Abstract:
A stress-balancing layer (130) is formed over portions (122) of a spring metal finger (120) that remain attached to an underlying substrate (101) to counter internal stresses inherently formed in the spring metal finger (120). The (e.g., positive) internal stress of the spring metal causes the claw (tip) (125) of the spring metal finger (120) to bend away from the substrate (101) when an underlying release material is removed. The stress-balancing pad (130) is formed on an anchor portion (122) of the spring metal finger (120), and includes an opposite (e.g., negative) internal stress that counters the positive stress of the spring metal finger (120). A stress-balancing layer (230) is either initially formed over the entire spring metal finger (120) and then partially removed (etched) from the claw portion (125), or selectively deposited only on the anchor portion (122) of the spring metal finger (120). An interposing etch stop layer (325-1) is used when the same material composition is used to form both the spring metal (220) and stress-balancing (230) layers.
Abstract:
PROBLEM TO BE SOLVED: To provide several methods and structures for improving the yield in plane external micro device structure including springs and coils. SOLUTION: A plane external structure comprises a substrate 20 and at least two elastic members 18 that are arranged with an interval, each elastic member 18 includes an anchor section, a spring, and a free end section, the anchor section is fixed to the substrate 20, and the free end section is arranged separately from the substrate 20. The radius of curvature of the elastic member 18 to be released is controlled by depositing a layer made of a reflow material, and then performing reflow after the release. A structure having a high yield can be used for a number of electronic application fields such as a filter circuit.
Abstract:
PROBLEM TO BE SOLVED: To obtain an optical switch, using a reflection MEMS mirror. SOLUTION: An optical cross connect system involves the general concept of a two-dimensional array of MEMS tilt mirrors, used to direct light, coming from a first optical fiber to a second optical fiber. Each MEMS tilt mirror in the two-dimensional array can tilt about two non-colinear axes and is suspended by plural suspension arms attached to a glass substrate.
Abstract:
PROBLEM TO BE SOLVED: To provide a fluidic conduit which can be used in microarraying systems, nano-lithography systems of dip pen type, a fluidic circuit and microfluidic systems. SOLUTION: This fluidic conduit comprises a spring beam 460 which has a fixed part 453 attached to a substrate 440, and a cantilever part 454 having a curvature away from the substrate 440. The spring beam 460 defines a first channel 452 extending approximately parallel with the curvature of the cantilever part 454, in order to carry fluid along the cantilever part 454 of the spring beam 460. COPYRIGHT: (C)2004,JPO
Abstract:
PROBLEM TO BE SOLVED: To provide a structure of a thin film spring decreased in or free from helical twisting. SOLUTION: The spring structure 100 comprising a substrate 101 having an upper surface defining a plane and a spring finger formed from a stress- engineered film deposited over the substrate 101. The spring finger has an anchor portion 122 attached to the substrate 101 defining a second plane that is parallel to the first plane and a curved free portion 125 extending from the anchor portion 122 and bending out of the second plane away from the substrate 101. The anchor portion 122 of the spring finger includes at least one layer having an isotropic internal stress. COPYRIGHT: (C)2004,JPO
Abstract:
PROBLEM TO BE SOLVED: To obtain an optical switch, using a reflection MEMS(micro- electromechanical system) mirror. SOLUTION: Optical cross-connect involve the general concept of a two-dimensional array of MEMS tilt mirrors, used to direct light coming from a first optical fiber, to a second optical fiber. Each MEMS tilt mirror in the two-dimensional array can rotate about its x-axis and y-axis and is suspended by plural suspension arms attached to a substrate.
Abstract:
PROBLEM TO BE SOLVED: To provide a scanning probe system of a scanning probe microscope system or the like having a low-cost probe that can be easily manufactured. SOLUTION: The scanning probe microscope (SPM) system for probing a sample 115 includes a stand 110 having a surface for mounting the sample 115, a probe assembly 120-1, and pieces of measuring apparatus (142, 145). The probe assembly includes a substrate 122, and a spring probe 125. The probe 125 comprises a fixed end 210 mounted to the substrate, a central section 220 that is curved away from the substrate, and a free end 230 having a probe chip 235 that is arranged adjacent to the surface of the stand. The pieces of measuring apparatus measure deformation in the spring probe 125 due to the interaction between the probe chip 235 and the sample 115. COPYRIGHT: (C)2004,JPO
Abstract:
PROBLEM TO BE SOLVED: To improve the strength and durability of a spring structure. SOLUTION: A stress-balancing layer is formed over a portion of a spring metal finger 120 that remains attached to a substrate 101 to counter balance internal stresses inherently formed in the spring metal finger 120. The internal stress (for example, positive internal stress) of the spring metal finger 120 causes the safety lug 125 (tip) of the spring metal finger 120 to bend away from the substrate 101 when a underlying release substance is removed. A stress-balancing pad 130 is formed on an anchor portion 122 of the spring metal finger 120, and made to include an internal stress (for example, negative internal stress) that counter balances the positive stress of the spring metal finger 120. COPYRIGHT: (C)2003,JPO
Abstract:
PROBLEM TO BE SOLVED: To reduce a metal required for sputtering. SOLUTION: A flattening structure for use with an associated marking device selected from a plurality of marking device types for making a mark on an associated substrate is provided. The flattening structure includes: a substrate; and a self-lifting spring finger having a non-raising anchor part mounted to the substrate and a separated part extending to the substrate where the separated part has a proximal end and distal end, and the distal end includes a tip for promoting the discharge of a marking fluid, and the separated part of the self-lifting spring finger rises from the surface by etching. COPYRIGHT: (C)2011,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide several methods and structures for improving the yield in plane external micro device structure including springs and coils. SOLUTION: A first free end section 33 includes at least one slender tip, a second free end section 34 includes a tip having at least one structure for receiving at least one slender tip, the first free end section slants from the substrate for separation by a stress profile peculiar to the first elastic member, the second free end section inclines from the substrate for separation by the stress profile peculiar to the second elastic member, and the first free end section is connected to the second free end section for forming annular coil winding.