公开(公告)号：US20140191905A1

公开(公告)日：2014-07-10

申请号：US13996827

申请日：2012-03-26

Applicant: Telesphor Kamgaing

Inventor： Telesphor Kamgaing

IPC: H01Q1/22

CPC classification number: H01Q1/2283 ,  H01Q21/0025 ,  H01Q21/0087 ,  Y10T29/49016

Abstract: A high performance antenna incorporated on a microelectronic substrate by forming low-loss dielectric material structures in the microelectronic substrates and forming the antenna on the low-loss dielectric material structures. The low-loss dielectric material structures may be fabricated by forming a cavity in a build-up layer of the microelectronic substrate and filling the cavity with a low-loss dielectric material.

Abstract translation: 通过在微电子衬底中形成低损耗介电材料结构并在低损耗介电材料结构上形成天线，将高性能天线结合在微电子衬底上。 低损耗介电材料结构可以通过在微电子衬底的堆积层中形成空腔并用低损耗介电材料填充空腔来制造。

公开(公告)号：US20140176368A1

公开(公告)日：2014-06-26

申请号：US13721245

申请日：2012-12-20

Applicant: Telesphor Kamgaing ,  Valluri R. Rao ,  Ofir Degani

Inventor： Telesphor Kamgaing ,  Valluri R. Rao ,  Ofir Degani

IPC: H01Q1/38 ,  H01P11/00

CPC classification number: H01Q9/045 ,  H01L2224/16225 ,  H01L2924/15311 ,  H01P11/00 ,  H01Q1/2283 ,  H01Q1/38 ,  H01Q1/526 ,  H01Q21/0006 ,  Y10T29/49018

Abstract: Methods of forming a microelectronic packaging structure and associated structures formed thereby are described. Those methods and structures may include forming a package structure comprising a discrete antenna disposed on a back side of a device, wherein the discrete antenna comprises an antenna substrate, a through antenna substrate via vertically disposed through the antenna substrate. A through device substrate via that is vertically disposed within the device is coupled with the through antenna substrate via, and a package substrate is coupled with an active side of the device.

Abstract translation: 描述了形成微电子封装结构的方法及由此形成的相关结构。 这些方法和结构可以包括形成包括设置在设备的背侧的分立天线的封装结构，其中分立天线包括天线基板，通过天线基板垂直设置的通过天线基板。 垂直设置在器件内的穿通器件衬底通孔经由天线衬底与封装衬底耦合，并且封装衬底与器件的有源侧耦合。

公开(公告)号：US08582333B2

公开(公告)日：2013-11-12

申请号：US12165484

申请日：2008-06-30

Applicant: Bradley S. Oraw ,  Telesphor Kamgaing

Inventor： Bradley S. Oraw ,  Telesphor Kamgaing

IPC: G05F1/00 ,  H05K1/00 ,  H05K1/18 ,  H05K7/00 ,  H05K7/10 ,  H05K7/12 ,  H02M3/18 ,  H02M7/00 ,  H02M1/00

CPC classification number: H02M3/07 ,  H01L2224/16225 ,  H01L2924/13091 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/00

Abstract: Switched capacitor networks for power delivery to packaged integrated circuits. In certain embodiments, the switched capacitor network is employed in place of at least one stage of a cascaded buck converter for power delivery. In accordance with particular embodiments of the present invention, a two-stage power delivery network comprising both switched capacitor stage and a buck regulator stage deliver power to a microprocessor or other packaged integrated circuit (IC). In further embodiments, a switched capacitor stage is implemented with a series switch module comprising low voltage MOS transistors that is then integrated onto a package of at least one IC to be powered. In certain embodiments, a switched capacitor stage is implemented with capacitors formed on a motherboard, embedded into an IC package or integrated into a series switch module.

Abstract translation: 开关电容网络用于封装集成电路的电力输送。 在某些实施例中，采用开关电容器网络代替用于功率输送的级联降压转换器的至少一级。 根据本发明的特定实施例，包括开关电容器级和降压调节器级的两级电力输送网络向微处理器或其它封装集成电路（IC）递送电力。 在另外的实施例中，利用包括低压MOS晶体管的串联开关模块来实现开关电容器级，然后将其集成到待供电的至少一个IC的封装上。 在某些实施例中，开关电容器级由主板上形成的电容器实现，嵌入到IC封装中或集成到串联开关模块中。

