公开(公告)号：JP2006113750A

公开(公告)日：2006-04-27

申请号：JP2004299307

申请日：2004-10-13

Applicant: Toppan Forms Co Ltd ,  トッパン・フォームズ株式会社

Inventor： KAGAYA HITOSHI

IPC: G06K19/077 ,  B42D15/10 ,  G06K19/07 ,  H01F17/00 ,  H01F17/04 ,  H04B1/59 ,  H04B5/02

Abstract: PROBLEM TO BE SOLVED: To provide a contactless data receiver and transmitter which suppresses the increase of a thickness in the contactless data receiver and transmitter and can be used by inducing electromotive force which fully exceeds the operation electromotive force of an IC chip even when contacting an article containing at least metal. SOLUTION: The contactless data receiver and transmitter comprises a base material; an inlet which is arranged on one surface of the base material, having an antenna and an IC chip which are mutually connected; and a magnetic material layer which is arranged to cover the antenna and the IC chip which constitute the inlet. The magnetic material layer is obtained by including, in its film thickness: areas α, β which do not depend on a communication distance; and an area γ which depends on the communication distance and is positioned between the areas α and β. COPYRIGHT: (C)2006,JPO&NCIPI

Abstract translation: 要解决的问题：提供一种非接触数据接收器和发送器，其抑制非接触数据接收器和发送器中的厚度的增加，并且可以通过感应电动势来使用，该电动势甚至完全超过IC芯片的操作电动势 当接触至少含有金属的物品时。 解决方案：非接触式数据接收机和发射机包括基材; 布置在基材的一个表面上的入口，具有相互连接的天线和IC芯片; 以及设置成覆盖构成入口的天线和IC芯片的磁性材料层。 磁性材料层通过在其膜厚度中包括不依赖于通信距离的区域α，β来获得; 以及取决于通信距离并位于区域α和β之间的区域γ。 版权所有（C）2006，JPO＆NCIPI

公开(公告)号：JP2006031599A

公开(公告)日：2006-02-02

申请号：JP2004212853

申请日：2004-07-21

Applicant: Toppan Forms Co Ltd ,  トッパン・フォームズ株式会社

Inventor： KAGAYA HITOSHI ,  YAMAGAMI TAKESHI ,  IDE YOSHIAKI

IPC: G06K19/077 ,  B42D15/10 ,  G06K19/07 ,  H01L23/29 ,  H01L23/31

Abstract: PROBLEM TO BE SOLVED: To provide a semiconductor device which reduces possibility that an IC chip is broken or that wire breakage is generated in connection of the IC chip and a wiring line formed on a base material, when or after producing a semiconductor device wherein a semiconductor substrate with the IC chip mounted on the base material is sealed by a resin, and suppresses reduction of a function in the semiconductor substrate, and also to provide a production method therefor. SOLUTION: A non-contact type IC tag 10 has: an inlet 15 comprising the base material 11, and the IC chip 13 and an antenna 12 provided on one face thereof and electrically connected to each other; a magnetic material layer 20 disposed such that the magnetic material layer 20 covers the IC chip 13 and the antenna 12 constituting the inlet 15; and a casing 25 comprising a first resin member 21 and a second resin member 23 provided to envelop the inlet 15 disposed with the magnetic material layer 20. COPYRIGHT: (C)2006,JPO&NCIPI

Abstract translation: 要解决的问题：为了提供一种降低IC芯片断裂的可能性或在IC芯片和形成在基材上的布线之间产生断线的半导体器件，当制造半导体时 其中具有安装在基材上的IC芯片的半导体衬底被树脂密封，并且抑制半导体衬底中的功能的降低，并且还提供其制造方法。 解决方案：非接触型IC标签10具有：包括基材11的入口15和IC芯片13以及设置在其一个面上并彼此电连接的天线12; 以使得磁性材料层20覆盖构成入口15的IC芯片13和天线12的方式配置的磁性材料层20; 以及壳体25，其包括设置成包围设置有磁性材料层20的入口15的第一树脂构件21和第二树脂构件23.版权所有（C）2006，JPO＆NCIPI

公开(公告)号：JP2005353643A

公开(公告)日：2005-12-22

申请号：JP2004169595

申请日：2004-06-08

Applicant: Toppan Forms Co Ltd ,  トッパン・フォームズ株式会社

Inventor： KAGAYA HITOSHI ,  ONO HIROKI

IPC: H05K13/04

Abstract: PROBLEM TO BE SOLVED: To provide a semiconductor part for relocating each semiconductor chip at a prescribed position to a desired base without taking out of a substrate, or the like, and to provide a method for manufacturing the semiconductor part. SOLUTION: In a method for mounting a semiconductor part 20, the semiconductor part 20 in which at least one portion of a semiconductor chip 12 is in contact with a base 11 made of a first synthetic resin is passed through an adhesive liquid 40 in a solid state, the semiconductor part 20 in which the adhesive liquid 40 is adhered is injected toward a body 50 to be deposited, and the semiconductor part 20 in which the adhesive liquid 40 is adhered is deposited on the body 50 to be deposited. In the method for mounting the semiconductor part 20, at least one portion of a part in which the semiconductor chip 12 is exposed is covered with a covering material 13 made of a second synthetic resin that has a lower melt point than that of the first synthetic resin for forming the base 11. COPYRIGHT: (C)2006,JPO&NCIPI

