公开(公告)号：KR1019900001410B1

公开(公告)日：1990-03-09

申请号：KR1019860002898

申请日：1986-04-15

Applicant: 한국전자통신연구원 ,  주식회사 케이티

Inventor： 김연곤 ,  오행석 ,  이종한

IPC: B27D3/00 ,  H05K3/46

Abstract: The method comprises a first process for drilling the piled board utilizing a drilling zig, a second process for dividing the piled board into individuals and printing circuit on inner layer, and for drilling a press hole by inputting the position data of film guide and a press hole to CNC drilling machine, and a third process for dividing the board from press fixture and for setting up a drilling guide hole.

Abstract translation: 该方法包括利用钻凿钻的堆垛板的第一工序，将堆垛板分为个人的印刷电路和内层的印刷电路的第二工序，以及通过输入胶片导向件和印刷机的位置数据来钻孔 孔到数控钻孔机，以及用于将板与冲压夹具分开并设置钻孔导向孔的第三工序。