公开(公告)号：WO2014055730A1

公开(公告)日：2014-04-10

申请号：PCT/US2013/063213

申请日：2013-10-03

Applicant: APPLIED OPTOELECTRONICS, INC.

Inventor： ZHENG, Jun, ,  MURRY, Stefan, ,  HWANG, Wen-Yen,

IPC: H04J14/02

CPC classification number: H01S5/4062 ,  H01S5/4087 ,  H04J14/0254 ,  H04J14/0279 ,  H04J14/0282

Abstract: A filtered laser array assembly generally includes an array of laser emitters coupled between external modulators and an arrayed waveguide grating (AWG). Each of the laser emitters emits light across a plurality of wavelengths including, for example, channel wavelengths in an optical communication system. The AWG filters the emitted light from each of the laser emitters at different channel wavelengths associated with each of the laser emitters. Lasing cavities are formed between each of the laser emitters and a back reflector coupled to an output of the AWG such that laser output from the laser emitters is provided at the respective channel wavelengths of the reflected, filtered light. The external modulators enable high speed modulation of the laser output. The modulated laser output may then be optically multiplexed to produce an aggregate optical signal including multiple channel wavelengths.

Abstract translation: 滤波的激光阵列组件通常包括耦合在外部调制器和阵列波导光栅（AWG）之间的激光发射器的阵列。 每个激光发射器在多个波长中发射光，包括例如光通信系统中的信道波长。 AWG在与每个激光发射器相关联的不同通道波长处对来自每个激光发射器的发射光进行滤波。 在每个激光发射器和耦合到AWG的输出端的后反射器之间形成激光腔，使得来自激光发射器的激光输出被提供在被反射的滤光光的各个通道波长处。 外部调制器可实现激光输出的高速调制。 调制的激光输出然后可以被光学多路复用以产生包括多个信道波长的聚合光信号。

公开(公告)号：WO2008098050A2

公开(公告)日：2008-08-14

申请号：PCT/US2008053177

申请日：2008-02-06

Applicant: APPLIED OPTOELECTRONICS INC ,  MURRY STEFAN J ,  MORBI ZULFIKAR ,  LIN KAI-SHENG

Inventor： MURRY STEFAN J ,  MORBI ZULFIKAR ,  LIN KAI-SHENG

IPC: G02B6/36

CPC classification number: G02B6/4201 ,  G02B6/4245 ,  G02B6/4271 ,  G02B6/4279 ,  G02B6/428

Abstract: A modular laser package system may be used to mount one type of laser package, such as a coaxial or TO (transistor outline) can laser package, to a circuit board, such as a transmitter board or a motherboard, designed to receive another type of laser package housing, such as a butterfly-type laser package housing. The modular laser package system may include a circuit board mounting platform, a laser housing mount to mount the laser package to the circuit board mounting platform, and a mounting base to facilitate mounting to the transmitter board or motherboard. The modular laser package system may also include a temperature control device, such as a thermo-electric cooler (TEC), and a temperature sensor, such as a thermistor, mounted to the laser housing mount to control and monitor the temperature of the laser package.

Abstract translation: 模块化激光器封装系统可以用于将诸如同轴或TO（晶体管轮廓）罐激光器封装之类的一种类型的激光器封装安装到诸如发射器板或主板的电路板上，所述电路板被设计成接收另一类型的 激光封装外壳，如蝶型激光封装外壳。 模块化激光器封装系统可以包括电路板安装平台，将激光器封装件安装到电路板安装平台的激光器外壳安装件，以及便于安装到传输器板或主板的安装基座。 模块化激光器封装系统还可以包括温度控制装置，诸如热电冷却器（TEC），以及安装到激光器外壳安装件的温度传感器，诸如热敏电阻器，以控制和监测激光器封装件的温度 。

