Abstract:
Described are various improved methods of forming electronic devices, electro-mechanical devices, force-sensing devices, and accelerometers. Also described are various improved electronic devices, electro-mechanical devices, force-sensing devices, and accelerometers. The device comprises a plurality of vibrating beams joined with a support portion and configured for movement relative to the support portion. A layer of electrically conductive material is disposed over at least some of the surface of the moveable portion and support portion, the layer comprising an inert or a noble material having a Young's modulus which is greater than that of elemental gold. Alternatively, the layer may comprise an inert material having a coefficient of expansion which is less than that of elemental gold.
Abstract:
A method of forming apparatus including a force transducer on a silicon substrate having an upper surface, the silicon substrate including a dopant of one of the n-type or the p-type, the force transducer including a cavity having spaced end walls and a beam supported in the cavity, the beam extending between the end walls of the cavity, the method including the steps of: (a) implanting in the substrate a layer of a dopant of said one of the n-type or the p-type; (b) depositing an epitaxial layer on the upper surface of the substrate, the epitaxial layer including a dopant of the other of the n-type or the p-type; (c) implanting a pair of spaced sinkers through the epitaxial layer and into electrical connection with said layer, each of the sinkers including a dopant of the one of the n-type or the p-type; (d) anodizing the substrate to form porous silicon of the sinkers and the layer; (e) oxidizing the porous silicon to form silicon dioxide; and (f) etching the silicon dioxide to form the cavity and beam.
Abstract:
Force transducers are formed of a beam of polysilicon which is mounted at its ends to a silicon substrate and is encapsulated within a polysilicon shell which defines, with the substrate, a cavity around the resonating beam. The cavity is sealed off from the atmosphere and evacuated to maximize the Q of the resonating beam. The beam is produced by deposition of polysilicon in such a way that, combined with subsequent annealing steps, the beam is in zero or low tensile strain. Resonant excitation of the beam may be accomplished in various ways, including capacitive excitation, and the vibratory motion of the beam may be detected utilizing an implanted resistor which is piezoresistive. Formation of the beam is carried out by depositing the beam on a sacrificial layer and surrounding it in a second sacrificial layer before the encapsulating polysilicon shell is formed. The sacrificial layers are etched out with liquid etchant which passes through channels in the periphery of the shell. Following etching, the interior of the cavity surrounding the beam is maintained in a wash liquid so that the beam is not deflected toward any of the adjacent surfaces, and the wash liquid is removed by freezing and sublimation. The interior surfaces of the cavity and the outer surfaces of the beam are passivated and the channels leading into the cavity may be sealed by oxidation in an oxidizing atmosphere, which also results in consumption of oxygen within the cavity.
Abstract:
A resonant strain gauge includes a silicon substrate, a polysilicon flexure beam fixed at both ends relative to the substrate, and a polysilicon rigid cover cooperating with the substrate to enclose the flexure beam within a sealed vacuum chamber. An upper bias electrode is formed on the cover, and a lower bias electrode is formed at the bottom of a trough in the substrate directly beneath the flexure beam. A drive electrode and a piezoresistive element are supported by the beam, formed over a silicon nitride thin film layer deposited onto the top surface of the flexure beam. A second silicon nitride layer covers the drive electrode and piezoresistor, cooperating with the first silicon nitride layer to dielectrically encapsulate the drive electrode and piezoresistor. The silicon nitride further extends outwardly of the beam to a location between the polysilicon layer that contains the beam, and the cover, to isolate the cover from the flexure beam. A polysilicon film is applied over the upper silicon nitride layer as a passivation layer to protect the silicon nitride during gauge fabrication. The process for fabricating the gauge includes a sequence of applying the various polysilicon and silicon nitride layers by low pressure chemical vapor deposition, in combination with selective etching to define the flexure beam, electric circuit components and vacuum chamber.
