Abstract:
In an integrated pressure sensor (15) with a high full-scale value, a monolithic body (16) of semiconductor material has a first and a second main surface (16a and 16b), opposite and separated by a substantially uniform distance (w). The monolithic body (16) has a bulk region (17), having a sensitive portion (23) next to the first main surface (16a), upon which pressure (P) acts. A first piezoresistive detection element (18) is integrated in the sensitive portion (23) and has a variable resistance as a function of the pressure (P). The bulk region (17) is a solid and compact region and has a thickness substantially equal to the distance (w).
Abstract:
Process for manufacturing a multi-drain power electronic device (30) integrated on a semiconductor substrate (100) of a first type of conductivity whereon a drain semiconductor layer (20) is formed, characterised in that it comprises the following steps: forming at least a first semiconductor epitaxial layer (21) of the first type of conductivity forming the drain epitaxial layer (20) on the semiconductor substrate (100) , forming first sub-regions (51) of a second type of conductivity by means of a first selective implant step forming second sub-regions (Dl, DIa) of the first type of conductivity by means of a second implant step forming a surface semiconductor layer (23) wherein body regions (40) of the second type of conductivity are formed being aligned with the first sub-regions (51) , carrying out a thermal diffusion process so that the first sub-regions (51) form a single electrically continuous column region (50) being aligned and in electric contact with the body regions (40).
Abstract:
A power actuator (20) of the emitter-switched type is described, the power actuator comprising at least one high voltage bipolar transistor (2) and a low voltage DMOS transistor (3) connected in cascode configuration between a collector terminal (C) of the bipolar transistor (2) and a source terminal (S) of the DMOS transistor (3) and having respective control terminals (B, G). Advantageously according to the invention, the power actuator (20) further comprises at least a Zener diode (21), inserted between the source terminal (S) of the DMOS transistor (3) and the control terminal (B) of the bipolar transistor (2).
Abstract:
A device for controlling the frequency of resonance of an oscillating micro-electromechanical system includes: a microstructure (2), having a first body (10) and a second body (11) , which is capacitively coupled to the first body (10) and elastically oscillatable with respect thereto at a calibratable frequency of resonance (ω R ) , a relative displacement (ΔY) between the second body (11) and the first body (10) being detectable from outside; and an amplifier (21) coupled to the microstructure (2) for detecting the relative displacement (ΔY) . DC decoupling elements (23) are arranged between the amplifier (21) and the microstructure (2).
Abstract:
There is described a circuit for reconstructing an analog signal from a digital signal and wide-band transmission system, particularly for employment in cellular telephony systems, or more in general in mobile communication systems, that adopt the WCDMA standard. The circuit comprises: a digital to analog converter (DAC) suitable for receiving said digital signal and converting it into signal in analog.format; - a low pass-filter (LOW-PASS) connected at the output of said converter for receiving said signal in analog format and providing as output said reconstructed analog signal. Advantageously, the low pass filter (LOW-PASS) is an active filter continuous in time and current coupled to the output of the digital-analog converter (DAC) and the digital-analog converter (DAC) is a converter of the current-steering type functioning at sampling frequency greater than the Nyquist frequency of said analog signal to be reconstructed.
Abstract:
There is described a device for the correction of the power factor in forced switching power supplies. The device comprises a converter (20) and a control device (100) coupled with the converter (20) in order to obtain from an alternated mains input voltage (Vin) a regulated voltage (Vout) on the output terminal; the converter (20) comprises a power transistor (M) and said control device (100) comprises an error amplifier (3) having in input on the inverting terminal a signal (Vr) proportional to the regulated voltage (Vout) and on the non-inverting terminal a reference voltage (Vref). The signal (Vr) proportional to the regulated voltage is produced by a first resistance (R1) and a second resistance (R2) coupled in series to which is applied said regulated voltage (Vout); a terminal of the second resistance (R2) is connected with the inverting terminal of the error amplifier (3). The device for the correction of the power factor comprises first means (D50) positioned between the first resistance (RI) and the inverting terminal of the error amplifier (3) and second means (50) suitable for detecting the electrical connection of the first means (D50) with the output terminal of said device for the correction of the power factor and suitable for detecting an output signal (Vr2) of the second resistance (R2). The second means (50) are suitable for supplying a malfunction signal (Fault) of the device for the correction of the power factor when the second means (50) detect electric disconnection of the first means (D50) from said output terminal (Out) or when the output signal (Vr2) of the second resistance (R2) tends to zero.
