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公开(公告)号：KR1020130015636A
公开(公告)日：2013-02-14
申请号：KR1020110077739
申请日：2011-08-04
Applicant: 한국전자통신연구원
CPC classification number: G01B9/0201 , G01B9/02067 , G01B9/0207 , G01B9/02095 , G01B11/2441 , G01H9/00
Abstract: PURPOSE: A closed type light phase extracting system with a phase correction function and a 3D image extracting method using the same are provided to minimize or correct phase errors generated in an optical fiber type interferometer caused by an environmental disturbance. CONSTITUTION: A closed type light phase extracting system with a phase correction function is as follows. The existence of phase errors caused by environmental changes of an optical fiber is checked by monitoring output signals obtained by interfering reflective light signals reflected through 2 paths. When the phase errors are generated, the errors are compensated by using a closed type phase correction control method through one path between the two paths. When the phase errors are compensated, images of an object are captured so that images are extracted.
Abstract translation: 目的：提供一种具有相位校正功能的闭合型光相提取系统和使用该相位校正功能的3D图像提取方法，以最小化或校正由环境干扰引起的光纤型干涉仪中产生的相位误差。 构成：具有相位校正功能的闭式轻相提取系统如下。 通过监视由通过2路径反射的反射光信号获得的输出信号来检查由光纤的环境变化引起的相位误差的存在。 当产生相位误差时，通过使用闭合型相位校正控制方法通过两条路径之间的一条路径来补偿误差。 当补偿相位误差时，捕获对象的图像，从而提取图像。
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公开(公告)号：KR1020120054252A
公开(公告)日：2012-05-30
申请号：KR1020100115537
申请日：2010-11-19
Applicant: 한국전자통신연구원
IPC: H01L21/20
CPC classification number: H01L21/185 , H01L21/324
Abstract: PURPOSE: A wafer bonding method is provided to improve quality of product by pressurizing two semiconductor substrates and forming a bonded substrate and transferring heat from the center of the bonded substrate to edge. CONSTITUTION: A first substrate(10) including a first side and a second side(10b) facing to the first side is provided. An insulating film is formed on the first side and the second side. The insulating film is an oxide film or a nitride film. A second substrate(20) including a third side and a fourth(20b) facing to the third side is provided. Bonding surface of two wafers are activated by using plasma. An initial bonding process is executed by perpendicularly pressurizing the bonding surface of the two wafers. The two wafers are bonded by selectively heating the center of the initially bonded wafers.
Abstract translation: 目的：提供晶片接合方法，通过对两个半导体衬底加压并形成接合衬底并将热量从接合衬底的中心传递到边缘来提高产品质量。 构成：提供包括面向第一侧的第一侧和第二侧（10b）的第一基板（10）。 绝缘膜形成在第一面和第二面上。 绝缘膜是氧化物膜或氮化物膜。 提供了包括面向第三侧的第三侧面和第四（20b）的第二基板（20）。 通过使用等离子体激活两个晶片的结合表面。 通过对两个晶片的粘合表面垂直加压来执行初始粘合工艺。 通过选择性地加热初始结合的晶片的中心来结合两个晶片。
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公开(公告)号：KR1020120024221A
公开(公告)日：2012-03-14
申请号：KR1020100087002
申请日：2010-09-06
Applicant: 한국전자통신연구원
Inventor： 임권섭
IPC: H04B10/50 , H04B10/2581
CPC classification number: G02B6/4204 , G02B6/4244 , G02B6/4263 , G02B6/4272 , G02B6/4281 , G02B6/4286
Abstract: PURPOSE: An optical transmission device which equips a cooler is provided to supply the characteristic of temperature control by including the cooler. CONSTITUTION: A platform includes a transfer line(207). The transfer line is patterned in order for the transfer line to have 90 degrees of inclined angle. A light source(201) is connected to the transfer line of a platform. The light source is mounted on the platform. A cooler(205) maintains the temperature of the light source. A TO(Transistor outline) stem package includes a lead line(302). The lead line is connected with the transfer line through a bonding wire(400).
Abstract translation: 目的：提供装备冷却器的光传输装置，通过包括冷却器来提供温度控制的特性。 规定：平台包括一条转运线（207）。 传送线被图案化，以便传输线具有90度的倾斜角度。 光源（201）连接到平台的传送线。 光源安装在平台上。 冷却器（205）保持光源的温度。 A TO（晶体管轮廓）杆组件包括引线（302）。 引线通过接合线（400）与输送线连接。
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公开(公告)号：KR101041570B1
公开(公告)日：2011-06-15
申请号：KR1020090078261
申请日：2009-08-24
Applicant: 한국전자통신연구원
IPC: H04B10/2581 , H04B10/00
CPC classification number: G02B6/4246 , H04B10/40
Abstract: 하나의 광섬유를 이용해서 양방향 통신 또는 다중화 통신이 가능한 광통신 모듈을 개시한다. 플랫폼에는 상하로 관통하는 관통 홀이 형성된다. 광수신부는 플랫폼에 실장되는 것으로, 수광소자를 구비한다. 광송신부는 플랫폼에 실장되는 것으로, 발광소자를 구비한다. 광필터부는 플랫폼의 한 면에 관통 홀에 대응되게 실장되는 것으로, 발광소자로부터 출력된 출력광을 광선로로 전달하며, 광선로를 통해 입력된 입력광을 수광소자로 전달한다. 수광소자와 발광소자 중 어느 하나는 플랫폼의 한 면에 광필터부를 사이에 두고 광선로의 반대쪽에 실장되며, 다른 하나는 플랫폼의 다른 면에 관통 홀과 대응되게 실장된다. 이에 따라, 모듈화 비용을 줄이고 광학적 또는 전기적 누화를 최소화할 수 있으며, 광 결합효율을 극대화할 수 있다.
