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公开(公告)号:US10775045B2
公开(公告)日:2020-09-15
申请号:US15115741
申请日:2015-01-09
Applicant: United Technologies Corporation
Inventor: Melvin Freling , Jessica L. Serra , Paul H. Zajchowski , Craig L. Ostrout , Brian T. Hazel , Mario P. Bochiechio
Abstract: An article such as a heat shield panel includes a substrate and a multi-layered coating supported on the substrate. The multi-layered coating can include alternating layers of different ceramic material compositions having individual thicknesses of less than 25 micrometers.
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公开(公告)号:US10718042B2
公开(公告)日:2020-07-21
申请号:US15636511
申请日:2017-06-28
Applicant: United Technologies Corporation
Inventor: Max A. Kaplan , Mario P. Bochiechio , Stephen D. Rittenburg , Paul D. Bennett
IPC: C22F1/10 , C22F1/00 , C22F1/02 , C22C19/03 , F27D7/06 , F27B5/06 , B22F5/04 , B22F3/24 , B22F1/00 , C22C1/04
Abstract: A method for heat treating a superalloy component includes heating a superalloy component to a first temperature, cooling the superalloy from the first temperature to a second temperature at a first cooling rate in a furnace, and cooling the superalloy component from the second temperature to a final temperature at a second cooling rate. The second cooling rate is higher than the first cooling rate.
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公开(公告)号:US20200216939A1
公开(公告)日:2020-07-09
申请号:US16818127
申请日:2020-03-13
Applicant: United Technologies Corporation
Inventor: Max A. Kaplan , Mario P. Bochiechio , Stephen D. Rittenburg , Paul D. Bennett
Abstract: A method for heat treating a superalloy component includes heating a superalloy component to a first temperature, cooling the superalloy from the first temperature to a second temperature at a first cooling rate in a furnace, and cooling the superalloy component from the second temperature to a final temperature at a second cooling rate. The second cooling rate is higher than the first cooling rate.
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公开(公告)号:US10265763B2
公开(公告)日:2019-04-23
申请号:US16152544
申请日:2018-10-05
Applicant: United Technologies Corporation
Inventor: Dilip M. Shah , Paul D. Genereux , Alan D. Cetel , John J. Marcin, Jr. , Steven J. Bullied , Mario P. Bochiechio , Kevin W. Schlichting , Bradford A. Cowles , Carl R. Verner , David U. Furrer , Venkatarama K. Seetharaman
IPC: B22D27/04 , C30B29/60 , C30B29/52 , C30B15/36 , C30B13/34 , F23R3/00 , F01D25/00 , F01D5/28 , F01D5/02 , C30B11/14 , B22D27/13 , B22D7/04 , B22D19/00 , B22D21/02 , B22D25/02 , C22C19/03 , F01D11/08 , F01D25/24 , F01D5/34 , F01D5/14
Abstract: A method for casting comprising: providing a seed, the seed characterized by: an arcuate form and a crystalline orientation progressively varying along an arc of the form; providing molten material; and cooling and solidifying the molten material so that a crystalline structure of the seed propagates into the solidifying material.
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公开(公告)号:US20190039128A1
公开(公告)日:2019-02-07
申请号:US16152544
申请日:2018-10-05
Applicant: United Technologies Corporation
Inventor: Dilip M. Shah , Paul D. Genereux , Alan D. Cetel , John J. Marcin, JR. , Steven J. Bullied , Mario P. Bochiechio , Kevin W. Schlichting , Bradford A. Cowles , Carl R. Verner , David U. Furrer , Venkatarama K. Seetharaman
IPC: B22D27/04 , F23R3/00 , B22D19/00 , B22D21/02 , B22D25/02 , B22D27/13 , C22C19/03 , C30B11/14 , C30B13/34 , C30B15/36 , C30B29/52 , C30B29/60 , F01D5/02 , B22D7/04 , F01D25/24 , F01D25/00 , F01D11/08 , F01D5/28 , F01D5/34 , F01D5/14
Abstract: A method for casting comprising: providing a seed, the seed characterized by: an arcuate form and a crystalline orientation progressively varying along an arc of the form; providing molten material; and cooling and solidifying the molten material so that a crystalline structure of the seed propagates into the solidifying material.
