Abstract:
A method for fabricating a wireless pressure sensor includes providing a first substrate. A portion of the first substrate is controllably displaced to form a cavity. A conducting material is patterned on the first substrate to form a first capacitor plate and a first inductor. A second substrate is provided. A conducting material is patterned on the second substrate to form a second capacitor plate. The second substrate is attached to the first substrate to seal the cavity such that at least a portion of the second substrate is movable with respect to the first substrate within the cavity in response to a change in an external condition. A hermetically sealed capacitive pressure sensor may reside in the cavity between the first substrate and second substrate.
Abstract:
Disclosed is an implant and method of making an implant. The implant having a housing that defines a cavity. The housing includes a sensor comprising a base attached to a diaphragm wherein said base may be positioned within said cavity. The sensor may be a capacitive pressure sensor. The diaphragm may be connected to the housing to hermetically seal said housing. The sensor may include electrical contacts positioned on the diaphragm. The base may define a capacitive gap and a vent wherein the electrodes may be positioned within said capacitive gap such that at least a portion of the electrical contacts extend through the vent. The implant may include a coil in electric communication with the sensor, said coil may be positioned within said housing. A printed circuit board having at least one component may be attached to the floating base.
Abstract:
A wireless circuit includes a housing having at least one opening, and sensor connected to the housing at the opening. The sensor includes a first layer having a first dimension and a second layer having a second dimension shorter than the first dimension. The second layer may be positioned entirely within the housing and a surface of said first layer may be exposed to an exterior of the housing.
Abstract:
A wireless circuit includes a housing having at least one opening, and sensor connected to the housing at the opening. The sensor includes a first layer having a first dimension and a second layer having a second dimension shorter than the first dimension. The second layer may be positioned entirely within the housing and a surface of said first layer may be exposed to an exterior of the housing.
Abstract:
The present invention is a communication system for communicating with an implantable device. The communication system comprises an implantable device, an implantable electronic unit and a remote antenna, wherein the remote antenna extends from the implantable electronic unit on wire leads. In one embodiment, the implantable device may be a sensor. In another embodiment, the implantable electronic unit may communicate wirelessly with the implantable device through a remote antenna.
Abstract:
A method for patterning a surface includes providing a first layer of mechanically deformable material having a first surface. A second layer of mechanically deformable material is placed on the first surface. At least a portion of the second layer is controllably displaced to form at least one patterned void through the second layer.
Abstract:
A radio frequency identification (RFID) tag device for monitoring at least one of ingestion and digestion by a subject of a solid dosage form includes a substrate attachable to the solid dosage form or at least partially embedded into the surface of the solid dosage form and an RFID tag at least partially formed on the substrate. The RFID tag is configured to generate a signal and transmit the generated signal to an external receiver to facilitate monitoring at least one of ingestion and digestion by the subject of the solid dosage form.
Abstract:
Provided are various embodiments of improvements made to methods, systems and assemblies of implant delivery systems and the associated implants. In one embodiment, provided is an implant delivery system comprising an implant, a first sheath and a second sheath each extending from a proximal end of said implant delivery system, the first sheath is translatable relative to said second sheath wherein said implant is connected to an exterior surface of said first sheath, and wherein said first sheath and said second sheath are movable with respect to one another to deploy said implant to a target site in an anatomy. Said delivery system may be configured to be partially inserted into a blood vessel of a human body such that said proximal end remains external to said body and said distal end is internal to said body.
Abstract:
The present disclosure relates to various anchoring systems for a catheter delivered device. In one instance the anchoring systems of the present disclosure are designed to be used in connection with a pulmonary artery implant device. In one embodiment, an anchoring system of the present disclosure comprises two anchoring ends, a distal end anchoring structure and a proximal end anchoring structure, where at least one of the distal or proximal anchoring structures has a clover-shaped structure formed by at least three lobes. In another embodiment, the distal anchoring structure includes an elongated and angled shape formed by wire material. In another embodiment, both the distal and proximal anchoring structures have a clover-shaped structure formed by at least three lobes.
Abstract:
Disclosed is an implant and method of making an implant. The implant having a housing that defines a cavity. The housing includes a sensor comprising a base attached to a diaphragm wherein said base may be positioned within said cavity. The sensor may be a capacitive pressure sensor. The diaphragm may be connected to the housing to hermetically seal said housing. The sensor may include electrical contacts positioned on the diaphragm. The base may define a capacitive gap and a vent wherein the electrodes may be positioned within said capacitive gap such that at least a portion of the electrical contacts extend through the vent. The implant may include a coil in electric communication with the sensor, said coil may be positioned within said housing. A printed circuit board having at least one component may be attached to the floating base.