Abstract translation: 要解决的问题：提供一种半导体部件，用于将规定位置的每个半导体芯片重定位到期望的基底而不从基板等中取出，并提供半导体部件的制造方法。 解决方案：在半导体部件20的安装方法中，半导体芯片12的至少一部分与由第一合成树脂制成的基座11接触的半导体部件20通过粘合剂液体40 在固体状态下，将粘附有液体40的半导体部件20朝向要沉积的主体50注入，并且将附着有粘合剂液体40的半导体部件20沉积在主体50上以进行沉积。 在半导体部件20的安装方法中，半导体芯片12露出的部分的至少一部分被第二合成树脂制成的覆盖材料13覆盖，第二合成树脂的熔点低于第一合成树脂 用于形成基底11的树脂。版权所有（C）2006，JPO＆NCIPI

公开(公告)号：JP2004093839A

公开(公告)日：2004-03-25

申请号：JP2002254035

申请日：2002-08-30

Applicant: Toppan Forms Co Ltd ,  トッパン・フォームズ株式会社

Inventor： ISEYA YUKIHIKO ,  KAGAYA HITOSHI ,  NOGUCHI AOBA

IPC: G03B17/02 ,  H04N5/225

Abstract: PROBLEM TO BE SOLVED: To provide a photographing device and a photographing system using the same by which optional information is imparted to a taken photograph.
SOLUTION: In the photographing system, an IC module 10 capable of writing and reading out the information in a non-contact state is assembled in a film housing 20, and a coil type antenna 31 electrically connected to the module 10 when the housing 20 is installed inside is provided on one surface constituting the housing of a camera 30, then the information is written in the module 10 from the outside of the camera 30 through the antenna 31 in the non-contact state in a reader/writer 50 capable of writing and reading out the information in/from the module 10 in the non-contact state when a subject image is transferred to photographic film housed in the housing 20.
COPYRIGHT: (C)2004,JPO

公开(公告)号：JP2013164868A

公开(公告)日：2013-08-22

申请号：JP2013104357

申请日：2013-05-16

Applicant: Toppan Forms Co Ltd ,  トッパン・フォームズ株式会社

Inventor： KAGAYA HITOSHI

IPC: G06K19/077 ,  G06K19/07 ,  H01Q1/38 ,  H01Q1/44

Abstract: PROBLEM TO BE SOLVED: To provide an IC tag that widens the directivity of an antenna and enables omnidirectional communication without adjusting the position of the antenna.SOLUTION: The IC tag of the present invention, which is attached to an item comprising at least one metal rod-like member, comprises an enclosure placed so that at least a part thereof faces and crosses the rod-like member and an inlet provided on the enclosure. The enclosure comprises at least one fitting part to which the rod-like member is externally fitted and a connecting part that connects to the fitting part and on which the inlet is placed. A tip of the antenna constituting the inlet is placed along a surface facing the rod-like member in the fitting part so that at least one part of the tip of the antenna faces and crosses the rod-like member when the rod-like member is externally fitted to the fitting part. At least a region of the connecting part in which an IC chip and the vicinity thereof are placed comprises a non-conductive member.

Abstract translation: 要解决的问题：提供一种扩大天线方向性的IC标签，能够进行全方向通信而不调整天线的位置。解决方案：本发明的IC标签附着在包含至少一种金属 杆状构件包括外壳，其被设置为使得其至少一部分面向并穿过杆状构件和设置在外壳上的入口。 所述外壳包括至少一个所述杆状构件外部嵌合的配合部分和连接到所述配合部分并且所述入口被放置在其上的连接部分。 构成入口的天线的尖端沿着装配部件中的杆状构件的表面放置，使得当杆状构件为杆状构件时，天线的尖端的至少一部分与杆状构件相交， 外部装配到配件部分。 IC芯片及其附近的连接部分的至少一个区域包括非导电部件。