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公开(公告)号:US20190003026A1
公开(公告)日:2019-01-03
申请号:US15636511
申请日:2017-06-28
Applicant: United Technologies Corporation
Inventor: Max A. Kaplan , Mario P. Bochiechio , Stephen D. Rittenburg , Paul D. Bennett
Abstract: A method for heat treating a superalloy component includes heating a superalloy component to a first temperature, cooling the superalloy from the first temperature to a second temperature at a first cooling rate in a furnace, and cooling the superalloy component from the second temperature to a final temperature at a second cooling rate. The second cooling rate is higher than the first cooling rate.
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公开(公告)号:US20180371594A1
公开(公告)日:2018-12-27
申请号:US15633659
申请日:2017-06-26
Applicant: United Technologies Corporation
Inventor: Ashwin Sreekant Raghavan , Kenneth A. Frisk , Max A. Kaplan , Mario P. Bochiechio , Michael A. Czywczynski
IPC: C22F1/10 , B24B39/00 , B23K26/00 , B23K26/352 , B23K20/12 , B23K20/24 , B23K20/233 , F01D5/06
Abstract: A method for welding a first powder metallurgical (PM) part to a second powder metallurgical (PM) part includes: working a first face of the first PM part; working a first face of the second PM part; and friction welding the first face of the first part to the first face of the second part.
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公开(公告)号:US09827608B2
公开(公告)日:2017-11-28
申请号:US14534616
申请日:2014-11-06
Applicant: United Technologies Corporation
Inventor: Mario P. Bochiechio , John Joseph Marcin
CPC classification number: B22C3/00 , B22C9/04 , B22D21/025
Abstract: A method of fabricating an investment casting mold includes using a zircon-containing slurry to form a facecoat of a refractory investment wall of a mold cavity in an investment casting mold. The zircon-containing slurry includes, by weight, at least 70% of zircon powder. Also disclosed is a slurry for use in an investment casting mold. The slurry includes, by weight, at least 70% of zircon powder, 10%-30% of colloidal silica material, and 1%-10% of a carrier solvent. The method and slurry can be used to fabricate an investment casting mold that has a refractory investment wall with a facecoat having, by weight, at least 70% zircon.
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公开(公告)号:US20170176007A1
公开(公告)日:2017-06-22
申请号:US15115741
申请日:2015-01-09
Applicant: United Technologies Corporation
Inventor: Melvin Freling , Jessica L. Serra , Paul H. Zajchowski , Craig L. Ostrout , Brian T. Hazel , Mario P. Bochiechio
Abstract: An article such as a heat shield panel includes a substrate and a multi-layered coating supported on the substrate. The multi-layered coating can include alternating layers of different ceramic material compositions having individual thicknesses of less than 25 micrometers.
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公开(公告)号:US09677167B2
公开(公告)日:2017-06-13
申请号:US14776128
申请日:2014-03-14
Applicant: United Technologies Corporation
Inventor: Mario P. Bochiechio
IPC: C23C14/08 , C23C14/02 , C23C4/11 , C23C28/00 , C23C14/34 , C23C16/40 , F01D5/28 , C23C14/30 , C23C14/22 , F01D9/04 , F01D11/08 , F02C7/25
CPC classification number: C23C14/083 , C23C4/11 , C23C14/024 , C23C14/08 , C23C14/22 , C23C14/30 , C23C14/34 , C23C16/40 , C23C16/405 , C23C28/3215 , C23C28/345 , C23C28/3455 , F01D5/288 , F01D9/041 , F01D11/08 , F02C7/25 , F05D2220/32 , F05D2230/90 , F05D2240/12 , F05D2240/30 , F05D2240/35 , F05D2240/55 , F05D2260/231 , F05D2300/5023 , F05D2300/611
Abstract: An article (50; 100) has a metallic substrate (22), a bondcoat (30) atop the substrate, and a thermal barrier coating (28; 27, 28) atop the bondcoat. The thermal barrier coating or a layer thereof comprises didymium oxide and zirconia.
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