Abstract:
In order to perform, according to a received signal (r), a channel-estimation procedure and a cell-search procedure in cellular communication systems, there are executed at least one first operation of correlation of said received signal (r) with secondary synchronization codes (SSC) and a second operation of correlation of said received signal (r) with known midamble codes (mid, MPL, MPS), whilst said channel-estimation procedure comprises a third operation of correlation of at least part of said received signal (r) with known midamble codes (mid, MPL, MPS), said first, second, and third correlation operation being executed by sending at least part (e mídamble )of said received signal (r) to an input of a correlation bank (111, 151; 203, 253; 303). There are envisaged the operations of: - sending, in a first time interval, the received signal (r) to said correlation bank (303) for executing the first operation of correlation of said received signal (r) with secondary synchronization codes (SSC); - sending, in a second time interval, at least part (e mídamble ) of said received signal (r) to said same correlation bank (303) for executing the second operation of correlation of said received signal (r) with known midamble codes (mid, MPL, MPS); - sending, in a second time interval, the received signal (r) to said same correlation bank (303) for executing the third operation of correlation of at least part (e midamble ) of said received signal (r) with known midamble codes (mid, MPL, MPS). Preferential application is in mobile communication systems based upon standards such as UMTS, CDMA2000, IS95 or WBCDMA.
Abstract:
The present invention describes a system for driving rows of a liquid crystal display comprising at least one module (10) for driving one single row of the liquid crystal display. The module comprises an inverter (T11-T12) operating in a supply path between a first (21) and a second (22) supply line of the system, where the first supply line (21) comprises first means (S1) capable of connecting it to a first (VLCD) or to a second (VA) supply voltage and the second supply line (22) comprises second means (S2) capable of connecting it to a third (VB) or to a fourth (VSS) supply voltage. The inverter (T11-T12) is driven by a logic circuitry (11-12) and sends in output (OUT) a drive signal for one single row of the liquid crystal display.
Abstract:
The present invention refers to a system for driving columns of a liquid crystal display comprising a logic circuitry (10) operating in a supply path between a first (VDD) and a second (VSS) supply voltage in which the first supply voltage is (VDD) higher than the second supply voltage (VSS). The logic circuitry (10) is capable of generating starting from the first logic signals (LOW_FRAME, WHITE_PIX) in input second logic signals (CP, CN, CP_N, CN_N) in output whose value is equal to the first (VDD) or second (VSS) supply voltage. The device comprises two elevator devices (11, 12) coupled to the logic circuitry (10) and operating in a supply path between a third supply voltage (VLCD) greater than the first supply voltage (VDD) and the second supply voltage (VSS); the elevator devices (11, 12) are capable of raising the value of the second logic signals (CP, CN, CP_N, CN_N). The device also comprises a first (T11-T12) and a second (T13-T14) pair of transistors shaving different supply paths (VLCD-VA, VB-VSS) and having an output terminal (OUT) in common; the first (T11-T12) and the second (T13-T14) pair of transistors are connected to the elevator devices (11, 12) so as to determine the drive signal of a column. The device comprises turnoff circuitry (15) operating in a supply path between the third (VLCD) and the second supply voltage (VSS) and coupled to the two elevator devices (11, 12). The circuitry (15) is capable of keeping one of the two pairs of transistors (T11-T12, T13-T14) in a turnoff state in the period of time of a frame when the other of the two pairs of transistors (T11-T12, T13-T14) is in operative conditions.
Abstract:
An integrated device having: a first conductive region (6A); a second conductive region (11A); an insulating layer (9) arranged between the first and the second conductive region; at least one through opening (36) extending in said insulating layer (9) between the first and the second conductive region; and a contact structure (10A) formed in the through opening and electrically connecting the first conductive region (6A) and the second conductive region (11B). The contact structure (10A) is formed by a conductive material layer (30) that coats the side surface and the bottom of the through opening (36) and surrounds an empty region (35) which is closed at the top by the second conductive region (11A). The conductive material layer (30) preferably comprises a titanium layer (31) and a titanium-nitride layer (32) arranged on top of one another.