公开(公告)号：US20110215563A1

公开(公告)日：2011-09-08

申请号：US13000898

申请日：2009-06-22

Applicant: Sandrine Rancien ,  Thibaut Le Loarer ,  Gaetan Le Gouic

Inventor： Sandrine Rancien ,  Thibaut Le Loarer ,  Gaetan Le Gouic

IPC: B42D15/00

CPC classification number: B42D25/333 ,  B42D25/00 ,  B42D25/351 ,  B42D2033/06 ,  B42D2033/28 ,  B42D2033/30 ,  B42D2033/46 ,  B42D2035/36 ,  G06K19/025 ,  G06K19/07749 ,  G06K19/10 ,  G06K19/16

Abstract: The invention provides a structure comprising: a fiber layer; a sub-structure including a translucent region; a watermark or pseudo-watermark carried by the fiber layer and superposed at least in part with the translucent region of the sub-structure, such that, in the translucent region of the sub-structure, the watermark or pseudo-watermark is observable in light transmitted through the structure only from the face of the structure that is adjacent to the fiber layer; and an integrated microcircuit device for communicating with or without contact.

Abstract translation: 本发明提供一种结构，包括：纤维层; 包括半透明区域的子结构; 由纤维层承载的水印或伪水印，至少部分地与子结构的半透明区域重叠，使得在子结构的半透明区域中，水印或伪水印在光中是可观察的 仅从与纤维层相邻的结构的表面透过结构; 以及用于与或不具有接触通信的集成微电路设备。

公开(公告)号：US20100295291A1

公开(公告)日：2010-11-25

申请号：US12682645

申请日：2008-10-09

Applicant: Sandrine Rancien ,  Alban Remy ,  Michel Camus ,  Pierre Doublet ,  Manuel Deloche

Inventor： Sandrine Rancien ,  Alban Remy ,  Michel Camus ,  Pierre Doublet ,  Manuel Deloche

IPC: B42D15/00 ,  B44F1/06

CPC classification number: B42D25/333 ,  B42D25/00 ,  B42D25/21 ,  B42D25/24 ,  B42D25/29 ,  B42D25/45 ,  B42D25/455 ,  B42D25/46 ,  B42D25/47 ,  B42D2033/06 ,  B42D2033/18 ,  B42D2033/20 ,  B42D2033/24 ,  B42D2033/28 ,  B42D2033/30 ,  B42D2033/46 ,  B42D2035/24 ,  D21H21/40 ,  D21H27/02 ,  D21H27/30 ,  D21H27/36

Abstract: The invention relates to a sheet having a recto face and a verso face together with at least one watermark or pseudo-watermark and such that at least part of said watermark or pseudo-watermark is observable in transmitted light from only one of the faces of said sheet.

Abstract translation: 本发明涉及一种具有正面和多面以及至少一个水印或伪水印的纸张，并且使得所述水印或伪水印的至少一部分仅在所述水印或伪水印的一个面的透射光中是可观察到的 片。

公开(公告)号：US20100282855A1

公开(公告)日：2010-11-11

申请号：US12805166

申请日：2010-07-15

Applicant: Sandrine Rancien ,  Thierry Mayade

Inventor： Sandrine Rancien ,  Thierry Mayade

IPC: G06K19/07 ,  B42D15/10

CPC classification number: G06K19/07758 ,  B42D25/24 ,  G06K19/025 ,  G06K19/027 ,  G06K19/07728 ,  G06K19/07745 ,  G06K19/07749 ,  H01L2924/0002 ,  Y10T156/1039 ,  H01L2924/00

Abstract: The invention relates to a multilayer structure such as a cover paper for a booklet, in particular a passport. The structure includes a radiofrequency identification device having a chip which is received in the thickness of the multilayer structure without generating extra thickness, the materials constituting the various layers of the multilayer structure are selected, as are the thicknesses of said layers, in such a manner that the cover withstands mechanical and thermal shocks, and in particular is capable of being subjected to graining treatment, and/or to decoration treatment by depositing a film by hot transfer under pressure, and/or to lamination treatment while depositing security films.

Abstract translation: 本发明涉及一种多层结构，例如小册子的封面纸，特别是护照。 该结构包括射频识别装置，其具有以多层结构的厚度接收的芯片，而不产生额外的厚度，选择构成多层结构的各个层的材料以及所述层的厚度，以这样的方式 特别是能够承受机械和热冲击，并且特别是能够进行磨粒处理，和/或通过在压力下热转印来沉积膜和/或在沉积安全膜的同时进行层压处理来进行装饰处理。

公开(公告)号：US20090087651A1

公开(公告)日：2009-04-02

申请号：US12213164

申请日：2008-06-16

Applicant: Pierre Doublet ,  Sandrine Rancien

Inventor： Pierre Doublet ,  Sandrine Rancien

IPC: B32B3/00

CPC classification number: B32B27/14 ,  B32B5/16 ,  B32B27/04 ,  B32B2307/412 ,  B32B2457/00 ,  G06K19/07749 ,  Y10T428/26 ,  Y10T428/266 ,  Y10T428/2813 ,  Y10T428/31721

Abstract: The present invention relates to a laminating film comprising: a flexible film that is transparent at least in part; a flexible chip fastened to a face of the film; and a thickness-compensating layer, covering the film at least in part around the chip.

Abstract translation: 本发明涉及层压膜，其包括：至少部分透明的柔性膜; 固定在薄膜表面上的柔性芯片; 以及厚度补偿层，至少部分地围绕芯片覆盖该膜。

公开(公告)号：US07429308B2

公开(公告)日：2008-09-30

申请号：US10472828

申请日：2002-07-30

Applicant: Sandrine Rancien ,  Jacques Terliska

Inventor： Sandrine Rancien ,  Jacques Terliska

IPC: D21H21/42 ,  G06K19/077

CPC classification number: G07F7/086 ,  D21H21/48 ,  G06K19/022 ,  G06K19/07743 ,  G06K19/07749 ,  G07D7/01

Abstract: The present invention provides a method of manufacturing an article comprising a fiber layer and at least one electronic chip, the fiber layer being formed by depositing fibers on a surface immersed in a dispersion of fiber material. The method includes the following step:Using an elongate flexible support to bring the electronic chip into contact with the fiber layer that is being formed.

公开(公告)号：US20080202715A1

公开(公告)日：2008-08-28

申请号：US12081910

申请日：2008-04-23

Applicant: Sandrine Rancien ,  Jacques Terliska

Inventor： Sandrine Rancien ,  Jacques Terliska

IPC: D21H21/00

CPC classification number: G07F7/086 ,  D21H21/48 ,  G06K19/022 ,  G06K19/07743 ,  G06K19/07749 ,  G07D7/01

Abstract: The present invention provides a method of manufacturing an article comprising a fiber layer and at least one electronic chip, the fiber layer being formed by depositing fibers on a surface immersed in a dispersion of fiber material. The method includes the following step: Using an elongate flexible support to bring the electronic chip into contact with the fiber layer that is being formed.

Abstract translation: 本发明提供一种制造包含纤维层和至少一个电子芯片的制品的方法，所述纤维层通过在浸渍在纤维材料分散体中的表面上沉积纤维而形成。 该方法包括以下步骤：使用细长的柔性支撑件使电子芯片与正在形成的纤维层接触。