括配置有加热电阻器的头芯片20，其上形成有喷嘴的喷嘴片13，用于形成墨液室的阻挡层，以及用于支撑喷嘴片13的模块框架11 粘贴在其上并设置有用于布置头芯片20的孔11b。在第（n + 1）区域中的第n（n是自然数）区域中的喷嘴阵列，头芯片排列孔11b和喷嘴阵列 垂直地布置有与形成在头芯片布置孔11b中的喷嘴阵列的布置方向（图中的头芯片20的纵向）垂直的方向平行形成的头部芯片布置孔11b，以喷射不同颜色的墨 。 版权所有（C）2005，JPO＆NCIPI

公开(公告)号：JP2005125670A

公开(公告)日：2005-05-19

申请号：JP2003364942

申请日：2003-10-24

Applicant: Sony Corp ,  ソニー株式会社

Inventor： ANDO MASATO ,  HIRASHIMA SHIGEYOSHI ,  ODA ATSUSHI ,  NAKAMICHI SEKIJI

IPC: B41J2/175

Abstract: PROBLEM TO BE SOLVED: To remove bubbles contained in liquid by generating a negative pressure in a liquid ejection head between the liquid ejection head and a liquid tank located lower than the liquid ejection head and circulating the liquid between them thereby preventing leakage of liquid from a nozzle during circulation.
SOLUTION: The liquid ejector comprises a print head 1 ejecting ink 7 from an ink ejection nozzle 10 formed in the nozzle surface 9, a conduit 3 for supplying the print head 1 with ink 7 from an ink tank 2 storing the ink 7 being fed into the print head 1, an ink circulation conduit 4 for returning ink 7 from the print head 1 back to the ink tank 2, and a liquid feed pump 5 arranged on the ink circulation conduit 4 and circulating the ink between the print head 1 and the ink tank 2. The ink tank 2 can be located lower than the print head 1 and the ink 7 is circulated between them by driving a liquid feed pump 5 to generate a negative pressure.
COPYRIGHT: (C)2005,JPO&NCIPI

Abstract translation: 要解决的问题：为了通过在液体喷射头和位于低于液体喷射头的液体罐之间的液体喷射头中产生负压而在液体中除去气泡，并使液体在它们之间循环，从而防止泄漏 在循环期间来自喷嘴的液体。 解决方案：液体喷射器包括从形成在喷嘴表面9中的喷墨嘴10喷射墨7的打印头1，用于从存储墨7的墨罐2向打印头1供应墨7的导管3 被供给到打印头1中，用于将墨水7从打印头1返回到墨水罐2的墨水循环管道4和布置在墨水循环管道4上并使墨水在打印头之间循环的液体供给泵5 油墨罐2可以位于比打印头1低的位置，油墨7通过驱动液体供给泵5而在它们之间循环以产生负压。 版权所有（C）2005，JPO＆NCIPI

公开(公告)号：JP2005125669A

公开(公告)日：2005-05-19

申请号：JP2003364941

申请日：2003-10-24

Applicant: Sony Corp ,  ソニー株式会社

Inventor： ANDO MASATO ,  MIYAZAKI AKIHITO ,  NISHI SHOTA ,  NAMEKAWA TAKUMI ,  HIRASHIMA SHIGEYOSHI ,  NAKAMURA MASATO

IPC: B41J2/175

Abstract: PROBLEM TO BE SOLVED: To prevent air from being entrained through a liquid ejection nozzle by reducing liquid suction pressure in a liquid circulation conduit when liquid is circulated between a liquid ejection head and a liquid tank by generating a negative pressure in the liquid ejection head.
SOLUTION: Ink 8 being fed from a plurality of ink ejection nozzles 27 formed in the nozzle surface 10 to a liquid chamber 9 in a print head 2 for ejecting ink is stored in an ink tank 3. Ink 8 is fed from the ink tank 3 through an ink supply conduit 4 to the print head 2 thence returned from the print head 2 through an ink circulation conduit 5 back to the ink tank 3. A negative pressure is generated in the print head 2 by driving a liquid feed pump 6 arranged on the ink circulation conduit 5 and ink is circulated between the print head 2 and the ink tank 3. Ink suction pressure in the ink circulation conduit 5 is reduced at a pressure regulating section 26 arranged on the ink circulation conduit 5 between the liquid feed pump 6 and the print head 2.
COPYRIGHT: (C)2005,JPO&NCIPI

