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    ILLUMINATION DEVICES AND METHODS FOR MAKING THE SAME
    41.
    发明申请
    ILLUMINATION DEVICES AND METHODS FOR MAKING THE SAME 审中-公开
    照明装置及其制造方法

    公开(公告)号：WO2008033720A1

    公开(公告)日：2008-03-20

    申请号：PCT/US2007/077844

    申请日：2007-09-07

    Applicant: 3M INNOVATIVE PROPERTIES COMPANY

    Inventor： AELING, Ellen O. ,  DAVID, John R. ,  MEIS, Michael A. ,  STEELMAN, Ronald S.

    IPC: G02B6/12 ,  G02B6/42

    CPC classification number: F21V19/0015 ,  F21K9/00 ,  F21K9/60 ,  F21K9/68 ,  F21K9/90 ,  F21V19/0025 ,  F21Y2115/10 ,  H01L33/60 ,  H05K1/0287 ,  H05K1/11 ,  H05K1/189 ,  H05K3/222 ,  H05K3/4611 ,  H05K2201/09681 ,  H05K2201/10106 ,  H05K2201/10363 ,  H05K2203/063 ,  Y10T156/10

    Abstract: The present disclosure is generally directed to illumination devices, and methods for making the same. The device, in particular, includes a first conductor layer, a first insulator layer disposed on the first conductor layer and having at least one first aperture defined therein through the first insulator layer, a second conductor layer disposed on the first insulator layer and having at least one second aperture defined therein through the second conductor layer and positioned to align with the at least one first aperture, and a light manipulation layer disposed on the second conductor layer and having at least one pair of apertures defined therein through the light manipulation layer including a third aperture and a fourth aperture, where the third aperture is positioned to align with the at least one second and first apertures.

    Abstract translation: 本公开一般涉及照明装置及其制造方法。 该器件特别地包括第一导体层，第一绝缘体层，设置在第一导体层上并且具有通过第一绝缘体层限定在其中的至少一个第一孔;第二导体层，设置在第一绝缘体层上并具有 通过所述第二导体层限定的至少一个第二孔，并且定位成与所述至少一个第一孔对准，以及光操纵层，其设置在所述第二导体层上并且具有通过所述光操纵层限定在其中的至少一对孔，包括 第三孔和第四孔，其中所述第三孔被定位成与所述至少一个第二孔和第一孔对准。

    BACKLIGHT ASYMMETRIC LIGHT INPUT WEDGE
    42.
    发明申请
    BACKLIGHT ASYMMETRIC LIGHT INPUT WEDGE 审中-公开
    背光不对称光输入楔

    公开(公告)号：WO2007140092A1

    公开(公告)日：2007-12-06

    申请号：PCT/US2007/068530

    申请日：2007-05-09

    Applicant: 3M INNOVATIVE PROPERTIES COMPANY

    Inventor： BRYAN, William J. ,  SCHULTZ, John C. ,  MEIS, Michael A. ,  DESTAIN, Patrick R.

    IPC: G02F1/13357

    CPC classification number: G02B6/0046 ,  G02B6/0028 ,  G02B6/0031 ,  G02B6/0043 ,  G02B6/0055

    Abstract: A backlight is disclosed and includes a visible light transmissive body primarily propagating light by TIR with a light input surface and a light output surface and a light guide portion and a light input portion. The light guide portion has a light reflection surface and a light emission surface. The light input portion has opposing side surfaces that are not parallel. One of the opposing surfaces is co-planar with either the light emission surface or the light reflection surface. A light source is disposed adjacent to the light input surface. The light source emits light into the light input portion. A reflective layer is disposed adjacent to or on the opposing side surfaces.

    Abstract translation: 公开了一种背光，包括主要通过TIR传输光的可见光透射体，其具有光输入表面和光输出表面以及导光部分和光输入部分。 导光部具有光反射面和发光面。 光输入部分具有不平行的相对的侧表面。 相对表面中的一个与发光表面或光反射表面共面。 光源邻近光输入表面设置。 光源将光发射到光输入部分。 反射层邻近或相对的侧表面设置。

    MULTI-LAYER OPTICAL CIRCUIT AND METHOD FOR MAKING
    43.
    发明申请
    MULTI-LAYER OPTICAL CIRCUIT AND METHOD FOR MAKING 审中-公开
    多层光电路和制造方法

    公开(公告)号：WO2005040881A1

    公开(公告)日：2005-05-06

    申请号：PCT/US2004/027690

    申请日：2004-08-26

    Applicant: 3M INNOVATIVE PROPERTIES COMPANY

    Inventor： MEIS, Michael A. ,  LEE, Nicholas A. ,  HENSON, Gordon D. ,  CARLSON, Luke

    IPC: G02B6/43

    CPC classification number: G02B6/3608 ,  G02B6/3612 ,  G02B6/3885 ,  G02B6/424 ,  G02B6/43

    Abstract: A multi-layer optical circuit (18/18'/18") has a plurality of optical circuit layers (24, 28). Each optical circuit layer is positioned on a corresponding one of a plurality of substrates (26, 30). An optical fiber (22) extends between at least two of the optical circuit layers (24, 28) and forms a portion of the at least two optical circuit layers.

