公开(公告)号：US20150247035A1

公开(公告)日：2015-09-03

申请号：US14632019

申请日：2015-02-26

Applicant: SAMSUNG SDI CO., LTD.

Inventor： Yoo Jin JUNG ,  Tae Gon KANG ,  Chan Moo PARK ,  Jong Cheol LIM ,  Sang Hyun HONG

IPC: C08L67/03 ,  H01L33/60 ,  H01L51/00

CPC classification number: H01L33/60 ,  C08G63/02 ,  C08G63/06 ,  C08G63/127 ,  C08K3/013 ,  C08L67/02 ,  C08L2201/02 ,  C08L2201/08 ,  C08L2203/20 ,  C08L2205/16 ,  C08L2207/04 ,  H01L51/5271 ,  H01L2224/48091 ,  C08K3/0033 ,  H01L2924/00012

Abstract: A polyester resin composition comprises: (A) a first polyester resin having a melting temperature of greater than about 285° C.; (B) a second polyester resin having a melting temperature of less than or equal to about 285° C.; (C) a white pigment; and (D) an inorganic filler. The polyester resin composition may exhibit improved mechanical properties and discoloration resistance and can be used in a molded article, for example, as a LED reflector.

Abstract translation: 聚酯树脂组合物包含：（A）熔融温度大于约285℃的第一聚酯树脂; （B）熔融温度小于或等于约285℃的第二聚酯树脂; （C）白色颜料; 和（D）无机填料。 聚酯树脂组合物可以表现出改善的机械性能和耐变色性，并且可以用于模制品，例如LED反射器。

公开(公告)号：US20150225554A1

公开(公告)日：2015-08-13

申请号：US14422164

申请日：2013-08-20

Applicant: HOSOKAWA YOKO CO., LTD.

Inventor： Toshiharu Iwasaki ,  Yohei Kageyama ,  Yukio Kobayashi ,  Masataka Kotani ,  Munenori Miyazaki

IPC: C08L23/06 ,  B65D1/40

CPC classification number: C08L23/06 ,  B29C49/00 ,  B65D1/40 ,  C08L23/0815 ,  C08L2201/02 ,  C08L2205/025 ,  C08L2205/03 ,  C08L2207/062 ,  C08L2207/066 ,  Y10T428/1397

Abstract: A blow-molded container is provided obtained by blow-molding a resin composition containing the following components (A) to (C): (A) 78 parts by mass to 55 parts by mass of a linear low-density polyethylene having a density of 910 kg/m3 to 925 kg/m3 and a melt mass flow rate of 1.5 g/10 minutes or more and less than 3.0 g/10 minutes; (B) 15 parts by mass to 25 parts by mass of a high-density polyethylene having a density of 945 kg/m3 to 970 kg/m3 and a melt mass flow rate of 1.0 g/10 minutes to 3.0 g/10 minutes; and (C) 7 parts by mass to 20 parts by mass of a low-density polyethylene having a density of 910 kg/m3 to 930 kg/m3 and a melt mass flow rate of 0.5 g/10 minutes to 8.0 g/10 minutes.

Abstract translation: 通过将含有以下成分（A）〜（C）的树脂组合物吹塑成型得到吹塑成形容器：（A）78质量份55质量份密度为 910kg / m3至925kg / m 3，熔体质量流量为1.5g / 10分钟以上且小于3.0g / 10分钟; （B）15质量份〜25质量份密度为945kg / m 3〜970kg / m 3，熔体质量流量为1.0g / 10分钟〜3.0g / 10分钟的高密度聚乙烯; 和（C）7质量份〜20质量份密度为910kg / m 3〜930kg / m 3，熔体质量流量为0.5g / 10分钟〜8.0g / 10分钟的低密度聚乙烯 。

公开(公告)号：US20150218374A1

公开(公告)日：2015-08-06

申请号：US14607676

申请日：2015-01-28

Applicant: EMS-PATENT AG

Inventor： Oliver THOMAS ,  Nikolai LAMBERTS ,  Botho HOFFMANN ,  Georgi BESCHIASCHVILI

IPC: C08L77/02 ,  C08L77/06

CPC classification number: C08L77/02 ,  C08K3/014 ,  C08K3/16 ,  C08K5/005 ,  C08K5/0066 ,  C08K5/13 ,  C08K7/14 ,  C08L77/06 ,  C08L2201/02 ,  C08L2201/08 ,  C08L2205/02 ,  C08L2205/025

Abstract: The present invention relates to polyamide moulding compounds which are distinguished by excellent flame-retardant properties and by very good long-term heat-ageing resistance. The moulding compounds according to the invention comprise a partially aromatic polyamide, caprolactam, a heat stabiliser, possibly a flame retardant and optionally further additives and admixtures. The polyamide moulding compound is thereby free of metal salts and/or metal oxides of a transition metal of group VB, VIB, VIIB or VIIIB of the periodic table.

