公开(公告)号：US20040261412A1

公开(公告)日：2004-12-30

申请号：US10819457

申请日：2004-04-07

Applicant: Bookham Technology PLC

Inventor： Ryan Murray Hickey

IPC: G11B005/56 ,  G11B021/24

CPC classification number: B81B3/004 ,  B81B3/0024 ,  B81B2201/047 ,  B81B2203/0118 ,  B81B2203/033 ,  B81B2203/058 ,  G02B26/0866 ,  H01H2061/008

Abstract: An asymmetric MEMS thermal actuator device includes a base portion, typically a pair of bond pads, and an actuator element connected to the base portion by a flexure portion. The actuator element has a first arm and a second arm alongside the first arm and spaced from the first arm. The second arm is wider than the first arm so that the actuator element deflects about the flexure element due to differential heating in the first and second arms when an electrical current is passed therethrough. A cut-out portion is provided in the second arm adjacent the first arm so as to increase the spacing therefrom over at least a portion of the second arm. Preferably, a heat sink is also provided laterally adjacent the second arm.

Abstract translation: 非对称MEMS热致动器装置包括基部，通常为一对接合焊盘，以及通过挠曲部分连接到基部的致动器元件。 致动器元件具有与第一臂并排并与第一臂间隔开的第一臂和第二臂。 第二臂比第一臂宽，使得当电流通过其中时，由于第一和第二臂中的差加热，致动器元件围绕挠曲元件偏转。 切割部分设置在邻近第一臂的第二臂中，以便在第二臂的至少一部分上增加其间隔。 优选地，散热器还横向设置在第二臂的附近。

公开(公告)号：US20040147053A1

公开(公告)日：2004-07-29

申请号：US10676976

申请日：2003-09-30

Applicant: BOOKHAM TECHNOLOGY, PLC

Inventor： Richard William Glew ,  Ian B. Betty ,  Jonathan Greenspan

IPC: H01L021/00 ,  C30B001/00 ,  H01L021/36

CPC classification number: H01L21/02463 ,  G02B6/1228 ,  H01L21/02392 ,  H01L21/02461 ,  H01L21/02543 ,  H01L21/02546 ,  H01L21/0262 ,  H01L21/02639

Abstract: A method for integrating optical devices in a single growth step by utilizing a combination of Selective Area Growth and Etch (SAGE) is provided. An first device is formed between a set of oxide-masked regions, whilst a second device is formed in an adjacent planar region. By use of Selected Area Growth and Etch (SAGE), in which the growth between the oxide-masked regions is greater than the growth in the planar region, and in which the etch rate in the area between the oxide-masked regions is substantially the same as that in the planar region, the number of active quantum layers for the first device are formed between the oxide-masked regions, and a different number of layers for the second device is formed in the planar region.

Abstract translation: 提供了通过利用选择区生长和蚀刻（SAGE）的组合在一个生长步骤中整合光学器件的方法。 在一组氧化物掩蔽区域之间形成第一器件，而第二器件形成在相邻的平坦区域中。 通过使用选择区生长和蚀刻（SAGE），其中氧化物掩模区域之间的生长大于平面区域的生长，并且其中氧化物掩模区域之间的区域中的蚀刻速率基本上是 与平面区域相同，在氧化物掩模区域之间形成第一器件的有源量子层的数量，并且在平面区域中形成不同数量的第二器件的层。

公开(公告)号：US20030057428A1

公开(公告)日：2003-03-27

申请号：US10283466

申请日：2002-10-30

Applicant: Bookham Technology PLC

Inventor： Ian Edward Day

IPC: H01L033/00

CPC classification number: G02F1/025 ,  G02F1/0147

Abstract: A thermo-optic semiconductor device has one semiconductor region providing an optical waveguide and an adjacent semiconductor region providing a resistive heater between two doped regions, current may be passed through the resistive heater within the adjacent semiconductor region to heat it and thereby vary the optical characteristics of the waveguide.

Abstract translation: 热光半导体器件具有提供光波导的一个半导体区域和在两个掺杂区域之间提供电阻加热器的相邻半导体区域，电流可以通过相邻半导体区域内的电阻加热器加热，从而改变光学特性 的波导。

公开(公告)号：US20020131744A1

公开(公告)日：2002-09-19

申请号：US09855525

申请日：2001-05-16

Applicant: Bookham Technology plc

Inventor： Ivan Evans ,  Arnold Peter Roscoe Harpin

IPC: G02B006/10

CPC classification number: G02B6/1228 ,  G02B6/12 ,  G02B6/132 ,  G02B6/136 ,  G02B2006/12097

Abstract: An optical waveguide structure formed on an optical chip comprising a first waveguide layer 3 of a first material supported on a substrate 7 and a second waveguide layer 6 of a second material supported on the first waveguide layer 3. The first waveguide layer 3 is separated from the substrate 7 by an optical confinement layer 8 and the second waveguide layer 6 is separated from the first waveguide layer 3 by an etch-stop layer 9. The etch-stop layer 9 is thin compared to the thickness of the first waveguide layer 3 and/or the second waveguide layer 6 and is of a material which enables it to act as an etch-stop when features are etched in the second waveguide layer 6.)

