Abstract:
PROBLEM TO BE SOLVED: To provide a solid state image pickup device and an electronic apparatus, which have more excellent color reproducibility.SOLUTION: A solid state image pickup device comprises: a plurality of photoelectric conversion regions 23B, 23G, 23R laminated for every one pixel inside the same semiconductor substrate 22 at depths different from one another for photoelectric converting lights of wavelength regions different from one another; and a discharge region 24 formed between the photoelectric conversion regions 23B and 23G or between the photoelectric conversion regions 23G and 23R which are adjacent to each other in a depth direction of the semiconductor substrate among the plurality of photoelectric conversion regions 23B, 23G, 23R for discharging charge generated by photoelectric conversion in a region between the photoelectric conversion regions 23B and 23G or between the photoelectric conversion regions 23G and 23R.
Abstract:
PROBLEM TO BE SOLVED: To enable influence of unnecessary wavelength-region components such as infrared light to be eliminated, even if an infrared filter is not used, in an imaging device.SOLUTION: A visible light region is detected by each detecting unit, after performing wavelength separation through filters C1, C2, C3, while an infrared light region is detected by a detection unit, after performing the wavelength separation through a filter C4. An imaging signal relating to visible light region components from which the influences of infrared light region components are eliminated is acquired by correcting signals SC1, SC2, SC3 detected through the filters C1, C2, C3 using a signal SC4 detected through the filter C4.
Abstract:
PROBLEM TO BE SOLVED: To provide a solid-state imaging device capable of improving a resolution. SOLUTION: The solid-state imaging device includes a chip 13 of a solid-state imaging element, an imaging lens 11 for forming an image of light to the solid-state imaging element, and a material provided between the image-forming lens 11 and the chip 13 and having a refractive index larger than 1. The material with the refractive index larger than 1 constitutes an optical component 16 including a planar part 16B and a convex-shaped part 16A. The convex-shaped part 16A of the optical component 16 is in contact with the top of the uppermost layer of the chip 13. Thus, the solid-state imaging device having a contact width of the convex-shaped part 16A and the uppermost layer of the chip 13 of 800 nm or smaller is constituted. COPYRIGHT: (C)2011,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a solid-state imaging element securing a sufficient S/N ratio by reducing noise by a dark current. SOLUTION: This solid-state imaging element 1 includes: a semiconductor layer 11 formed of silicon; a photoelectric conversion element PD formed in the semiconductor layer 11; and a single-crystal layer 25 formed at least on a part of the semiconductor layer 11 formed with the photoelectric conversion element PD thereon and formed of SiGeC. COPYRIGHT: (C)2010,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a solid-state image-taking apparatus capable of improving resolution. SOLUTION: The solid-state image-taking apparatus includes a chip 13 of a solid-state image-taking device, an imaging lens 11 configured to focus light on the solid-state image-taking device, and a material 14 of a refraction index larger than 1, which is arranged between the imaging lens 11 and chip 13. COPYRIGHT: (C)2010,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To use a common signal processing circuit to process a pixel signal taken out after thinning addition of signals and that taken out through all pixel reading, even if an oblique A checkered pattern is employed as a color filter array of a solid state imaging apparatus. SOLUTION: The solid state imaging apparatus includes a pixel array in which a plurality of pixels are arranged in matrix and in two dimension, with a pixel array in oblique grid, and a color filter array which uses color filters of R, G, B, and A in oblique A checkered structure. When it is driven in a thinning addition mode, three pixels adjoining in row direction are assumed as a unit pixel block, relating to the pixels for which color filters of R, G, and B are arrayed. In the unit pixel block, every other pixels starting with one arrayed at the end of the pixel block, in row direction, are objects for signal addition, while other than those are objects for signal thinning. Thinning addition is performed on pixel signal in units of pixel blocks adjoining each other in row direction. COPYRIGHT: (C)2008,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a CCD solid-state imaging device capable of reading all picture elements with a high resolution even in a structure for obtaining a wide dynamic range or a structure capable of obtaining multiple color signals from the same picture element. SOLUTION: The solid-state imaging device 101 capable of reading all picture elements contains picture element arrays arranged in lines with multiple picture elements (photo diode 121(122)), each having two lines of vertical charge-coupled devices (vertical CCDs) 141, 142 (143, 144). COPYRIGHT: (C)2008,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To independently and simultaneously obtain a color image and an infrared ray image with one image sensor. SOLUTION: In a physical information acquiring method, a wiring layer constituting a signal line for reading an image signal from an in-pixel amplifier is formed on a semiconductor element where a photodiode and the in-pixel amplifier or the like are formed, and there is formed on the wiring layer a laminate film 1 that includes a structure where a plurality of layers having different refractive indexes between adjacent layers and having different predetermined thicknesses, and that has a characteristic where infrared rays IR are reflected and visible light VL is passed. For a plurality of pixels constituting a unit pixel matrix 12 infrared light is cut or is not cut for every pixel. Color filters 14R, 14G, and 14B for color imaging are formed on the laminate film 1 correspondingly to color pixels 12R, 12G, 12B. A color image is obtained on the basis of a pixel signal from the pixels 12R, 12G, and 12B where the laminate film 1 is formed. An infrared ray image is obtained on the basis of a pixel signal from a pixel 12IR where no laminate film 1 is formed. COPYRIGHT: (C)2006,JPO&NCIPI
Abstract:
PROBLEM TO BE SOLVED: To provide a photoelectric conversion element capable of achieving a further improvement in photoelectric conversion efficiency. SOLUTION: The photoelectric conversion element of the present invention comprises a photoelectric conversion layer 20 having a periodic structure and exhibiting a light confinement effect based on Bragg reflection resulting from the periodic structure. The periodic structure is formed of a multilayer film lamination structure 21, 22. Alternatively, the periodic structure is preferably formed of a photonic crystal. COPYRIGHT: (C)2006,JPO&NCIPI