公开(公告)号：WO2008039967A2

公开(公告)日：2008-04-03

申请号：PCT/US2007/079839

申请日：2007-09-28

Applicant: APPLIED OPTOELECTRONICS, INC. ,  MURRY, Stefan J.,

Inventor： MURRY, Stefan J.,

IPC: H01S3/02

CPC classification number: H01S5/024 ,  H01S5/02212 ,  H01S5/02453 ,  H01S5/0612

Abstract: A laser for use in a laser transmitter may be heated to maintain an operating temperature of the laser above a temperature floor such that the operating temperature of the laser is allowed to vary within a reduced operating temperature range. The reduced operating temperature range of the laser thus allows the wavelength emitted by the laser to vary within a reduced range of emission wavelengths. In other words, the temperature floor reduces the temperature range experienced by the laser, which reduces the wavelength excursion. The operating temperature of the laser may be allowed to rise above the temperature floor without cooling the laser to stabilize the operating temperature.

Abstract translation: 可以加热用于激光发射器的激光器，以将激光器的工作温度保持在温度范围之上，使激光器的工作温度允许在降低的工作温度范围内变化。 因此，激光器的降低的工作温度范围允许激光器发射的波长在发射波长的减小范围内变化。 换句话说，温度降低了激光器所经历的温度范围，从而降低了波长偏移。 可以允许激光器的工作温度升高到温度上限以上而不冷却激光器以稳定工作温度。

公开(公告)号：WO03023457A3

公开(公告)日：2003-05-22

申请号：PCT/US0225155

申请日：2002-08-08

Applicant: APPLIED OPTOELECTRONICS INC

Inventor： ZHENG JUN

IPC: H01S5/024 ,  H01S5/04 ,  H01S5/14 ,  H01S5/183 ,  H01S3/042

CPC classification number: H01S5/183 ,  H01S5/02461 ,  H01S5/041 ,  H01S5/14 ,  H01S5/18341

Abstract: The present invention is directed to a method and VCSEL (200, 300) for improved heat removal/dispersion. The VCSEL comprises a bottom mirror, an active region disposed on the bottom mirror (203, 303), a heat spreading layer (207, 307) disposed on the active region (204, 304), and a top mirror (215, 315) disposed above the heat spreading layer. The heat spreading layer may be composed of InP.

Abstract translation: 本发明涉及用于改进散热/散射的方法和VCSEL（200,300）。 VCSEL包括底镜，设置在底镜（203,303）上的有源区，设置在有源区（204,304）上的散热层（207,307）和顶镜（215,315） 设置在散热层之上。 散热层可以由InP组成。

公开(公告)号：WO2002059935A1

公开(公告)日：2002-08-01

申请号：PCT/US2002/000212

申请日：2002-01-04

Applicant: APPLIED OPTOELECTRONICS, INC.

Inventor： JOHNSON, Jeffery, L.

IPC: H01J40/14

CPC classification number: G01R31/2635

Abstract: One or more photodiode performance parameters for a photodiode (310) are determined by first determining four data points Iph1, Voc1, Iph2, and Voc2, where Iph1 is a first short-circuit current, and Voc1 is a first open-circuit voltage, for the photodiode (310) under a first illumination condition (Qbk), and Iph2 is a second short-circuit current and Voc2 is a second open-circuit voltage, for the photodiode (310) under a second illumination condition (Qbk + Qb2). Then, at least one photodiode performance parameter for the photodiode is determined as a function of said four data points.

Abstract translation: 通过首先确定四个数据点Iph1，Voc1，Iph2和Voc2，确定光电二极管（310）的一个或多个光电二极管性能参数，其中Iph1是第一短路电流，Voc1是第一开路电压， 在第一照明条件（Qbk）下的光电二极管（310）和在第二照明条件（Qbk + Qb2）下的光电二极管（310）的Iph2是第二短路电流，Voc2是第二开路电压。 然后，确定光电二极管的至少一个光电二极管性能参数作为所述四个数据点的函数。

公开(公告)号：WO2018106810A1

公开(公告)日：2018-06-14

申请号：PCT/US2017/064920

申请日：2017-12-06

Applicant: APPLIED OPTOELECTRONICS, INC.