公开(公告)号：US08558636B2

公开(公告)日：2013-10-15

申请号：US11694765

申请日：2007-03-30

Applicant: Jaemin Shin ,  Pascal A. Meier ,  Telesphor Kamgaing ,  Kemal Aygun

Inventor： Jaemin Shin ,  Pascal A. Meier ,  Telesphor Kamgaing ,  Kemal Aygun

IPC: H04B3/04 ,  H05K1/18 ,  H03G11/04

CPC classification number: H04B3/14 ,  H01L23/66 ,  H01L25/16 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/15311 ,  H01L2924/3011 ,  H01L2924/00

Abstract: A passive equalizer circuit is embedded within a substrate of a package containing an integrated circuit. It is believed that substantial reduction in uneven frequency dependent loss may be achieved for interconnects interconnecting the integrated circuit with other integrated circuits on a printed circuit board. Other aspects are described and claimed.

Abstract translation: 无源均衡器电路嵌入在包含集成电路的封装的衬底内。 据信，将集成电路与印刷电路板上的其他集成电路互连的互连可以实现不均匀的频率相关损耗的显着减少。 描述和要求保护其他方面。

公开(公告)号：US20120280366A1

公开(公告)日：2012-11-08

申请号：US13101874

申请日：2011-05-05

Applicant: Telesphor Kamgaing ,  Valluri R. Rao

Inventor： Telesphor Kamgaing ,  Valluri R. Rao

IPC: H01L23/552

CPC classification number: H01L23/552 ,  H01L23/481 ,  H01L23/66 ,  H01L25/18 ,  H01L2223/6616 ,  H01L2223/6677 ,  H01L2224/16225 ,  H01L2225/06513 ,  H01L2225/06537 ,  H01L2225/06541 ,  H01L2924/15311

Abstract: An apparatus includes a radio-frequency die with shielding through-silicon vias and a die backside lattice lid that shield a sector in the RF die from radio - and electromagnetic interference.

Abstract translation: 一种装置包括具有屏蔽通硅通孔的射频管芯和屏蔽RF管芯中的扇区的模具背面格栅盖与无线电和电磁干扰。

公开(公告)号：US20120092076A1

公开(公告)日：2012-04-19

申请号：US13316811

申请日：2011-12-12

Applicant: Telesphor Kamgaing ,  Emile Davies-Venn

Inventor： Telesphor Kamgaing ,  Emile Davies-Venn

IPC: H03F3/04

CPC classification number: H01P1/212 ,  H01L2224/05553 ,  H01L2224/0603 ,  H01L2224/48095 ,  H01L2224/48225 ,  H01L2224/48237 ,  H01L2224/49113 ,  H01L2924/181 ,  H01L2924/00012

Abstract: A microelectronic package having a radio frequency (RF) amplifier circuit and, incorporating harmonic rejection filters and matching circuits integrally formed in the package is disclosed. A harmonic rejection filter may comprise a metal-insulator-metal (MIM) capacitor serially coupled between bond pads disposed on a RF amplifier circuit die, a first wire bond coupling a first bond pad to a package output, where the first bond pad is coupled to the output of the RF amplifier, and a second wire bond coupling a second bond pad to a package ground. The harmonic rejection filter may be appropriately configured to filter one or more harmonics at different frequencies.

Abstract translation: 公开了一种具有射频（RF）放大器电路并且并入谐波抑制滤波器和整体形成在封装中的匹配电路的微电子封装。 谐波抑制滤波器可以包括串联连接在RF放大器电路管芯上的接合焊盘之间的金属 - 绝缘体 - 金属（MIM）电容器，将第一接合焊盘耦合到封装输出端的第一引线键合，其中第一接合焊盘耦合 到RF放大器的输出，以及将第二接合焊盘耦合到封装地的第二引线接合。 谐波抑制滤波器可以被适当地配置为滤波不同频率的一个或多个谐波。

公开(公告)号：US20110115597A1

公开(公告)日：2011-05-19

申请号：US12946577

申请日：2010-11-15

Applicant: Telesphor Kamgaing

Inventor： Telesphor Kamgaing

IPC: H01F5/00

CPC classification number: H01F17/0006 ,  H01F41/04 ,  H01F2027/2819 ,  H01F2038/143 ,  Y10T29/4902 ,  Y10T29/49069 ,  Y10T29/49073 ,  Y10T29/49075

Abstract: A planar transformer or balun device, having small trace spacing and high mutual coupling coefficient, and a method of fabricating the same is disclosed. The method may comprise providing a first and a second inductor on a primary and a second substrate respectively, interleaving at least partially the first inductor with the second inductor, coupling the primary and the secondary substrates to form a unitary structure, and providing electrical contacts to couple the first and second inductors with another device or circuit.

