Patent search ap:"MOMENTIVE PERFORMANCE MATERIALS INC." Page 5

41.

发明专利
Conductive liquid silicone rubber composition 有权
Title translation: 导电液硅橡胶组合物

公开(公告)号：JP2010031292A

公开(公告)日：2010-02-12

申请号：JP2009255905

申请日：2009-11-09

Applicant: Momentive Performance Materials Inc , モメンティブ・パフォーマンス・マテリアルズ・ジャパン合同会社

Inventor： TABEI SHINGO , IIDA ISAO

IPC: C09D183/04 , C09D5/24 , C09D7/12 , C09D183/10 , H01B1/24

Abstract: PROBLEM TO BE SOLVED: To maintain a homogeneous dispersion/solution condition for a long time in a conductive liquid silicone rubber composition containing carbon black as a conductive material. SOLUTION: The conductive liquid silicone rubber composition contains (A) 100 pts.mass of a polyorganosiloxane having a degree of polymerization of 100-2,000, (B) 0.5-30 pts.mass of a silicone oil, which contains a monovalent group (R 2 group) selected from an aryl group and an aralkyl group, has a degree of polymerization of 5-1,000, and includes at least 5 mol% of an SiO unit having the R 2 group, (C) 5-100 pts.mass of carbon black, (D) a required amount of a curing agent, and (E) a solvent. COPYRIGHT: (C)2010,JPO&INPIT

Abstract translation: 要解决的问题：在含有炭黑作为导电材料的导电性液体硅橡胶组合物中长时间保持均匀的分散/溶液条件。导电性液体硅橡胶组合物含有（A）100聚体聚合度为100〜2000的聚有机硅氧烷，（B）0.5〜30质量％的硅油的100质量份，含有一价选自芳基和芳烷基的基团（R 2 SP 2基团）的聚合度为5-1,000，并且包括至少5mol％的具有R 2℃，（C）5-100个碳黑炭黑，（D）所需量的固化剂和（E）溶剂。版权所有（C）2010，JPO＆INPIT

42.

发明专利
Thermoconductive silicone composition 有权
Title translation: 热固性硅酮组合物

公开(公告)号：JP2010006923A

公开(公告)日：2010-01-14

申请号：JP2008166827

申请日：2008-06-26

Applicant: Momentive Performance Materials Inc , モメンティブ・パフォーマンス・マテリアルズ・ジャパン合同会社

Inventor： TAMURA TAKERU

IPC: C08L83/07 , C08K3/00 , C08L83/05 , H01L23/36 , H01L23/373

CPC classification number: H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2224/73253 , H01L2924/00

Abstract: PROBLEM TO BE SOLVED: To provide a silicone composition which has the excellent workability (application workability) owing to the low viscosity and the excellent adhesiveness and also forms a cured product which has the high thermoconductivity. SOLUTION: The thermoconductive silicone composition contains (A) 100 pts.wt. of a siloxane oligomer having a viscosity at 23°C of 10-100 mPa s and having a trialkoxysilyl group and an alkenyl group, (B) 1,000-3,000 pts.wt. of a thermoconductive filler having different three average particle diameters, (C) a platinum-based catalyst, (D) a polyorganohydrogensiloxane of an amount corresponding to 0.5-2.0 of SiH groups relative to one alkenyl group of component (A), and (E) 1.0-10 pts.wt. of an adhesiveness-imparting agent. COPYRIGHT: (C)2010,JPO&INPIT

Abstract translation: 要解决的问题：提供由于低粘度和优异的粘附性而具有优异的可加工性（应用可加工性）的硅酮组合物，并且还形成具有高导热性的固化产物。导热硅氧烷组合物含有（A）100重量份的在23℃下的粘度为10-100mPa·s且具有三烷氧基甲硅烷基和烯基的硅氧烷低聚物，（B）1,000-3,000重量份。具有不同三个平均粒径的导热填料，（C）铂类催化剂，（D）相对于组分（A）的一个烯基的SiH基团相当于0.5-2.0的量的聚有机氢硅氧烷和（E））1.0-10磅的粘合剂赋予剂。版权所有（C）2010，JPO＆INPIT

43.