Inventor： LIN, Kai-Sheng ,  LIAO, Hao-Hsiang ,  LII, Justin

IPC: G02B7/182 ,  H04B10/66

CPC classification number: G02B7/1824 ,  G02B7/003 ,  G02B27/0916 ,  G02B27/1006 ,  G02B27/141 ,  H04B10/66

Abstract: An optical component holder having a base portion with a chamfered (or step) portion is disclosed herein that allows a technician to position and partially insert the same within an associated opening using a relatively minor amount of force. The chamfered portion of the base portion operates, in a general sense, as a guide that ensures proper alignment of the optical component holder and allows the same to travel a predetermined distance within the opening before being blocked from further travel by "bottoming" out when the wider portion of the base is at the edge of the associated opening. Thus, the chamfered portion provides an alignment feature to provide tactile feedback that indicates to the technician that the optical component holder is aligned and evenly inserted into an associated opening prior to supplying additional force to press the optical component holder fully into a housing.

公开(公告)号：WO2018044993A1

公开(公告)日：2018-03-08

申请号：PCT/US2017/049305

申请日：2017-08-30

Applicant: APPLIED OPTOELECTRONICS, INC.

Inventor： LIN, Kai-Sheng ,  WANG, Chong ,  LII, Justin

IPC: G02B6/42 ,  G02B6/293

Abstract: In an embodiment, an optical component assembly is disclosed and is configured to be at least partially disposed within at least one first opening of an optical subassembly housing. The at least one optical component assembly comprising a base extending from a first end to a second end along a longitudinal axis, and a vertical mount disposed on the base and including a first surface that provides a mounting region to couple to an optical component, the first surface defining a vertical axis that extends substantially upright from the base and a horizontal axis that is angled relative to the longitudinal axis of the base at a first angle, the vertical mount further providing a channel that extends through the vertical mount, wherein the channel provides an optical pathway angled relative to the first surface at the first angle, the first angle being substantially between about 15 and 75 degrees.

Abstract translation: 在一个实施例中，公开了一种光学部件组件并且被配置为至少部分地设置在光学子组件外壳的至少一个第一开口内。 所述至少一个光学部件组件包括沿着纵向轴线从第一端延伸到第二端的基部以及设置在所述基部上并且包括提供安装区域以耦合到光学部件的第一表面的垂直安装件，所述 第一表面，其限定垂直轴线，所述垂直轴线从所述基部基本直立地延伸;以及水平轴线，所述水平轴线相对于所述基部的所述纵向轴线以第一角度成角度，所述垂直安装件还提供延伸穿过所述垂直安装件的通道， 提供以第一角度相对于第一表面成角度的光学路径，第一角度基本上在大约15和75度之间。

公开(公告)号：WO2017189538A1

公开(公告)日：2017-11-02

申请号：PCT/US2017/029350

申请日：2017-04-25

Applicant: APPLIED OPTOELECTRONICS, INC.

Inventor： HO, I-Lung, ,  MIAO, Zhengyu, ,  LI, Qin,

IPC: G02B6/12 ,  H04J14/02

CPC classification number: G02B6/12016 ,  G02B6/12011 ,  G02B6/12019 ,  G02B6/4246 ,  G02B6/4292 ,  H04B10/40 ,  H04J14/02 ,  H04J14/0256

Abstract: An arrayed waveguide grating (AWG) device for use in an optical transceiver is disclosed, and can de-multiplex an optical signal into N number of channel wavelengths. The AWG device can include an AWG chip, with the AWG chip providing a planar lightwave (PLC) circuit configured to de-multiplex channel wavelengths and launch the same into output waveguides. A region of the AWG chip may be tapered such that light traveling via the output waveguides encounters an angled surface of the tapered region and reflects towards an output interface region of the AWG chip. Thus detector devices may optically couple to the output interface region of the AWG chip directly, and can avoid losses introduced by other approaches which couple an output of an AWG to detectors by way of a fiber array or other intermediate device.