Abstract translation: 一种形成在光学芯片上的光波导结构，包括支撑在基板7上的第一材料的第一波导层3和支撑在第一波导层3上的第二材料的第二波导层6.第一波导层3与 通过光学限制层8和第二波导层6的衬底7通过蚀刻停止层9与第一波导层3分离。与第一波导层3的厚度相比，蚀刻停止层9薄 /或第二波导层6，并且是当在第二波导层6中蚀刻特征时使其能够用作蚀刻停止的材料）

公开(公告)号：US20020048653A1

公开(公告)日：2002-04-25

申请号：US09981890

申请日：2001-10-19

Applicant: Bookham Technology PLC

Inventor： Karen Emma Todd

IPC: B32B023/02

CPC classification number: G02B6/4201 ,  G02B6/12 ,  Y10T428/24793

Abstract: An integrated optical package comprises an integrated optical device in a substantially planar form and a supporting structure, the device being held by the supporting structure in a plurality of fixing regions, the fixing regions being elongate and serving to secure the device in each of the two dimensions of the planar form, at least one edge of the planar form being unfixed. Thus, either two or three edges of the planar form are unfixed, assuming that the device is rectangular. This ensures that one or two edges are free, allowing the device to accommodate stresses by slight relaxation. The device can be held by a heat curable composition, ideally adapted to cure at about the operating temperature of the device. Thus, when the device is operating, the adhesive is substantially at or near its cure temperature. The composition should cure at a temperature within 20null C. of the operating temperature of the device. Given the normal operating temperatures of AWG devices, suitable cure temperatures are between 60 and 90null C., more preferably between 70 and 80null C. or 70 to 75null C. The composition is preferably resilient after curing to assist further in reducing stresses in the device. The application also relates to an integrated optical package comprising an integrated optical device in a substantially planar form, a supporting structure, controlled heating apparatus to elevate the temperature of the device to within a selected temperature range, the device being attached to the supporting structure by a curable composition with a curing temperature within about 20null C. of the selected temperature range.

Abstract translation: 集成光学封装包括基本平面形式的集成光学器件和支撑结构，该器件由支撑结构保持在多个固定区域中，固定区域是细长的，并用于将器件固定在两个 平面形状的尺寸，平面形式的至少一个边缘是不固定的。 因此，假设设备是矩形的，平面形式的两个或三个边缘是不固定的。 这确保一个或两个边缘是空闲的，允许设备通过轻微的松弛来适应应力。 该装置可以由可热固化的组合物保持，理想地适于在装置的操作温度附近固化。 因此，当设备运行时，粘合剂基本处于或接近其固化温度。 组合物应在装置的工作温度的20℃以内的温度下固化。 鉴于AWG装置的正常工作温度，合适的固化温度为60至90℃，更优选为70至80℃或70至75℃。组合物在固化后优选具有弹性，以进一步帮助减少应力 在设备中。 该应用还涉及一种集成光学封装，其包括基本平面形式的集成光学器件，支撑结构，受控加热装置，用于将器件的温度升高到选定的温度范围内，该器件通过 具有所选温度范围的约20℃的固化温度的可固化组合物。

公开(公告)号：US20030030066A1

公开(公告)日：2003-02-13

申请号：US10216095

申请日：2002-08-09

Applicant: Bookham Technology PLC

Inventor： Edmund Peter Clinton Herman

IPC: H01L033/00

CPC classification number: H01S5/02268 ,  H01S5/02272

Abstract: An optical device (110) has a substrate (101) with an outer surface (103) and an optical component (117) having a base (115) which interfaces with the outer surface of the substrate. In one embodiment at least one gap (109) is disposed between the outer surface of the substrate and the base of the optical device, the at least one gap containing an adhesive (125) which adheres the substrate and the optical device together and at least one interface (123,133) between the base and the outer surface. In another embodiment a plurality of spaced-apart gaps are disposed between the outer surface of the substrate and the base of the optical device, each gap containing an adhesive which adheres the substrate and optical device together.