    Abstract translation: 多层光电路（18/18'/ 18“）具有多个光电路层（24,28），每个光电路层位于多个基板（26,30）的对应的一个基板 光纤（22）在至少两个光电路层（24,28）之间延伸并形成至少两个光电路层的一部分。

    LIGHTGUIDE HAVING A VISCOELASTIC LAYER FOR MANAGING LIGHT
    45.
    发明公开
    LIGHTGUIDE HAVING A VISCOELASTIC LAYER FOR MANAGING LIGHT 审中-公开
    LICHTLEITER MIT VISKOELASTISCHER SCHICHT ZUR HANDHABUNG VON LICHT

    公开(公告)号：EP3026471A1

    公开(公告)日：2016-06-01

    申请号：EP15175481.9

    申请日：2009-07-30

    Applicant: 3M Innovative Properties Company

    Inventor： SHERMAN, Audrey A. ,  MEIS, Michael A. ,  BOULOS, Marie A. ,  SCHAFFER, Kevin R. ,  WINKLER, Wendi J.

    IPC: G02B6/00 ,  F21V8/00 ,  G02B27/00

    CPC classification number: G02B6/005 ,  G02B6/0038 ,  G02B6/0053 ,  G02B6/0095

    Abstract: The present invention relates to an optical device including a light source and an optical article. The optical article includes a lightguide and a viscoelastic layer disposed on the lightguide. Light emitted by the light source enters the lightguide and is transported within the lightguide by total internal reflection. The viscoelastic layer manages light, for example, at least about 50 %, or less than about 10 %, of light that enters the lightguide may be extracted. The optical device can be used in a variety of constructions for signs, markings, display devices, keypad assemblies, tail light assemblies and illumination devices.

    Abstract translation: 本发明涉及一种包括光源和光学制品的光学装置。 光学制品包括设置在光导上的光导和粘弹性层。 由光源发出的光线进入光导，并通过全内反射在光导内传输。 粘弹性层管理光，例如可以提取进入光导的光的至少约50％或小于约10％。 光学装置可以用于各种用于符号，标记，显示装置，键盘组件，尾灯组件和照明装置的结构。

    LED MOUNTING STRUCTURES
    48.
    发明公开
    LED MOUNTING STRUCTURES 审中-公开
    MONTAGESTRUKTURENFÜRLED

    公开(公告)号：EP2002489A2

    公开(公告)日：2008-12-17

    申请号：EP07811834.6

    申请日：2007-03-29

    Applicant: 3M Innovative Properties Company

    Inventor： MEIS, Michael A. ,  AELING, Ellen, O. ,  DAVID, John, R.

    IPC: H01L33/00

    CPC classification number: H01L33/483 ,  F21V19/0025 ,  F21Y2115/10 ,  H01L33/642 ,  H01L33/648 ,  H05K1/183 ,  H05K1/184 ,  H05K3/107 ,  H05K2201/09036 ,  H05K2201/09981 ,  H05K2201/10106 ,  H05K2201/1059

    Abstract: An LED assembly may include a substrate, an elongate mounting structure that is formed in or on the substrate, and an LED that is mechanically secured to the elongate mounting structure. A light producing apparatus may include a substrate, an elongate mounting structure that may be formed in or on the substrate, and a plurality of LEDs that may be removably secured to the elongate mounting structure. A light producing array may include a substrate, a first elongate mounting structure that is formed in or on the substrate, and a second elongate mounting structure that is formed in or on the substrate. A first plurality of LEDs may be removably secured to the first elongate mounting structure. A second plurality of LEDs may be removably secured to the second elongate mounting structure.

    Abstract translation: LED组件可以包括衬底，形成在衬底中或衬底上的细长安装结构，以及机械地固定到细长安装结构的LED。 发光装置可以包括基板，可以形成在基板中或基板上的细长安装结构，以及可拆卸地固定到细长安装结构的多个LED。 发光阵列可以包括衬底，形成在衬底中或衬底上的第一细长安装结构，以及形成在衬底中或衬底上的第二细长安装结构。 第一多个LED可以可拆卸地固定到第一细长安装结构。 第二多个LED可以可拆卸地固定到第二细长安装结构。

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