Abstract translation: 公开了一种用于光收发器中的阵列波导光栅（AWG）装置，其可将光信号解复用为N个信道波长。 AWG器件可以包括AWG芯片，AWG芯片提供平面光波（PLC）电路，用于解复用信道波长并将其发射到输出波导中。 AWG芯片的区域可以是锥形的，使得经由输出波导传播的光遇到锥形区域的倾斜表面并且朝向AWG芯片的输出接口区域反射。 因此，检测器设备可以直接光学耦合到AWG芯片的输出接口区域，并且可以避免由通过光纤阵列或其他中间设备将AWG的输出耦合到检测器的其他方法引入的损耗。

公开(公告)号：WO2017189536A1

公开(公告)日：2017-11-02

申请号：PCT/US2017/029347

申请日：2017-04-25

Applicant: APPLIED OPTOELECTRONICS, INC.

Inventor： HO, I-Lung ,  LIAO, Hao-Hsiang ,  LII, Justin

IPC: G02B6/42

CPC classification number: G02B6/4244 ,  G02B6/29362 ,  G02B6/4214 ,  G02B6/4215 ,  G02B6/4239 ,  G02B6/4253 ,  G02B6/4263

Abstract: Techniques are disclosed for filling gaps formed between a press-fit component and an optical subassembly housing to introduce a seal or barrier that can prevent or otherwise mitigate the ingress of contaminants. In an embodiment, a layer of sealant material is applied to one or more surfaces of an optical component prior to press-fitting the component into an optical subassembly housing. Alternatively, or in addition to applying sealant to one or more surfaces of an optical component, a layer of sealant material may be disposed on an interface formed between an outer surface of the optical subassembly housing and the optical component press-fit into the same. Techniques disclosed herein are particularly well suited for small form-factor optical subassemblies that include one or more optical components press-fit into openings of a subassembly housing during manufacturing.

Abstract translation: 公开了用于填充在压配部件和光学子组件壳体之间形成的间隙的技术，以引入可以防止或以其他方式减轻污染物进入的密封或屏障。 在一个实施例中，在将部件压配到光学子组件壳体中之前，将一层密封剂材料施加到光学部件的一个或多个表面。 作为替代或者除了将密封剂施加到光学部件的一个或多个表面上之外，密封剂材料层可以设置在形成在光学子组件壳体的外表面和压配合到其中的光学部件之间的界面上。 本文公开的技术特别适合于包括在制造期间压配合到子组件外壳的开口中的一个或多个光学部件的小形状因子光学子组件。

公开(公告)号：WO2016191359A1

公开(公告)日：2016-12-01

申请号：PCT/US2016/033759

申请日：2016-05-23

Applicant: APPLIED OPTOELECTRONICS, INC.

Inventor： HO, I-Lung ,  WANG, Chong ,  LII, Justin ,  MIAO, Zhengyu

IPC: H04B10/40

CPC classification number: H04B10/40 ,  G02B6/4292 ,  G02B6/43 ,  H04B10/506 ,  H04J14/0246 ,  H04J14/025

Abstract: A coaxial transmitter optical subassembly (TOSA) including a cuboid type TO laser package may be used in an optical transceiver for transmitting an optical signal at a channel wavelength. The cuboid type TO laser package is made of a thermally conductive material and has substantially flat outer surfaces that may be thermally coupled to substantially flat outer surfaces on a transceiver housing and/or on other cuboid type TO laser packages. An optical transceiver may include multiple coaxial TOSAs with the cuboid type TO laser packages stacked in the transceiver housing. The cuboid type TO laser package may thus provide improved thermal characteristics and a reduced size within the optical transceiver.

Abstract translation: 包括长方体型TO激光器封装的同轴发射器光学子组件（TOSA）可以用于在信道波长处发送光信号的光收发器中。 长方体型TO激光器封装由导热材料制成，并且具有基本上平坦的外表面，其可以热收缩到收发器壳体上和/或其它长方体型TO激光器封装上的基本平坦的外表面。 光收发器可以包括多个同轴TOSA，其中堆叠在收发器壳体中的长方体型TO激光器封装。 因此，长方体型TO激光器封装可以在光收发器内提供改进的热特性和减小的尺寸。