Abstract:
A mobile device includes a diversity antenna, a radio-frequency antenna, a first wireless communication circuit, a second wireless communication circuit and a first switching circuit. The second wireless communication circuit is electrically connected to the radio-frequency antenna. The first switching circuit is electrically connected to the diversity antenna, the first wireless communication circuit and the second wireless communication circuit. In a first mode, the diversity antenna is conducted to the first wireless communication circuit through the first switching circuit, and the first wireless communication circuit receives a wireless signal through the diversity antenna. In a second mode, the diversity antenna is conducted to the second wireless communication circuit through the first switching circuit, and the second wireless communication circuit executes a multi-input multi-output transmission through the diversity antenna and the radio-frequency antenna.
Abstract:
A sandal includes a sole having an outer front portion, an inner front portion, an outer rear portion, an inner rear portion; an outer middle portion, and an inner middle portion, and a foot strapping system having a primary tether which has two end portions and two extensions attached to the sole, an auxiliary tether having two end portions attached to the sole for securing a foot of a user to the sole. The primary tether includes four anchorages attached to the end portions and the extensions, and the auxiliary tether includes two anchorages attached to the end portions of the auxiliary tether respectively. The sole includes six recesses formed in the bottom portion for engaging with the anchorages.
Abstract:
An adhesive coating device is provided with an adhesive reservoir; two opposite adjustment rollers at bottom of the reservoir; a pattern roller between the adjustment rollers and having a pattern formed thereon; a resilient roller under the pattern roller; a roller member under the resilient roller; two pivotal, co-rotated links on a side of the reservoir and operatively connected to the adjustment rollers respectively; and a spring biased adjustment screw pivotably secured to an end of one link. Clockwise rotation of the adjustment screw rotates the links at different directions, thereby decreasing a gap between the pattern roller and each adjustment roller.
Abstract:
An emotion script generating method includes receiving a user's emotion data, and generating emotion script using the emotion data based on a predefined template.
Abstract:
Described is a technology by which a relay is coupled (e.g., by a wire) to a network and (e.g., by a wireless link) to an endpoint. Incoming data packets directed towards the endpoint are processed by the relay according to an error correction scheme, such as one that replicates packets. The reprocessed packets, which in general are more robust against packet loss, are then sent to the endpoint. For outgoing data packets received from the endpoint, the relay reprocesses the outgoing packets based upon the error correction scheme, such as to remove redundant packets before transmitting them to the network over the wire. Also described are various error correction schemes, and various types of computing devices that may be used as relays. The relay may be built into the network infrastructure, and/or a directory service may be employed to automatically find a suitable relay node for an endpoint device.
Abstract:
The present invention provides a structure of a resistor comprising: a substrate having an interfacial layer thereon; a resistor trench formed in the interfacial layer; at least a work function metal layer covering the surface of the resistor trench; at least two metal bulks located at two ends of the resistor trench and adjacent to the work function metal layer; and a filler formed between the two metal bulks inside the resistor trench, wherein the metal bulks are direct in contact with the filler.
Abstract:
An integrated chip package structure and method of manufacturing the same is by adhering dies on a silicon substrate and forming a thin-film circuit layer on top of the dies and the silicon substrate. Wherein the thin-film circuit layer has an external circuitry, which is electrically connected to the metal pads of the dies, that extends to a region outside the active surface of the dies for fanning out the metal pads of the dies. Furthermore, a plurality of active devices and an internal circuitry is located on the active surface of the dies. Signal for the active devices are transmitted through the internal circuitry to the external circuitry and from the external circuitry through the internal circuitry back to other active devices. Moreover, the chip package structure allows multiple dies with different functions to be packaged into an integrated package and electrically connecting the dies by the external circuitry.
Abstract:
An adhesive coating device is provided with an adhesive reservoir; two opposite adjustment rollers at bottom of the reservoir; a pattern roller between the adjustment rollers and having a pattern formed thereon; a resilient roller under the pattern roller; a roller member under the resilient roller; two pivotal, co-rotated links on a side of the reservoir and operatively connected to the adjustment rollers respectively; and a spring biased adjustment screw pivotably secured to an end of one link. Clockwise rotation of the adjustment screw rotates the links at different directions, thereby decreasing a gap between the pattern roller and each adjustment roller.
Abstract:
A touch display device including a touch panel, a protection layer, a conductive optical adhesive layer and a display panel is provided. The touch panel includes a substrate, pads, at least one grounding pad, a touch-sensing device, and at least one ESD protection line. The touch panel includes a pad area and an active area. The pads and the grounding pad are disposed on the substrate and located in the pad area. The touch-sensing device is disposed on the substrate and located in the active area. The ESD protection line is disposed on the substrate and located at a side of the active area. The protection layer including a first opening covers the touch panel and a portion of the pad area is exposed by the first opening. The conductive optical adhesive layer is disposed on the protection layer and electrically connected to the ESD protection circuit.
Abstract:
A plurality of network addresses from a distributed client is obtained, at least a first portion of the obtained network addresses including resolved network address responses to distributed client requests for resolved network addresses corresponding to one or more network location indicators associated with a first web service. Test content is obtained, based on one or more of the network addresses included in the first portion. It is determined whether the obtained test content includes unauthorized content.