发明专利
Heat conductive grease composition 审中-公开
Title translation: 热传导润滑脂组合物

公开(公告)号：JP2009221311A

公开(公告)日：2009-10-01

申请号：JP2008065865

申请日：2008-03-14

Applicant: Momentive Performance Materials Inc , モメンティブ・パフォーマンス・マテリアルズ・ジャパン合同会社

Inventor： KOBAYASHI HIDEKI , TAMURA TAKERU

IPC: C10M169/00 , C10M107/50 , C10M113/06 , C10M113/08 , C10M125/04 , C10M125/10 , C10M155/02 , C10N10/04 , C10N10/06 , C10N20/00 , C10N20/02 , C10N20/06 , C10N30/00 , C10N50/10 , H01L23/36

Abstract: PROBLEM TO BE SOLVED: To provide a heat conductive grease composition capable of highly filling a heat conductive filler, and having excellent operation efficiency.
SOLUTION: The heat conductive grease composition comprises (A) an oil having 10-10,000 mPa s viscosity at 23°C and a group represented by -COOR
1 (wherein, R
1 is a hydrogen atom, or a substituted or an un-substituted monovalent hydrocarbon group) or any functional groups of alkoxy groups, alkenoxy groups or acyloxy groups bound to silicon atom at the molecular chain terminal, and alkylene groups in a larger number than that of the terminal functional groups in the main chain, and (B) the heat conductive filler.
COPYRIGHT: (C)2010,JPO&INPIT

Abstract translation: 要解决的问题：提供一种能够高度填充导热填料并具有优异的操作效率的导热性油脂组合物。解决方案：导热润滑脂组合物包含（A）在23℃下具有10-10,000mPa·s粘度的油和由-COOR 1表示的基团（其中，R 1 或者在分子链末端与硅原子键合的烷氧基，链烯氧基或酰氧基的任何官能团，或更大的亚烷基数量大于主链末端官能团的数量，（B）导热填料。版权所有（C）2010，JPO＆INPIT

44.

发明专利
Repellent silicone rubber composition 有权
Title translation: 有机硅橡胶组合物

公开(公告)号：JP2009185142A

公开(公告)日：2009-08-20

申请号：JP2008025018

申请日：2008-02-05

Applicant: Momentive Performance Materials Inc , モメンティブ・パフォーマンス・マテリアルズ・ジャパン合同会社

Inventor： KOHAMA SATORU

IPC: C08L83/04 , A01N25/02 , A01N53/08 , A01P17/00 , C08K5/00

Abstract: PROBLEM TO BE SOLVED: To provide a silicone rubber composition having satisfactory pest repellency in itself to pests such as cockroaches.
SOLUTION: The repellent silicone rubber composition is obtained by blending and uniformly dispersing a polyorganosiloxane base polymer, a curing agent and, optionally, various additives to prepare an oxime type liquid silicone rubber composition, and blending this composition with acrinathrin which is a pyrethroidal compound as a pest repelling component in an amount of 0.01-10 pts.wt. based on 100 pts.wt. of the silicone rubber base polymer. The repellent silicone rubber composition maintains its pest repelling effect over a prolonged period of time and does not cause problems such as yellowing.
COPYRIGHT: (C)2009,JPO&INPIT

Abstract translation: 要解决的问题：提供具有令人满意的防虫性的硅橡胶组合物本身对诸如蟑螂的害虫。解决方案：斥水硅橡胶组合物通过将聚有机硅氧烷基聚合物，固化剂和任选的各种添加剂共混并均匀分散以制备肟型液体硅橡胶组合物，并将该组合物与作为拟除虫菊酯化合物作为驱虫成分的量为0.01-10重量份基于100重量的硅橡胶基础聚合物。驱避硅橡胶组合物在长时间内保持其驱虫效果，并且不会引起诸如变黄等问题。版权所有（C）2009，JPO＆INPIT

45.

发明专利
Conductive silicone rubber composition 有权
Title translation: 导电硅橡胶组合物

公开(公告)号：JP2009173922A

公开(公告)日：2009-08-06

申请号：JP2008333372

申请日：2008-12-26

Applicant: Momentive Performance Materials Inc , モメンティブ・パフォーマンス・マテリアルズ・ジャパン合同会社

Inventor： IIJIMA HIROYOSHI , OTASHIRO KOKI

IPC: C08L83/07 , C08K3/04 , C08K5/43 , F16C13/00

Abstract: PROBLEM TO BE SOLVED: To provide a conductive silicone rubber composition having small variation in volume resistivity even in a semiconductive region and also having small voltage dependency of volume resistivity.
SOLUTION: The conductive silicone rubber composition is prepared by adding (B) 1-150 pts.wt. of a conductive carbon black and (C) 0.05-1,000 ppm of a slightly water-soluble or water-insoluble ionic substance in which an anionic component is bis(trifluoromethanesulfonyl)imide to (A) 100 pts.wt. of heat-curable silicone rubber.
COPYRIGHT: (C)2009,JPO&INPIT

Abstract translation: 要解决的问题：即使在半导体区域中也提供体积电阻变化小的导电性硅橡胶组合物，并且还具有小体积电阻率的电压依赖性。导电硅橡胶组合物是通过加入（B）1-150重量份制备的。的导电炭黑和（C）0.05-1,000ppm的微水溶性或水不溶性离子物质，其中阴离子组分为双（三氟甲磺酰基）酰亚胺至（A）100重量份。的可热固化硅橡胶。版权所有（C）2009，JPO＆INPIT

46.