Abstract translation: 光学装置（110）具有具有外表面（103）的基板（101）和具有与基板的外表面相接的基座（115）的光学部件（117）。 在一个实施例中，至少一个间隙（109）设置在基板的外表面和光学装置的基部之间，所述至少一个间隙包含将基板和光学装置粘合在一起的粘合剂（125），并且至少 一个接口（123,133）在基座和外表面之间。 在另一个实施例中，多个间隔开的间隙设置在基板的外表面和光学装置的基座之间，每个间隙包含将基板和光学装置粘合在一起的粘合剂。

公开(公告)号：US20030020560A1

公开(公告)日：2003-01-30

申请号：US10201077

申请日：2002-07-24

Applicant: Bookham Technology plc

Inventor： Stephen Paul Marsh

IPC: H01P001/04

CPC classification number: H01P5/085 ,  H01P3/003

Abstract: In electronic apparatus, a coaxial signal cable is connected to a semiconductor circuit using a coaxial connector 24 to convert the coaxial signal to a coplanar wave (CPW) mode, the CPW mode signal being transferred from the connector 24 to the circuit 27 via a flexible connection 23 comprising a CPW transmission line 25 on a flexible substrate 26.

Abstract translation: 在电子设备中，使用同轴连接器24将同轴信号电缆连接到半导体电路，以将同轴信号转换为共面波（CPW）模式，CPW模式信号通过柔性的从连接器24传送到电路27 连接23包括柔性基板26上的CPW传输线25。

公开(公告)号：US20030002801A1

公开(公告)日：2003-01-02

申请号：US10176358

申请日：2002-06-20

Applicant: Bookham Technology PLC

Inventor： Renaud Vegny ,  Christophe P. Prel

IPC: G02B006/26 ,  G02B006/30 ,  G02B006/36

CPC classification number: G02B6/3676 ,  G02B6/30 ,  G02B6/3652 ,  G02B6/3692

Abstract: A system (10) comprises a carrier (1) which is adapted to carry an optical fiber (9) and an optical chip (3) having a circuit element (4). The carrier and the optical chip are provided with co-operable alignment features (13,14) for aligning the carrier with the optical chip so that the optical fiber and the circuit element are optically coupled.

Abstract translation: 系统（10）包括适于承载光纤（9）的载体（1）和具有电路元件（4）的光学芯片（3）。 载体和光学芯片设置有用于使载体与光学芯片对准的可协调对准特征（13,14），使得光纤和电路元件光学耦合。

公开(公告)号：US20020131747A1

公开(公告)日：2002-09-19

申请号：US09864393

申请日：2001-05-25

Applicant: Bookham Technology plc

Inventor： Stephen William Roberts ,  Bradley Jonathan Luff ,  John Paul Drake ,  Stephen Geoffrey Unwin

IPC: G02B006/125

CPC classification number: G02B6/136 ,  G02B6/1228 ,  G02B6/132 ,  G02B6/305 ,  G02B2006/12097

Abstract: A rib waveguide structure comprising a layer (4) of light conductive material defined between two planar faces with a rib (9) formed on one of the faces and an optical components e.g. a tapered waveguide (6) optically coupled to the other face. An inverted rib waveguide comprising a light conductive layer (11) and a rib (10) that projects from the light conductive layer (11) into a substrate (4, 8) is also described as well as other optical devices comprising a light conductive layer separated from a substrate by a non-planar layer (3) of light confining material and optical devices comprising two or more layers (2, 3; 18, 19, 20) of light confining material buried within a rib with a light conducting component (10; 17; 22) at least a part of which is formed between planes defined by the two layers of light confining material. A method of forming such devices is also described.

Abstract translation: 肋波导结构包括限定在两个平面之间的导光材料层（4），其上形成有一个表面上的肋（9） 光学耦合到另一个面的锥形波导（6）。 还描述了包括导光层（11）和从导光层（11）突出到衬底（4,8）中的肋（10）的倒置肋波导，以及包括导光层 通过光限制材料的非平面层（3）和包含两个或更多层（2,3; 18,19,20）的光限制材料的光限制材料与基片间隔开， 10; 17; 22），其至少一部分形成在由两层光限制材料限定的平面之间。 还描述了形成这种装置的方法。

公开(公告)号：US20020122651A1

公开(公告)日：2002-09-05

申请号：US10050575

申请日：2002-01-18

Applicant: BOOKHAM TECHNOLOGY PLC

Inventor： Stephen William Roberts

IPC: G02B006/10 ,  G02B006/27

CPC classification number: G02B6/12011 ,  G02B5/3083 ,  G02B6/105 ,  G02B6/12023 ,  G02B2006/12097 ,  G02B2006/12116 ,  H04L41/12 ,  H04L63/1433 ,  H04L63/145

Abstract: A method of controlling birefringence in a rib waveguide structure manufactured in silicon, the rib waveguide structure comprising an elongated rib element having an upper face and two side faces, the method comprising forming a layer of thermal oxide to a predetermined thickness on said upper face and side faces of at least a portion of said rib waveguide structure.

Abstract translation: 一种在硅制造的肋波导结构中控制双折射的方法，所述肋波导结构包括具有上表面和两个侧面的细长肋元件，所述方法包括在所述上表面上形成预定厚度的热氧化层， 所述肋波导结构的至少一部分的侧面。