Abstract translation: 本发明涉及具有优异的阻燃性能和非常好的长期耐热老化性的聚酰胺模塑料。 根据本发明的模塑料包括部分芳族聚酰胺，己内酰胺，热稳定剂，可能的阻燃剂和任选的其它添加剂和混合物。 因此，聚酰胺模塑料不含周期表第VB族，VIB族，VIIB族或VIIIB族过渡金属的金属盐和/或金属氧化物。

公开(公告)号：US20150218369A1

公开(公告)日：2015-08-06

申请号：US14418206

申请日：2013-07-31

Applicant: TEIJIN LIMITED ,  KANEKA CORPORATION

Inventor： Hiroshi Okamoto ,  Toyohisa Fujimoto

IPC: C08L69/00

CPC classification number: C08L69/00 ,  C08F279/02 ,  C08L2201/02 ,  C08L2201/10 ,  C08L2207/53 ,  C08L51/04

Abstract: A polycarbonate resin composition which has a high biogenic matter content, is excellent in transparency, surface hardness and impact resistance and is useful as an industrial material having excellent moldability.The resin composition comprises 100 parts by weight of a polycarbonate (component A) containing not less than 30 mol % of a recurring unit represented by the following formula (1) and 2 to 20 parts by weight of an impact resistance modifier (component B), wherein the resin composition has an aggregation structure that impact resistance modifier (component B) domains are dispersed in the matrix of the polycarbonate (component A), the average size of the impact resistance modifier domains is 5 to 200 nm, and the normalized dispersity is not more than 17%.

Abstract translation: 具有高生物成分含量的聚碳酸酯树脂组合物的透明性，表面硬度和耐冲击性优异，可用作成型性优异的工业材料。 树脂组合物包含100重量份含有不少于30摩尔％的由下式（1）表示的重复单元的聚碳酸酯（组分A）和2至20重量份的抗冲击改性剂（组分B） 其中，所述树脂组合物具有将耐冲击性改性剂（B成分）区域分散在聚碳酸酯（A成分）的基体中的聚集结构，抗冲击性改性剂畴的平均粒径为5〜200nm，归一化分散度 不超过17％。

公开(公告)号：US20150203731A1

公开(公告)日：2015-07-23

申请号：US14421675

申请日：2013-08-03

Applicant: CLARIANT INTERNATIONAL LTD

Inventor： Timo Herrlich ,  Christian Steib ,  Andreas Lang

IPC: C09J191/06 ,  D06N7/00 ,  C08K5/5313 ,  C08K3/22 ,  C08K3/04 ,  C08K3/32

CPC classification number: C09J191/06 ,  C08K3/04 ,  C08K3/22 ,  C08K3/32 ,  C08K5/5313 ,  C08K2003/2227 ,  C08K2003/323 ,  C08L2201/02 ,  C08L2207/14 ,  C09J123/14 ,  D06M11/74 ,  D06M17/04 ,  D06M17/06 ,  D06N3/0059 ,  D06N3/0063 ,  D06N3/04 ,  D06N7/0071 ,  D06N7/0078 ,  D06N2209/067 ,  Y10T442/2631 ,  C08K5/0066

Abstract: A hot-melt adhesive designed to be flame-resistant, characterized in that the adhesive contains the following components: a) 20 to 70 percent by weight of one or more polyolefin wax(es) of one or more C3-C18 [alpha]-olefin(s) and optionally ethylene; b) 9 to 30 percent by weight of expanded graphite; c) 5 to 30 percent by weight of a further flame retardant; d) 0 to 15 percent by weight of an antistatic agent; e) 0 to 12 percent by weight of one or more resin(s); f) 0 to 40 percent by weight of one or more amorphous, atactic poly [alpha]-olefin(s) (APAO).