Abstract translation: 要解决的问题：为了通过在液体在液体喷射头和液体罐之间循环而在液体中产生负压而减小液体循环管道中的液体吸入压力来防止空气通过液体喷射嘴夹带， 喷头 解决方案：将从喷嘴表面10中形成的多个喷墨喷嘴27供给到用于喷射墨水的打印头2中的液体室9的墨8被储存在墨盒3中。墨水8从 墨水盒3通过墨水供应导管4到打印头2从打印头2通过墨循环导管5返回到墨盒3.通过驱动液体供给泵在打印头2中产生负压 布置在墨水循环导管5上，并且墨水在打印头2和墨水盒3之间循环。墨水循环导管5中的墨水吸入压力在设置在墨水循环导管5上的压力调节部分26之间在液体 进料泵6和打印头2.版权所有（C）2005，JPO＆NCIPI

公开(公告)号：JP2003154659A

公开(公告)日：2003-05-27

申请号：JP2001357284

申请日：2001-11-22

Applicant: SONY CORP

Inventor： ANDO MASATO ,  TOKUNAGA HIROSHI ,  MIYAZAKI AKIHITO ,  NAKAMURA MASATO ,  HORII SHINICHI

IPC: B41J2/05 ,  B41J2/16

Abstract: PROBLEM TO BE SOLVED: To decrease positional shift between a heating resistor and an ink ejection nozzle. SOLUTION: In the method for manufacturing a print head comprising a nozzle sheet 2 having ink ejection nozzles 3 formed therein, a head frame 4 for supporting the nozzle sheet 2, a substrate member 6 having heating resistors 8, and a channel plate 12 for supplying ink wherein the head frame 4 and the substrate member 6 have a substantially equal coefficient of linear expansion, the nozzle sheet 2 has a coefficient of linear expansion larger than that of the head frame 4 and the substrate member 6, and the channel plate 12 is formed of a material having Young's modulus smaller than that of steel, the nozzle sheet 2 and the head frame 4 are bonded at a temperature higher than the room temperature, the nozzle sheet 2 and the substrate member 6 are bonded at a temperature higher than the room temperature but lower than the bonding temperature of the nozzle sheet 2 and the head frame 4, and the channel plate 12 and the nozzle sheet 2, and the head frame 4 and the substrate member 6 are bonded at a temperature lower than the bonding temperature of the nozzle sheet 2 and the head frame 4.

公开(公告)号：JP2002264349A

公开(公告)日：2002-09-18

申请号：JP2001073144

申请日：2001-03-14

Applicant: SONY CORP

Inventor： NISHI SHOTA ,  ANDO MASATO

IPC: B41J2/165

Abstract: PROBLEM TO BE SOLVED: To prevent an ink discharge face of a printing head from damage, prevent ink colors from mixing, and facilitate replacing cleaning members. SOLUTION: There are provided a head cap 5 formed in conformity with a length of the printing head 4 which has the ink discharge face 6 with ink discharge openings set for discharging ink supplied from an ink cartridge 3, a cleaning sheet 7 set along a longitudinal direction of the head cap 5 and detachably to the side of the printing head 4 of the head cap 5 for cleaning the ink discharge face 6 of the printing head 4, a pressing plate body 8 for pressing the cleaning sheet 7 to the ink discharge face 6 of the printing head 4, and a pushing and moving mechanism (12) for pushing up the pressing plate body 8 towards the ink discharge face 6 of the printing head 4.