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Patent Agency Ranking
公开(公告)号：KR1020100022690A
公开(公告)日：2010-03-03
申请号：KR1020080081330
申请日：2008-08-20
Applicant: 한국전자통신연구원
IPC: H01L23/12
CPC classification number: H01L21/76898 , H01L23/481 , H01L25/50 , H01L2223/6616 , H01L2224/05001 , H01L2224/05009 , H01L2224/05568 , H01L2224/0557 , H01L2224/056 , H01L2224/16 , H01L2225/06513 , H01L2225/06541 , H01L2924/00014 , H01L2924/09701 , H01L2924/3011 , H01L2224/05099
Abstract: PURPOSE: A manufacturing method of a stacked semiconductor package with an improved through via forming technology are provided to minimize electric leakage between a transmission line and a via hole. CONSTITUTION: A seed layer(2) is formed on the bottom of a wafer(1). The seed layer is formed in order to form a via-core. The wafer comprises at least one via hole(5). The via hole passes through the wafer up and down. The via-core(10) is formed within the via hole. The via hole and via-core are insulated with each other. The seed layer is removed.
Abstract translation: 目的：提供一种具有改进的通孔形成技术的堆叠半导体封装的制造方法，以使传输线和通孔之间的漏电最小化。 构成：在晶片（1）的底部形成种子层（2）。 形成种子层以形成通孔。 晶片包括至少一个通孔（5）。 通孔上下穿过晶片。 通孔（10）形成在通孔内。 通孔和通孔相互绝缘。 种子层被去除。
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公开(公告)号：KR1020090058948A
公开(公告)日：2009-06-10
申请号：KR1020070125763
申请日：2007-12-05
Applicant: 한국전자통신연구원
IPC: H04B10/2581 , H04B10/00 , H04J14/00
CPC classification number: H04J14/0226 , H04B10/25751 , H04J14/0232 , H04J14/0247 , H04J14/0252 , H04J14/0282
Abstract: An optical diplexer module using a mixed-signal multiplexer and a method using the same are provided to realize an optical diplexer module which enables an MPS(Multiple-Play Service) and a TPS(Triple-play service) by using only two optical wavelength for an uplink and downlink signals. A multiplexing unit(210) multiplexes a wideband digital signal and an analog signal, and then outputs those signals in one multiplexing signal. A multiplexer(213) mixes an output signal of each mixer with a baseband signal and outputs the mixed signal as a multiplexing signal. An optical converter outputs converts the multiplexing signal into an optical signal and outputs the optical signal. A photoelectric converter(240) converts the optical signal received from the outside into an electric signal. An amplifier(250) performs an amplification function that amplifies the output signal of the photoelectric converter.
Abstract translation: 提供一种使用混合信号多路复用器的光双工器模块及其使用方法，以实现通过仅使用两个光波长来实现MPS（多播服务）和TPS（三重播放业务）的光双工器模块 上行链路和下行链路信号。 多路复用单元（210）对宽带数字信号和模拟信号进行复用，然后在一个复用信号中输出这些信号。 多路复用器（213）将每个混频器的输出信号与基带信号进行混频，并输出混合信号作为复用信号。 光转换器输出将复用信号转换为光信号并输出光信号。 光电转换器（240）将从外部接收的光信号转换为电信号。 放大器（250）执行放大光电转换器的输出信号的放大功能。
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公开(公告)号：KR101835456B1
公开(公告)日：2018-03-09
申请号：KR1020100116815
申请日：2010-11-23
Applicant: 한국전자통신연구원
Abstract: 본발명의일 실시예에따른광섬유어레이블럭의제조방법은, 실리콘기판상에피식각될영역을노출시키는식각마스크패턴을형성하는단계; 노출된상기실리콘기판을건식식각하여트렌치를형성하는단계; 상기트렌치의바닥면에노출된상기실리콘기판을습식식각으로이방성식각하여복수개의브이홈(V-groove)들을형성하는단계; 상기브이홈들에광섬유들을안착시키는단계; 및상기안착된광섬유들에 UV 경화용에폭시를도포하고덮개판을올린후 UV를조사하여상기광섬유들을고정시키는단계를포함한다.
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