Abstract translation: 一种设计成具有阻燃性的热熔粘合剂，其特征在于该粘合剂含有以下组分：a）20至70重量％的一种或多种一种或多种C 3 -C 18α-烯烃的聚烯烃蜡， 烯烃和任选的乙烯; b）9〜30重量％的膨胀石墨; c）5至30重量％的另外的阻燃剂; d）0至15重量％的抗静电剂; e）0至12重量％的一种或多种树脂; f）0至40重量％的一种或多种无定形聚α-烯烃（APAO）。

公开(公告)号：US20150159368A1

公开(公告)日：2015-06-11

申请号：US14622990

申请日：2015-02-16

Applicant: Sherwin-Williams Protective & Marine Coatings

Inventor： John Darryl Green ,  William Allen ,  Andrew Philip Taylor

IPC: E04B1/94 ,  B32B15/04

CPC classification number: E04B1/941 ,  B32B15/04 ,  B32B2419/00 ,  C08L2201/02 ,  C09D5/185 ,  C09D133/04 ,  E04B1/945

Abstract: A coating system comprising: (1) a liquid intumescent coating composition comprising a resin system comprising at least one polymeric component, at least one ethylenically unsaturated monomeric component, and at least one intumescent ingredient, the coating composition being curable to a solid state by free radical polymerisation, and (2) a reinforcement structure. The reinforcement structure may comprise any of mesh, fabric and/or tape. The reinforcement structure preferably comprises an inorganic fabric, and may be installed by application of a suitable adhesive binder.

公开(公告)号：US20150159016A1

公开(公告)日：2015-06-11

申请号：US14367337

申请日：2011-12-29

Applicant: Yungdong Meng ,  Kehong Fang

Inventor： Yungdong Meng ,  Kehong Fang

IPC: C08L79/00 ,  C08L71/12 ,  C08L63/00 ,  C08J5/24

CPC classification number: C08L79/00 ,  C08J5/24 ,  C08J2363/00 ,  C08J2371/12 ,  C08J2379/00 ,  C08J2463/00 ,  C08J2471/12 ,  C08J2479/00 ,  C08K5/5313 ,  C08L63/00 ,  C08L71/12 ,  C08L71/126 ,  C08L2201/02 ,  C08L2205/03 ,  H05K2201/029 ,  H05K2201/0293 ,  Y10T428/31522 ,  Y10T442/20 ,  C08L79/04

Abstract: The present invention relates to a thermoset resin composition, and a prepreg and a laminate for a printed circuit board manufactured therefrom. The thermoset resin composition comprises the following components: a phosphorus-containing polyphenyl ether resin having low molecular weight, an epoxy resin, a cyanate resin and an accelerator. The prepreg manufactured using the resin composition comprises a base material and the thermoset resin composition adhered to the base material by impregnation and drying. The laminate for a printed circuit board manufactured using the resin composition comprises a plurality of laminated prepregs, a metal foil covering one or two faces of the laminated prepregs by pressing, with each prepreg comprising a base material and the thermoset resin composition adhered to the base material by impregnation and drying. The thermoset resin composition of the present invention has properties such as a low dielectric constant and a dielectric dissipation factor, high heat resistance, a high glass transition temperature, and flame retardancy, etc. The laminates for a printed circuit board manufactured using same have excellent metal foil peel strength, heat resistance and dielectric properties, and are suitable for high frequency and high speed electronic circuit boards.

Abstract translation: 本发明涉及一种热固性树脂组合物，以及由其制成的用于印刷电路板的预浸料和层压材料。 热固性树脂组合物包含以下组分：低分子量的含磷聚苯醚树脂，环氧树脂，氰酸酯树脂和促进剂。 使用树脂组合物制造的预浸料包含基材，并且通过浸渍和干燥将热固性树脂组合物粘附到基材上。 使用该树脂组合物制造的印刷电路板用层压体包括多层叠预浸料，通过压制覆盖层叠预浸料坯的一面或两面的金属箔，每个预浸料坯包含基材，并且热固性树脂组合物粘附于基材 材料通过浸渍和干燥。 本发明的热固性树脂组合物具有低介电常数和介电损耗因子，高耐热性，高玻璃化转变温度和阻燃性等性质。使用该印刷电路板制造的印刷电路板的层压板具有优异的 金属箔剥离强度，耐热性和介电性能，适用于高频高速电路板。

公开(公告)号：US20150148453A1

公开(公告)日：2015-05-28

申请号：US14088421

申请日：2013-11-24

Applicant: ITEQ CORPORATION ,  ITEQ (DONGGUAN) CORPORATION

Inventor： Feng Tang ,  Quansheng Zhu ,  Tsung-Lieh Weng ,  Yongxin Jiang ,  Hailin Li ,  Faquan Tu

