Sectional Documents Comprising a Structure Equipped with a Watermark or Pseudo-Watermark and Associated Process
    31.
    发明申请
    Sectional Documents Comprising a Structure Equipped with a Watermark or Pseudo-Watermark and Associated Process 审中-公开
    包含水印或伪水印及相关过程的结构的剖面文件

    公开(公告)号:US20120104102A1

    公开(公告)日:2012-05-03

    申请号:US13263680

    申请日:2010-04-12

    Abstract: The present invention relates to a sectional document (100) comprising: —a support (101) that defines at least two sections (101a, 1010b) connected by at least one fold line (102), —a structure linked to the support (101), especially at the fold line (102), with a possibility of movement relative to the latter and extending at least partially between the two sections (101a, 101b) when the sectional document is folded, the structure comprising: —a fibrous layer (103a, 103b, 104a, 104b), —a substructure (120) comprising a translucent region, —a watermark or pseudo-watermark (10a) borne by the fibrous layer and being superposed at least partially at the translucent region of the substructure, so that the watermark or pseudo-watermark can be observed in light transmitted through the structure, at the translucent region of the substructure, only from the face of the structure situate on the side of the fibrous layer.

    Abstract translation: 本发明涉及一种分段文件(100),包括: - 一个支撑件(101),其限定由至少一个折叠线(102)连接的至少两个部分(101a,1010b), - 连接到所述支撑件 ),特别是在折叠线(102)处,具有相对于后者移动的可能性,并且当部分文档被折叠时至少部分地在两个部分(101a,101b)之间延伸,该结构包括: - 纤维层 103a,103b,104a,104b), - 包括半透明区域的子结构(120),由纤维层承载并至少部分地叠置在子结构的半透明区域的水印或伪水印(10a),因此 可以在透射结构的光中观察到水印或伪水印,在子结构的半透明区域,只有结构的表面位于纤维层的侧面。

    Method of manufacturing an article comprising at least one electronic chip
    36.
    发明申请
    Method of manufacturing an article comprising at least one electronic chip 审中-公开
    制造包含至少一个电子芯片的制品的方法

    公开(公告)号:US20080202715A1

    公开(公告)日:2008-08-28

    申请号:US12081910

    申请日:2008-04-23

    Abstract: The present invention provides a method of manufacturing an article comprising a fiber layer and at least one electronic chip, the fiber layer being formed by depositing fibers on a surface immersed in a dispersion of fiber material. The method includes the following step: Using an elongate flexible support to bring the electronic chip into contact with the fiber layer that is being formed.

    Abstract translation: 本发明提供一种制造包含纤维层和至少一个电子芯片的制品的方法,所述纤维层通过在浸渍在纤维材料分散体中的表面上沉积纤维而形成。 该方法包括以下步骤:使用细长的柔性支撑件使电子芯片与正在形成的纤维层接触。

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