公开(公告)号：JP2013105380A

公开(公告)日：2013-05-30

申请号：JP2011249756

申请日：2011-11-15

Applicant: Toppan Forms Co Ltd ,  トッパン・フォームズ株式会社

Inventor： OISHI NORIHIRO ,  KAGAYA HITOSHI

IPC: G06K19/077 ,  B42D15/10 ,  G06K19/07

Abstract: PROBLEM TO BE SOLVED: To provide a non-contact data receiving/transmitting body which has an antenna prevented from being disconnected due to expansion and contraction of an objective article when used in a state of being embedded in the article and is superior in mechanical strength of the antenna, a manufacturing method thereof, a resin molding including a non-contact data receiving/transmitting body, and a manufacturing method thereof.SOLUTION: A non-contact data receiving/transmitting body 10 includes: a substrate 11; an IC chip 12 and a first antenna part 13 which are provided on one surface 11a of the substrate 11 and are electrically connected to each other; an insulating part 14 which covers the IC chip 12 and its periphery and is made of insulating resin; and second antenna parts 15 and 16 which are disposed so as to overlap a part of the first antenna part 13 and are made of conductive resin. The conductive resin and the insulating resin contain rubber having main chains of the same structure, as main components and contain vulcanizers.

Abstract translation: 要解决的问题：提供一种非接触式数据接收/发送体，其在被嵌入物品中的状态下被防止由于物品的膨胀和收缩而断开的天线，并且优异 在天线的机械强度，其制造方法，包括非接触式数据接收/发送主体的树脂模制品及其制造方法中。 解决方案：非接触式数据接收/发送主体10包括：基板11; IC芯片12和第一天线部件13，其设置在基板11的一个表面11a上并彼此电连接; 绝缘部14，其覆盖IC芯片12及其周边，并由绝缘树脂制成; 以及与第一天线部13的一部分重叠配置并由导电性树脂构成的第二天线部15,16。 导电树脂和绝缘树脂含有作为主要成分的具有相同结构的主链的橡胶，并含有硫化剂。 版权所有（C）2013，JPO＆INPIT

公开(公告)号：JP2009238023A

公开(公告)日：2009-10-15

申请号：JP2008084816

申请日：2008-03-27

Applicant: Kyowa Kogyo Kk ,  Toppan Forms Co Ltd ,  トッパン・フォームズ株式会社 ,  共和工業株式会社

Inventor： SHIBUYA EIJI ,  ITO KENICHI ,  SHIBUYA KOICHI ,  KAGAYA HITOSHI ,  MIZUTANI YOSHIHIRO ,  OISHI NORIHIRO

IPC: G06K19/077 ,  G06K19/07

Abstract: PROBLEM TO BE SOLVED: To provide a method for manufacturing a non-contact data receiver/transmitter which has excellent flexibility and resistance to chemicals, weather, and heat further, preventing the decrease of the communication characteristics of an antenna. SOLUTION: A method for manufacturing a non-contact data receiver/transmitter equipped with an inlet, an adhesive that coats the inlet, and a first substrate and a second substrate that sandwich the inlet with the adhesive therebetween includes: a step of adhering the inlet through the adhesive to the upper surface of the protrusion of each of resin base materials in which recesses and protrusions are alternately and continuously formed with cross-section shaped like protrusion/recess; a step of applying adhesive to coat the inlet arranged on the upper surface of the protrusion; a step of overlapping the second substrate through the adhesive on the laminate consisting of the resin base materials and the inlet; a step of curing the adhesive; and a step of cutting the laminate consisting of the resin base materials, inlet, adhesive and the second substrate according to the shape of the inlet. COPYRIGHT: (C)2010,JPO&INPIT

Abstract translation: 要解决的问题：为了提供一种制造具有优异的柔性和耐化学性，耐候性和耐热性的非接触式数据接收/发射机的方法，防止了天线的通信特性的降低。 解决方案：一种用于制造装备有入口，涂覆入口的粘合剂的非接触式数据接收器/发送器的方法，以及将粘合剂夹在入口之间的第一基底和第二基底包括：步骤 将入口通过粘合剂粘附到每个树脂基材的突起的上表面，其中凹部和突起交替并连续地形成有横截面形状的突起/凹部; 施加粘合剂以涂覆布置在突起的上表面上的入口的步骤; 在由树脂基材和入口构成的层叠体上通过粘合剂将第二基板重叠的步骤; 固化粘合剂的步骤; 以及根据入口的形状切割由树脂基材，入口，粘合剂和第二基材组成的层压体的步骤。 版权所有（C）2010，JPO＆INPIT