IPC: C08L85/02

CPC classification number: C08L85/02 ,  C08G59/4071 ,  C08L63/00 ,  C08L2201/02 ,  C08L2201/08 ,  C08L2203/20 ,  C08L79/04

Abstract: Disclosed is a halogen-free epoxy resin composition for integrated circuit packaging, and the resin composition includes a polyfunctional epoxy resin, a benzoxazine resin, a phosphorus-containing a curing agent, an inorganic filler, a curing accelerator and a solvent. The rigid and firm resins and inorganic filler contained in the composition provide a low coefficient of thermal expansion and a high heat resistance, so that laminates made of this composition are applicable for IC packaging substrates, and the laminates contain halogen-free compounds with a flame retardant rating of UL94-V0 grade.

Abstract translation: 公开了一种用于集成电路封装的无卤环氧树脂组合物，该树脂组合物包括多官能环氧树脂，苯并恶嗪树脂，含磷固化剂，无机填料，固化促进剂和溶剂。 包含在组合物中的刚性和坚固的树脂和无机填料提供低的热膨胀系数和高耐热性，使得由该组合物制成的层压体可应用于IC封装基板，并且层压体含有无卤化合物，其具有火焰 UL94-V0级的阻燃等级。

公开(公告)号：US20150141560A1

公开(公告)日：2015-05-21

申请号：US14540711

申请日：2014-11-13

Applicant: Konica Minolta, Inc.

Inventor： Yiqiang YU ,  Masashi Mamino ,  Ryuji Kitani

IPC: C08L67/02

CPC classification number: C08L67/02 ,  C08J3/00 ,  C08J3/005 ,  C08J3/20 ,  C08J3/203 ,  C08J2367/00 ,  C08J2367/02 ,  C08J2369/00 ,  C08L69/00 ,  C08L2201/02

Abstract: Provided is a thermoplastic resin composition having high flame resistance and high fluidity during injection molding, and improved impact resistance in a molded article. A method for producing a thermoplastic resin composition, the method including the step (1) of obtaining a polyester resin mixture by melt-kneading 50 to 80 parts by weight of crystalline polyester resin and 20 to 50 parts by weight of amorphous polyester resin with an extruder, and the step (2) of mixing the polyester resin mixture, a polycarbonate resin, a flame retardant, a dripping inhibitor and a toughening agent, wherein the cylinder temperature of the extruder is 250 to 280° C.

Abstract translation: 本发明提供一种热塑性树脂组合物，其在注射成型时具有高阻燃性和高流动性，并且在模制品中具有改进的耐冲击性。 一种热塑性树脂组合物的制造方法，其特征在于，包括通过将50〜80重量份结晶性聚酯树脂和20〜50重量份无定形聚酯树脂进行熔融混炼而得到聚酯树脂混合物的方法 挤出机和混合聚酯树脂混合物，聚碳酸酯树脂，阻燃剂，滴液抑制剂和增韧剂的步骤（2），其中挤出机的料筒温度为250-280℃。

公开(公告)号：US20150126650A1

公开(公告)日：2015-05-07

申请号：US14400118

申请日：2013-05-03

Applicant: ICL-IP AMERICA INC.

Inventor： Pierre Georlette ,  Eyal Eden ,  Rachel Shtekler ,  Marc Leifer ,  Sergei V. Levchik

IPC: C08L25/06

CPC classification number: C08L25/06 ,  C08K5/0066 ,  C08K5/0091 ,  C08K5/02 ,  C08K5/5333 ,  C08L27/18 ,  C08L51/04 ,  C08L55/02 ,  C08L2201/02 ,  C08L2201/08 ,  C08L2203/20 ,  C08L25/12

Abstract: There is provided herein an antimony trioxide-free flame-retarded styrenic thermoplastic polymer composition comprising: (a) at least one styrenic thermoplastic polymer; (b) at least one brominated flame retardant, (c) at least one metal phosphonate; and, (d) at least one antidripping agent. There is also provided a method of making said flame retarded styrenic thermoplastic polymer composition; and, an article comprising the styrenic thermoplastic polymer composition.

Abstract translation: 本文提供了不含三氧化锑的阻燃苯乙烯热塑性聚合物组合物，其包含：（a）至少一种苯乙烯类热塑性聚合物; （b）至少一种溴化阻燃剂，（c）至少一种金属膦酸盐; 和（d）至少一种抗复发剂。 还提供了制造所述阻燃苯乙烯类热塑性聚合物组合物的方法; 以及包含苯乙烯类热塑性聚合物组合物的制品。