Abstract:
A resonant strain gauge includes a silicon substrate, a polysilicon flexure beam attached at both ends to the substrate, and a polysilicon rigid cover cooperating with the substrate to enclose the flexure beam within a sealed vacuum chamber. An upper bias electrode is formed on the cover, and a lower bias electrode is formed on the substrate directly beneath and spaced apart from the flexure beam. A drive electrode is formed in or on the beam, centrered between the upper and lower bias electrodes transversely with respect to the direction of beam elongation. The upper and lower electrodes are biased at constant voltage levels, of equal magnitude and opposite polarity. The drive electrode, ordinarily biased at ground, is selectively charged by applying an oscillating drive voltage, to cause mechanical oscillation of the beam. A piezoresistor element, formed on the beam, senses beam oscillation and provides a position indicating input to the oscillator circuit that drives the beam. The beam tends to oscillate at its natural resonant frequency. The piezoresistor thus provides the natural resonant frequency to the oscillating circuit, adjusting the frequency of the beam drive signal toward coincidence with the natural resonant frequency. A shield electrode can be formed on the flexure beam between the piezoresistor and the drive electrode, to insure against parasitic capacitance. In alternative embodiments, the drive signal is applied to one of the bias electrodes to oscillate the beam, and beam oscillation is sensed capacitively.
Abstract:
A push-pull force transducer comprising a unitary body (40) formed from a crystalline substrate. The body comprises first and second mounting elements (42, 44) for mounting the force transducer to first and second structures (72, 74), and first and second force sensing elements (46, 48) connected to the mounting elements. Each force sensing element has first and second ends, a line extending from the second to the first end defining a force sensing axis for the force sensing elements. The force sensing elements are oriented with their force sensing axes parallel to and aligned with one another. The first force sensing element has its first end connected to the second mounting element and its second end connected to the first mounting element. The second force sensing element has its first end connected to the first mounting element and its second end connected to the second mounting element. Also described are embodiments utilizing strain relief flexures and an embodiment featuring a leveraged design.
Abstract:
Le capteur résonant comporte un corps d'épreuve (10) apte à subir un torseur d'efforts produits par une structure mécanique externe, ledit corps (10) comportant au moins : - une première interface (2) et une deuxième interface (3) aptes chacune à entrer en contact avec ladite structure; - au moins deux zones sensibles (1) disposées chacune entre ces deux interfaces (2, 3); une zone sensible étant formée d'une plaque (21) encastrée dans un cadre (22) solidaire mécaniquement desdites interfaces, ladite plaque étant apte à entrer en résonance sous l'effet d'excitations mécaniques locales produites en des points particuliers par des transducteurs d'excitation portant ladite plaque à plusieurs fréquences de résonances, des capteurs captant les signaux résonant produits au niveau desdits points particuliers, des moyens de mesure mesurant les décalages de fréquences de résonance de signaux qui sont des combinaisons linéaires des signaux résonant captés, lesdits décalages étant fonction de contraintes mécaniques induites par lesdits efforts et transmises à ladite plaque (21) par ledit cadre (22), les composantes dudit torseur d'efforts étant déterminées à partir décalages de fréquences de résonance mesurés sur les plaques (21) desdites zones sensibles (1).
Abstract:
A method of forming a thin film metallization layer having a predetermined residual stress and a predetermined sheet resistance and force measuring devices formed using the methods.
Abstract:
At least one microbeam situated on a substrate, having a resonant frequency dependent on the strain on the microbeam which may be affected by the bending of the substrate. The beam or beams have sense and drive electrodes proximate to the beam or beams and form capacitors with a beam being the other electrode. The capacitance varies as the beam moves in vibration. The sense electrode is connected to an input of a transistor, such as the gate or base, and the drive electrode is connected to an output of the transistor. The transistor has a load impedance with a capacitive component to aid in the sustaining of vibration of the beam at a resonant frequency. A high ohm resistor is connected between the gate and the drain of the transistor to appropriately bias the gate. The bending of the substrate may be caused by a magnitude of a physical stimulus being measured. However, the bending of the substrate is not utilized nor desired in the filter and temperature sensing configurations of the invention. The frequency of resonance is an indication of the magnitude of the physical parameter. Variants of the sensor may be implemented with different placements of the sense and drive electrodes, and additional electronics as needed to implement the various configurations and microbeam geometry. Additional sense and/or drive electrodes and beams also may be incorporated in the transistor resonant microbeam sensor.