Abstract translation: 公开了具有小迹线间距和高互耦系数的平面变压器或平衡 - 不平衡变压器及其制造方法。 该方法可以包括分别在主基片和第二衬底上提供第一和第二电感器，至少部分地将第一电感器与第二电感器交错，将初级和次级衬底耦合以形成整体结构，并提供电触点 将第一和第二电感器与另一个器件或电路耦合。

公开(公告)号：US07841070B2

公开(公告)日：2010-11-30

申请号：US11842298

申请日：2007-08-21

Applicant: Telesphor Kamgaing

Inventor： Telesphor Kamgaing

IPC: H01F7/06

CPC classification number: H01F17/0006 ,  H01F41/04 ,  H01F2027/2819 ,  H01F2038/143 ,  Y10T29/4902 ,  Y10T29/49069 ,  Y10T29/49073 ,  Y10T29/49075

Abstract: A planar transformer or balun device, having small trace spacing and high mutual coupling coefficient, and a method of fabricating the same is disclosed. The method may comprise providing a first and a second inductor on a primary and a second substrate respectively, interleaving at least partially the first inductor with the second inductor, coupling the primary and the secondary substrates to form a unitary structure, and providing electrical contacts to couple the first and second inductors with another device or circuit.

Abstract translation: 公开了具有小迹线间距和高互耦系数的平面变压器或平衡 - 不平衡变压器及其制造方法。 该方法可以包括分别在主基片和第二衬底上提供第一和第二电感器，至少部分地将第一电感器与第二电感器交错，耦合初级和次级衬底以形成整体结构，并提供电触点 将第一和第二电感器与另一个器件或电路耦合。

公开(公告)号：US20090322414A1

公开(公告)日：2009-12-31

申请号：US12165484

申请日：2008-06-30

Applicant: Bradley S. Oraw ,  Telesphor Kamgaing

Inventor： Bradley S. Oraw ,  Telesphor Kamgaing

IPC: G05F3/02 ,  H02M3/07

CPC classification number: H02M3/07 ,  H01L2224/16225 ,  H01L2924/13091 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/00

Abstract: Switched capacitor networks for power delivery to packaged integrated circuits. In certain embodiments, the switched capacitor network is employed in place of at least one stage of a cascaded buck converter for power delivery. In accordance with particular embodiments of the present invention, a two-stage power delivery network comprising both switched capacitor stage and a buck regulator stage deliver power to a microprocessor or other packaged integrated circuit (IC). In further embodiments, a switched capacitor stage is implemented with a series switch module comprising low voltage MOS transistors that is then integrated onto a package of at least one IC to be powered. In certain embodiments, a switched capacitor stage is implemented with capacitors formed on a motherboard, embedded into an IC package or integrated into a series switch module.

Abstract translation: 开关电容网络用于封装集成电路的电力输送。 在某些实施例中，采用开关电容器网络代替用于功率输送的级联降压转换器的至少一级。 根据本发明的特定实施例，包括开关电容器级和降压调节器级的两级电力输送网络向微处理器或其它封装集成电路（IC）递送电力。 在另外的实施例中，利用包括低压MOS晶体管的串联开关模块来实现开关电容器级，然后将其集成到待供电的至少一个IC的封装上。 在某些实施例中，开关电容器级由主板上形成的电容器实现，嵌入到IC封装中或集成到串联开关模块中。

公开(公告)号：US20090051477A1

公开(公告)日：2009-02-26

申请号：US11842298

申请日：2007-08-21

Applicant: Telesphor Kamgaing

Inventor： Telesphor Kamgaing

IPC: H01F5/00

CPC classification number: H01F17/0006 ,  H01F41/04 ,  H01F2027/2819 ,  H01F2038/143 ,  Y10T29/4902 ,  Y10T29/49069 ,  Y10T29/49073 ,  Y10T29/49075

Abstract: A planar transformer or balun device, having small trace spacing and high mutual coupling coefficient, and a method of fabricating the same is disclosed. The method may comprise providing a first and a second inductor on a primary and a second substrate respectively, interleaving at least partially the first inductor with the second inductor, coupling the primary and the secondary substrates to form a unitary structure, and providing electrical contacts to couple the first and second inductors with another device or circuit.

Abstract translation: 公开了具有小迹线间距和高互耦系数的平面变压器或平衡 - 不平衡变压器及其制造方法。 该方法可以包括分别在主基片和第二衬底上提供第一和第二电感器，至少部分地将第一电感器与第二电感器交错，耦合初级和次级衬底以形成整体结构，并提供电触点 将第一和第二电感器与另一个器件或电路耦合。