发明专利
Heating apparatus with enhanced thermal uniformity, and method for making thereof 审中-公开
Title translation: 具有增强热稳定性的加热装置及其制造方法

公开(公告)号：JP2008085283A

公开(公告)日：2008-04-10

申请号：JP2006323723

申请日：2006-11-30

Applicant: Momentive Performance Materials Inc , モーメンティブ・パフォーマンス・マテリアルズ・インク

Inventor： MARINER JOHN , SANE AJIT , EHATA TOSHIKI , SCHAEPKENS MARC , LIU XIANG , FAN WEI

IPC: H01L21/683 , C23C16/46 , H01L21/205

CPC classification number: H01L21/68757 , H01L21/67248

Abstract: PROBLEM TO BE SOLVED: To generally provide a heating apparatus for providing a relatively uniform temperature distribution to a substrate in a semiconductor-processing chamber or for heating a metal or ceramic mold for press forming glass lenses. SOLUTION: The heating apparatus for regulating/controlling the surface temperature of a substrate is provided. At least a pyrolytic graphite (TPG) layer is embedded in a heater to diffuse the temperature difference of various components in the heating apparatus and provides temporal and spatial control of the surface temperature of the substrate, for a relatively uniform substrate temperature with the difference between the maximum and minimum temperature points on the substrate of less than 10°C. COPYRIGHT: (C)2008,JPO&INPIT

Abstract translation: 要解决的问题：通常提供一种用于在半导体处理室中的基板提供相对均匀的温度分布或用于加热用于压制成型玻璃透镜的金属或陶瓷模具的加热装置。解决方案：提供用于调节/控制基板的表面温度的加热装置。至少热解石墨（TPG）层嵌入加热器中以扩散加热装置中的各种组分的温度差，并且对于相对均匀的衬底温度提供衬底的表面温度的时间和空间控制，基板上的最大和最小温度点小于10°C。版权所有（C）2008，JPO＆INPIT

47.

发明专利
Corrosion resistant wafer process device and manufacturing method therefor 审中-公开
Title translation: 耐腐蚀过程设备及其制造方法

公开(公告)号：JP2008016795A

公开(公告)日：2008-01-24

申请号：JP2006320939

申请日：2006-11-29

Applicant: Momentive Performance Materials Inc , モーメンティブ・パフォーマンス・マテリアルズ・インク

Inventor： OLECHNOWICZ BENJAMIN J , RUSINKO DAVID M , FAN WEI , SARIGIANNIS DEMETRIUS , SCHAEPKENS MARC , LONGWORTH DOUGLAS A , LOU VICTOR L , LIU XIANG , KLUG JENNIFER

IPC: H01L21/683 , C04B41/87 , H01L21/205

CPC classification number: H01L21/67103 , H01L21/6875 , H01L21/68785

Abstract: PROBLEM TO BE SOLVED: To provide a wafer process device, equipped with structure parts adaptive to the atmosphere containing corrosive gas that is used in a semiconductor process. SOLUTION: The wafer process device has an electrical junction part, a gas supply channel, a recess, a protruding part, a mesa (trapezoidal projection), through holes such as lift pin hole, threaded hole, and blind hole or the like, connected together for corrosion resistance, and has a special structure, of which the connection part uses a filler and a binder having superior chemical resistance. The thermal expansion coefficient of the junction part is an optimized one such as approximately agrees with that of base substrate, electrode, and coating layer. In one embodyment, the filler uses a composition containing a glass ceramic material. COPYRIGHT: (C)2008,JPO&INPIT

Abstract translation: 要解决的问题：提供一种装配有适于在半导体工艺中使用的含有腐蚀性气体的气氛的结构部件的晶片处理装置。解决方案：晶片处理装置具有电连接部分，气体供应通道，凹部，突出部分，台面（梯形突起），诸如提升销孔，螺纹孔和盲孔的通孔，或连接在一起，具有耐腐蚀性，并且具有特殊结构，其连接部分使用具有优异耐化学性的填料和粘合剂。接合部的热膨胀系数是与基底，电极和涂层大致一致的优化的热膨胀系数。在一个实施方案中，填料使用含有玻璃陶瓷材料的组合物。版权所有（C）2008，JPO＆INPIT