Abstract:
The present invention relates to a sectional document (100) comprising: —a support (101) that defines at least two sections (101a, 1010b) connected by at least one fold line (102), —a structure linked to the support (101), especially at the fold line (102), with a possibility of movement relative to the latter and extending at least partially between the two sections (101a, 101b) when the sectional document is folded, the structure comprising: —a fibrous layer (103a, 103b, 104a, 104b), —a substructure (120) comprising a translucent region, —a watermark or pseudo-watermark (10a) borne by the fibrous layer and being superposed at least partially at the translucent region of the substructure, so that the watermark or pseudo-watermark can be observed in light transmitted through the structure, at the translucent region of the substructure, only from the face of the structure situate on the side of the fibrous layer.
Abstract:
The invention provides a structure comprising: a fiber layer; a sub-structure including a translucent region; a watermark or pseudo-watermark carried by the fiber layer and superposed at least in part with the translucent region of the sub-structure, such that, in the translucent region of the sub-structure, the watermark or pseudo-watermark is observable in light transmitted through the structure only from the face of the structure that is adjacent to the fiber layer; and an integrated microcircuit device for communicating with or without contact.
Abstract:
The invention relates to a sheet having a recto face and a verso face together with at least one watermark or pseudo-watermark and such that at least part of said watermark or pseudo-watermark is observable in transmitted light from only one of the faces of said sheet.
Abstract:
The present invention relates to a laminating film comprising: a flexible film that is transparent at least in part; a flexible chip fastened to a face of the film; and a thickness-compensating layer, covering the film at least in part around the chip.
Abstract:
The present invention provides a method of manufacturing an article comprising a fiber layer and at least one electronic chip, the fiber layer being formed by depositing fibers on a surface immersed in a dispersion of fiber material. The method includes the following step:Using an elongate flexible support to bring the electronic chip into contact with the fiber layer that is being formed.
Abstract:
The present invention provides a method of manufacturing an article comprising a fiber layer and at least one electronic chip, the fiber layer being formed by depositing fibers on a surface immersed in a dispersion of fiber material. The method includes the following step: Using an elongate flexible support to bring the electronic chip into contact with the fiber layer that is being formed.