公开(公告)号：JP2009059072A

公开(公告)日：2009-03-19

申请号：JP2007224332

申请日：2007-08-30

Applicant: Kyowa Kogyo Kk ,  Toppan Forms Co Ltd ,  トッパン・フォームズ株式会社 ,  共和工業株式会社

Inventor： SHIBUYA EIJI ,  ITO KENICHI ,  SHIBUYA KOICHI ,  KAGAYA HITOSHI ,  MIZUTANI YOSHIHIRO

IPC: G06K19/07 ,  G06K19/077

Abstract: PROBLEM TO BE SOLVED: To provide a noncontact type data transceiving body excellent in chemical resistance, weatherability, heat resistance and flexibility, and capable of preventing a communication characteristic generated in an antenna from getting worse, and a manufacturing method therefor.
SOLUTION: In this noncontact type data transceiving body 10 of the present invention, the first casing 11 storing an inlet 14 is stored in the second casing 12, those are joined via a sealing material 13, the first casing 11 storing the inlet 14 is stored in a storage part 12a of the second casing 12 under the condition where an end face 11d of a side wall 11b of a storage part 11a abuts to a bottom face 12c of the storage part 12a of the second casing 12, and the sealing material 13 is interposed between an outer face 11c of the first casing 11 and an inner face 12d of the storage part 12a of the second casing 12.
COPYRIGHT: (C)2009,JPO&INPIT

Abstract translation: 要解决的问题：提供耐化学性，耐候性，耐热性和柔韧性优异并且能够防止天线中产生的通信特性变差的非接触式数据收发体及其制造方法。 解决方案：在本发明的非接触式数据收发体10中，存储入口14的第一壳体11存储在第二壳体12中，经由密封材料13接合，第一壳体11存储入口 14在存储部分11a的侧壁11b的端面11d与第二壳体12的存储部分12a的底面12c相邻的状态下存储在第二壳体12的存储部分12a中，并且 密封材料13插入在第一壳体11的外表面11c和第二壳体12的存储部分12a的内表面12d之间。版权所有（C）2009，JPO＆INPIT

公开(公告)号：JP2008191918A

公开(公告)日：2008-08-21

申请号：JP2007025443

申请日：2007-02-05

Applicant: Toppan Forms Co Ltd ,  トッパン・フォームズ株式会社

Inventor： KAGAYA HITOSHI

IPC: G06K19/077 ,  G06K19/07

Abstract: PROBLEM TO BE SOLVED: To provide a non-contact type data transmission/reception body which is excellent in weather-resistance and flexibility for preventing the deterioration of the communication characteristics of an antenna by reducing the area of a casing directly brought into contact with the antenna. SOLUTION: This non-contact data transmission/reception body 10 is provided with: a case body 11 with a recessed part 16 formed therein; an inlet 12 housed in the recessed part 16; and a sealing member 18 overlapped on the inlet 12 in the recessed part 16 and for sealing the case body 11. The section facing an antenna 15 of the inlet 12 of the casing 11 has a plurality of holes 17 formed all over the region of the antenna 15, and the casing 11 and the sealing member 18 are made of resin having rubber-like elasticity and flexibility. COPYRIGHT: (C)2008,JPO&INPIT

Abstract translation: 要解决的问题：提供一种非接触型数据发送接收体，其耐候性和柔性优异，通过减少直接进入的壳体的面积来防止天线的通信特性的恶化 与天线接触。 解决方案：该非接触式数据发送接收体10设置有：形成有凹部16的壳体11; 容纳在凹部16中的入口12; 以及密封构件18，其重叠在凹部16中的入口12上并用于密封壳体11.面对壳体11的入口12的天线15的部分具有多个孔17，其形成在 天线15，壳体11和密封构件18由具有橡胶状弹性和柔性的树脂制成。 版权所有（C）2008，JPO＆INPIT

公开(公告)号：JP2008112373A

公开(公告)日：2008-05-15

申请号：JP2006295939

申请日：2006-10-31

Applicant: Toppan Forms Co Ltd ,  トッパン・フォームズ株式会社

Inventor： KAGAYA HITOSHI

IPC: G06K19/077 ,  B42D15/10 ,  G06K19/07

Abstract: PROBLEM TO BE SOLVED: To provide a non-contact type data reception/transmission body wherein a fiber material forming a heat insulation material is not scattered or contaminated, capable of stably maintaining heat resistance over a long period. SOLUTION: This non-contact type data reception/transmission body 10 has: an inlet 11 having an antenna coil and an IC chip connected to the antenna coil; a wrapping material 12 made of ceramics fiber wrapping up the inlet 11; and a covering body 13 made of a heat-resistant resin covering the wrapping material 12. COPYRIGHT: (C)2008,JPO&INPIT

Abstract translation: 要解决的问题：提供一种非接触型数据接收/传输体，其中形成隔热材料的纤维材料不会被散射或污染，能够长期稳定地保持耐热性。 解决方案：该非接触型数据接收/发送主体10具有：具有天线线圈和连接到天线线圈的IC芯片的入口11; 由包围入口11的陶瓷纤维制成的包装材料12; 以及由覆盖包装材料12的耐热树脂制成的覆盖体13.版权所有（C）2008，JPO＆INPIT